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Thursday 15 January 2026
Foxconn-HCL semiconductor joint venture to be named India Chip Private Limited
Electronics manufacturing services major Foxconn and India's HCL Group have formally named their semiconductor joint venture India Chip Private Limited, according to a regulatory filing...
Thursday 15 January 2026
Exclusive: T-Glass shortage ripples through memory and advanced packaging markets

The global memory industry is confronting a growing capacity crunch, one that is increasingly rippling upstream to a shortage of glass...

Thursday 15 January 2026
Trump invokes Section 232 to levy 25% tariff on Nvidia H200, AMD MI325X chips
On January 14, US President Donald Trump signed a proclamation invoking Section 232 of the Trade Expansion Act of 1962 to impose an immediate 25% tariff on a narrow category of advanced...
Thursday 15 January 2026
Rising memory prices lift Taiwan supply chain earnings

The global memory industry entered a clear upturn in the second half of 2025 as both spot and contract prices rose sharply, lifting earnings...

Thursday 15 January 2026
Rapidus forecasts 2nm supply shortfall by 2030, flags talent gap versus TSMC

As global governments accelerate investments in the semiconductor sector, Japan's Rapidus is moving forward with its goal of mass-producing 2nm...

Thursday 15 January 2026
Japan fortifies rare-earth supply chain against China risk
China has tightened export controls on rare earths and other dual-use materials bound for Japan, prompting Tokyo to formalise a rare-earth stockpiling policy and work with G7 partners...
Thursday 15 January 2026
Taiwan's Holtek sees surge in MCU sales, launches compact energy and fire-safety units
After navigating a turbulent year of US-China tariffs, Taiwanese microcontroller (MCU) maker Holtek Corp. closed 2025 with a full-year revenue of NT$3.058 billion (US$96 million),...
Thursday 15 January 2026
China's WUS to build US$300m optical-electrical PCB hub for AI systems
WUS Printed Circuit (Kunshan) Co. plans to invest up to US$300 million in a high-density optical-electrical printed circuit board (PCB) project aimed at supporting next-generation...
Thursday 15 January 2026
GlobalWafers' Topsil advances ultra-pure float zone silicon for quantum tech
GlobalWafers stated it is continuing to expand the application landscape of its advanced materials technologies, with its Danish subsidiary Topsil GlobalWafers ramping up investment...
Thursday 15 January 2026
GlobalFoundries moves into processor IP with ARC acquisition from Synopsys

GlobalFoundries said on January 13 that it has agreed to acquire the ARC Processor IP Solutions business from Synopsys, a move that modestly...

Wednesday 14 January 2026
Advanced packaging crunch lifts ASE, KYEC to new highs
TSMC will hold its earnings call on January 15, 2026. Supply chain sources expect AI chip demand to remain strong in 2026, while TSMC's advanced packaging and testing capacity continues...
Wednesday 14 January 2026
China lifts semiconductor equipment localization to 35%
China's push to localize its semiconductor equipment supply chain has reached an unexpected milestone. Domestic tools accounted for 35% of chipmaking equipment used in 2025, up from...
Wednesday 14 January 2026
SK Hynix to invest in new advanced packaging plant amid AI memory demand
SK Hynix has announced plans to invest KRW19 trillion (US$13.02 billion) to construct a new advanced packaging facility, P&T7, in Cheongju, North Chungcheong Province, South Korea...
Wednesday 14 January 2026
Gold Circuit Electronics sees record revenue on ASIC server orders, plans Taiwan expansion
PCB manufacturer Gold Circuit Electronics (GCE) posted a record-high full-year consolidated revenue in 2025, surging more than 50% year-over-year, driven by a ramp-up in ASIC server...
Wednesday 14 January 2026
Samsung will adopt South Korea-made mask blanks to EUV process to reduce reliance on Japan
Samsung Electronics is set to introduce South Korea-made mask blanks into its extreme ultraviolet (EUV) process starting as early as the second quarter of 2026. According to ET...