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Saturday 5 September 2026
Semicon Taiwan 2026: A windmill in the die bonder, and a Dutch bet on photonics
Dutch equipment maker ITEC used Semicon Taiwan to promote a die-bonding architecture that it says triples throughput over earlier versions of the design by removing the largest source...
Saturday 5 September 2026
Taiwan semiconductor output targets NT$8 trillion
As Semicon Taiwan kicked off at the Taipei Nangang Exhibition Center, the Ministry of Economic Affairs (MOEA) announced that, based on forecasts compiled from multiple research institutions,...
Saturday 5 September 2026
Topco targets optical comms, cooling as copper gives way
System integration remains a key hurdle as the AI chip industry pushes for higher power efficiency and faster transmission speeds, drawing intense attention to when short-reach optical...
Saturday 5 September 2026
TSMC's 3D packaging roadmap: engineering AI chips to think like the human brain
TSMC is steering the future of artificial intelligence toward high-density three-dimensional advanced packaging designed to mimic the architectural connectivity of the human brain,...
Saturday 5 September 2026
Micron looks to lock in Taiwanese construction capacity with long-term deals
The global rush to build semiconductor fabs is creating a historic opportunity for Taiwan's construction and facility engineering supply chain, and Micron Technology is looking to...
Saturday 5 September 2026
Commentary: China builds three-pronged memory strategy around CXMT, YMTC, XMC
China's memory industry is shifting from a single-champion model towards a three-pronged structure. ChangXin Memory Technologies (CXMT) is building its position in DRAM, Yangtze Memory...
Saturday 5 September 2026
Marketech profits hit record in 1H26 on overseas orders
Marketech International Corp. (MIC) posted record results in the second quarter of 2026, with consolidated revenue of NT$21.2 billion (approx. US$668.6 million), up 48.2% quarter-over-quarter...
Friday 4 September 2026
CPO testing shifts to mid-stage to avoid costly failures, Chroma says

Co-packaged optics (CPO) is forcing chipmakers and equipment suppliers to rethink where testing should take place, as long optical test...

Friday 4 September 2026
TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex
TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...
Friday 4 September 2026
From chips to physical AI: Experts urge Taiwan-US push for trusted drone supply chains at Semicon Taiwan 2026
Trustworthy supply chain concerns are extending beyond semiconductors to drones and other autonomous systems, now emerging as national strategic industries. At a Semicon Taiwan 2026...
Friday 4 September 2026
The 'Copper Wall': inside the physical bottlenecks threatening to melt AI supercomputing boom
A decade ago, when Nvidia CEO Jensen Huang was developing the world's first NVLink-enabled deep learning system, the DGX-1, the tech industry was deeply skeptical about the future...
Friday 4 September 2026
How agentic AI and 'AI physics' are reshaping chip design
As semiconductor designs advance toward trillion-transistor packages, the traditional engineering playbook of simply adding more personnel or running legacy software faster has hit...
Friday 4 September 2026
South Korea taps chip windfall for next tech push
South Korea is turning a semiconductor-driven tax windfall into a broader technology investment push, directing record fiscal firepower toward chips, Nvidia's Vera Rubin computing...
Friday 4 September 2026
Samsung turns to chips, OLED for next phase of Vietnam expansion
Samsung is expanding its Vietnam footprint beyond smartphones, with semiconductor testing, high-end chip substrates, OLED displays and R&D emerging as the next pillars of its presence...
Friday 4 September 2026
MSScorps August revenue hits new high on silicon photonics gains
MSScorps saw August 2026 revenue post a new single-month high, as global artificial intelligence (AI) computing power continues to expand, driving demand for advanced process technologies,...