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    NEWS TAGGED CHIPS + COMPONENTS
    Monday 6 July 2026
    Analysis: AI supercycle could drive semiconductor market beyond US$2 trillion by 2030
    The global semiconductor market is entering a historically significant growth phase. According to WSTS's latest June forecast, global semiconductor revenue is projected to grow by...
    Monday 6 July 2026
    Asahi Kasei to expand Taiwan photoresist film capacity for AI chip packaging
    Asahi Kasei, one of the notable suppliers of Sunfort dry film photoresist in Japan, has initiated a fab expansion project in Taiwan. The newly established plant is expected to further...
    Monday 6 July 2026
    Samsung Electro-Mechanics, Sumitomo Chemical to form glass-core venture for chip substrates

    Samsung Electro-Mechanics signed a final agreement on July 2 with Sumitomo Chemical's Korean subsidiary Dongwoo Fine-Chem to form a...

    Monday 6 July 2026
    India roundup: India accelerates semiconductor ambitions through policy and global partnerships
    India accelerated its semiconductor ambitions through deeper Japan cooperation, policy advances, new manufacturing partnerships, and local technology investments, reinforcing efforts...
    Monday 6 July 2026
    Analysis: Taiwan's semiconductor sector enters 2026 helium crunch, with nearly 90% dependent on Qatar
    Taiwan's chipmakers walked into the 2026 helium supply shock more exposed to Qatar than any other major buyer, sourcing nearly 88% of their rare-gas imports from the Gulf state in...
    Monday 6 July 2026
    ESMT revenue hits record high as DDR2 and DDR3 prices keep climbing
    Elite Semiconductor Microelectronics Technology (ESMT), a memory IC design house, posted record monthly consolidated revenue of NT$4.85 billion (approx. US$152 million) in June 2026,...
    Sunday 5 July 2026
    Applied Materials unveils integrated tools for HBM, chiplet, and 3D packaging scale-up
    Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM,...
    Sunday 5 July 2026
    Component inflation weighs on manufacturing momentum as Taiwan PMI growth moderates
    Surging demand for high-bandwidth memory (HBM) used in AI servers has driven shortages and sharp price increases for conventional memory, while microcontroller (MCU) suppliers have...
    Sunday 5 July 2026
    AI, HPC test interface demand drives CHPT June revenue to new monthly high

    Test interface supplier Chunghwa Precision Test Tech. Co., Ltd. (CHPT) reported its June 2026 revenue, marking its sixth consecutive...

    Sunday 5 July 2026
    Advantest and OpenLight join forces on silicon photonics test platform for mass production
    Advantest said it has partnered with OpenLight to develop a scalable silicon photonics (SiPh) test solution for mass production environments. The announcement comes as artificial intelligence...
    Saturday 4 July 2026
    Infineon wins fourth German patent ruling against Innoscience, as GaN fight flares in Shanghai
    Germany's District Court Munich I ruled on July 3 that Innoscience infringed Infineon Technologies' gallium nitride (GaN) patents, barring the Chinese chipmaker from importing, selling,...
    Saturday 4 July 2026
    Machvision's June revenue hits another record due to AI demand
    Machvision posted another record monthly revenue in June 2026, as surging demand for AI servers, high-performance computing (HPC), and advanced packaging continued to lift orders for...
    Saturday 4 July 2026
    TSMC's median pay trails four smaller IC design houses, filings show

    Fabless chip designers dominate the upper ranks of Taiwan's newly disclosed non-managerial employee pay data for fiscal year 2025,...

    Saturday 4 July 2026
    China's CR Micro raises power chip prices as Chinese suppliers push fresh hikes

    China Resources Microelectronics (CR Micro), a Chinese power semiconductor integrated device manufacturer, has notified customers and...

    Saturday 4 July 2026
    Samsung and SK Hynix seek substrate price cuts for the second half of 2026
    Samsung Electronics and SK Hynix are reportedly pressing South Korean semiconductor substrate suppliers to lower prices for the second half of 2026, even as memory demand remains in...
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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