News tagged Chips + components at DIGITIMES

NEWS TAGGED CHIPS + COMPONENTS

Friday 27 March 2026

SK Hynix targets KRW100 trillion net cash as AI demand surges, eyes US listing

SK Hynix plans to build more than KRW100 trillion (approx. US$66 billion) in net cash to support long-term investment in artificial intelligence...

Friday 27 March 2026

US advances chip tracking mandate after US$2.5B smuggling case exposes export gaps

In a rare show of bipartisan unity, a key US congressional committee voted 42-0 on Thursday to advance the Chip Security Act (CSA). The...

Friday 27 March 2026

Adata secures NT$12B syndicated loan to drive expansion, debuts Trusta for edge AI infrastructure

Taiwan's memory module giant Adata Technology has secured a NT$12 billion (US$375 million) syndicated loan led by Bank of Taiwan, strengthening its mid-term working capital while advancing...

Friday 27 March 2026

Eikei targets automotive and AI markets, establishes Slovakia subsidiary

Automotive printed circuit board (PCB) manufacturer Eikei Group announced plans to establish a subsidiary in Slovakia, aiming to diversify geopolitical risks across its three major...

Friday 27 March 2026

Air Liquide launches first advanced materials plant in Taiwan for sub-3nm chips

Paris-headquartered Air Liquide has inaugurated a new advanced materials plant in Taichung, marking its first large-scale production base in Taiwan for deposition and etching materials...

Friday 27 March 2026

Semicon China 2026: AI drives semiconductor market to US$1.8 trillion by 2030, China leads capacity and equipment

AI computing is pushing the semiconductor industry into a structural growth phase, reshaping global capacity and technology pathways, according to Lily Feng, President of SEMI China,...

Friday 27 March 2026

SK Hynix keeps HBM shipments steady, targets HBM4E sample this year

SK Hynix expects stable growth in its high-bandwidth memory (HBM) business this year and plans to keep shipments in line with initial...

Friday 27 March 2026

DRAM and NAND costs hit 90% of smartphone prices, squeezing low-end profits

Core component costs for smartphones are surging at unprecedented rates, threatening the survival of low-priced models in the market. Nikkei reports that prices for two essential...

Friday 27 March 2026

TSMC prioritises AI, core clients; 3nm capacity remains constrained

Cloud AI demand is tightening advanced-node supply, with TSMC's 3nm capacity emerging as the most constrained segment at the end of the first quarter of 2026, according to IC design...

Friday 27 March 2026

Samsung and SK Hynix expand microscope procurement to boost HBM yield

As AI compute demand surges, the rising need for high-bandwidth memory (HBM) testing and failure analysis is reshaping semiconductor inspection equipment markets, affecting chipmakers,...

Friday 27 March 2026

Semicon China 2026: AI efficiency fuels demand growth under Jevons paradox, AMD warns

At SEMICON China 2026, AMD VP and Head of Corporate Strategy and Partnerships Mario Morales delivered a stark warning: while the AI market is rapidly expanding toward a projected US$1.7...

Friday 27 March 2026

Micron inaugurates Tongluo site, targets fiscal 2028 DRAM, HBM output

Micron Technology, on March 26, held an inauguration ceremony for its Tongluo site in Miaoli County, marking a milestone following the...

Friday 27 March 2026

UPS and Applied Materials boost Taiwan semiconductor logistics with new Taoyuan hub

Targeting the growing needs of Taiwan's high-tech and semiconductor sectors, UPS has officially launched its Taoyuan International Logistics Center (TILC) with a total investment nearing...

Friday 27 March 2026

Nvidia says quantum computing will not replace GPUs

Nvidia said quantum computing will complement rather than replace GPUs, even as Taiwan accelerates investment in quantum technology. Speaking at an industry event, the company said...

Thursday 26 March 2026

Innos set for late April listing on TPEx, riding advanced packaging boom

Probe card automation equipment maker Innostar Service (Innos) is expected to list on the Taipei Exchange (TPEx) main board in late April 2026. With artificial intelligence (AI) applications...

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Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook