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    NEWS TAGGED CHIPS + COMPONENTS
    Friday 4 September 2026
    K&S targets CPO, CoPoS growth with expanded TCB advanced packaging roadmap
    Singapore-based semiconductor packaging equipment maker Kulicke and Soffa (K&S) said AI demand is spreading into adjacent applications, lifting 2026 orders for wire bonding equipment...
    Friday 4 September 2026
    China interconnect chipmaker Montage enters Samsung, SK Hynix CXL 3.2 supply chains and begins DDR6 development

    Montage Technology is accelerating its move beyond traditional DDR memory interfaces, with CXL 3.2, DDR6 and PCIe products positioning the...

    Friday 4 September 2026
    Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
    Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4...
    Friday 4 September 2026
    CPO high-density optical interconnects drive E&R's submicron 2D FAU breakthrough
    To meet next-generation high-speed optical interconnect demand, fiber array units (FAU) are moving from traditional one-dimensional layouts to high-density two-dimensional (2D) architectures,...
    Friday 4 September 2026
    Kyocera completes Nagasaki plant for semiconductor ceramics and packages
    Kyocera held a ceremony on September 1 to mark the completion of its Nagasaki Isahaya Plant in Kuremo-machi, Isahaya, Nagasaki. The company says the new manufacturing site will anchor...
    Friday 4 September 2026
    Fujitsu says useful quantum computers may need far fewer qubits than expected
    For years the quantum industry has worked on a discouraging assumption: that a machine capable of doing anything commercially useful would need a million qubits or more. Fujitsu told...
    Friday 4 September 2026
    China's EUV gap may stretch 10–15 years, but DUV gains test Western export controls
    China may remain 10–15 years away from developing domestic extreme ultraviolet (EUV) lithography, according to assessments from UBS and Zeiss, highlighting the technological...
    Friday 4 September 2026
    Taiwan automation specialist Kenmec targets semiconductor packaging plants with low-clearance OHT, AI digital twins
    Rising semiconductor packaging and testing demand is exposing space and logistics constraints at existing plants. Kenmec Mechanical Engineering is targeting the upgrade market with...
    Friday 4 September 2026
    Taisic unveils p-type SiC substrate for ultra-high-voltage grid, rail applications
    Taisic Materials, a compound semiconductor company under the Kenmec Group, unveiled a p-type silicon carbide (SiC) substrate on September 2, targeting ultra-high-voltage power applications,...
    Friday 4 September 2026
    Processor, memory boom could push chip supply chain out of sync, says Yole
    Gary Huang, vice president and head of Asia-Pacific research and business development at Yole Group, said the imbalance is already showing signs of what he described as supply-chain...
    Friday 4 September 2026
    AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground

    The global DRAM market continued its explosive expansion in the second quarter of 2026, as AI infrastructure spending drove demand for...

    Friday 4 September 2026
    Silicon Valley overflow fuels semiconductor boom in California's Capital Region
    A surge of multibillion-dollar industrial expansions is quietly transforming California's capital region into a premier domestic semiconductor and advanced technology powerhouse, positioning...
    Friday 4 September 2026
    Sumitomo Chemical starts mass production of 4-inch InP wafers for AI data centers
    Sumitomo Chemical has started mass production and sales of indium phosphide (InP) epitaxial wafers, a core material for optical semiconductors used in next-generation data centers...
    Friday 4 September 2026
    Silicon photonics testing shift could reshape how CPO suppliers win business
    As silicon photonics (SiPh) and co-packaged optics (CPO) move toward mass production, suppliers say testing is shifting earlier in the process to catch defects at the wafer stage,...
    Friday 4 September 2026
    Chip leaders call for end to 'silo mentality' as AI scale-up demands cross-industry collab
    The rapid expansion of artificial intelligence is forcing a radical shift from individual chip design to holistic system-level engineering, requiring competitors and supply chain partners...
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