News tagged Chips + components at DIGITIMES

NEWS TAGGED CHIPS + COMPONENTS

Thursday 3 September 2026

Exclusive: China 6-inch SiC substrate supply tightens, prices set to rise

China's 6-inch silicon carbide (SiC) substrate market is undergoing a structural supply-demand reversal. Driven by strengthening downstream demand and limited production restarts,...

Thursday 3 September 2026

China chip tool makers expand beyond import substitution at CSEAC 2026

China's semiconductor equipment industry is moving beyond replacing imported tools at mature nodes, with CSEAC 2026 highlighting deeper...

Thursday 3 September 2026

KEPCO seeks US$18 billion from Samsung, SK Hynix to fund Korea's power grid

Korea Electric Power Corp. (KEPCO) has proposed that Samsung Electronics and SK Hynix prepay as much as KRW25 trillion (approx. US$18 billion) in electricity bills as South Korea looks...

Thursday 3 September 2026

Semiconductor sustainability shifts to cost control as fab resource demand surges

Sustainability is not just good for communities and the environment but also good for business. This is the message from a sustainability...

Thursday 3 September 2026

Broadcom says CPO fits scale-out better than scale-up

Broadcom Senior Vice President and General Manager of the Core Switching Group Asad Khamisy said at the Semicon Taiwan 2026 master forum that co-packaged optics (CPO) is not necessarily...

Thursday 3 September 2026

CXMT expands global hiring to Japan for DDR5, LPDDR technology upgrade

Chinese DRAM maker CXMT has launched its 2027 global recruitment campaign, opening roles across circuit design, R&D, mass-production...

Thursday 3 September 2026

Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools

Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift...

Thursday 3 September 2026

Solomon leverages AI vision and optical tech to tap semiconductor inspection market

Solomon Technology, a Taiwanese artificial intelligence (AI) 3D vision company, is showcasing two key inspection applications that integrate its core AI vision and optical technologies...

Thursday 3 September 2026

TSMC doubles down on equipment purchase as AI demand is outpacing semiconductor supply chain planning

TSMC says surging AI demand is stretching the global chip industry beyond its usual planning cycle, with fast-changing procurement needs, labor shortages, and infrastructure constraints...

Thursday 3 September 2026

SK Hynix weighs Kioxia production tie-up in Japan

SK Group chairman Chey Tae-won has raised the possibility of jointly producing semiconductors with Japan's Kioxia, taking SK Hynix's exploration of a Japanese manufacturing base a...

Thursday 3 September 2026

Intel pre-funds EMIB-T and CPU capacity, will address DRAM through partners rather than fabs

Intel's US$23 billion equity raise in August was pre-funding for a capacity build driven by demand and process confidence rather than distress, chief financial officer David Zinsner...

Thursday 3 September 2026

Taiwan's supply chain is 'one of a kind,' MediaTek CEO says

MediaTek CEO Rick Tsai said Taiwan's supply-chain capabilities are unmatched as the technology industry moves into the AI and robotics era, while joking that the chip designer will...

Thursday 3 September 2026

Apple, Xiaomi and Nvidia chase terabyte-class bandwidth for AI chips

For decades, semiconductor performance gains largely came from shrinking process nodes, from 22nm and 14nm to 7nm and 3nm. AI is changing the constraint: processors are getting faster,...

Thursday 3 September 2026

AUO unit eyes TSMC ecosystem as merger benefits emerge

AUO Group's AET Corporation (AET), formed in September 2025 through the merger of AUO Envirotech and AUO Digitech, is expanding across the semiconductor supply chain and has reportedly...

Thursday 3 September 2026

China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration

Chinese advanced packaging provider SJ Semiconductor (SJSemi) has expanded its silicon-interposer-based 2.5D packaging platform to 3.3 times the standard reticle size, enabling denser...

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