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    China's Primarius Technologies initiates major EDA acquisitions, advancing industry integration
    Sep 30, 18:19
    China accelerates development of 12-inch silicon carbide wafers
    Sep 30, 18:19
    Five major pressures plaguing TSMC as US govt push for 50-50 split
    Sep 30, 18:19
    YMTC's NAND market share fell below 5% in 2Q25 amid US sanctions
    Sep 30, 18:19
    Intel starts production of Fab 52 with 18A process featuring PowerVia technology
    Sep 30, 18:19
    Samsung shifts Galaxy S26 Ultra periscope zoom camera supply chain amid quality concerns
    Sep 30, 18:18
    NEWS TAGGED CHIPS + COMPONENTS
    Monday 1 September 2025
    Rapidus 2nm chip matches TSMC's logic density, outpaces Intel in performance

    Rapidus is preparing to launch its most advanced chip yet, a 2nm process called "2HP," that could put it nearly on par with TSMC's N2...

    Monday 1 September 2025
    Samsung and SK Hynix waiver revoked: Korean chipmakers hobbled, China memory benefits
    The Trump administration has revoked long-standing exemptions that allowed Samsung Electronics and SK Hynix to use US equipment freely at their chip plants in China, a move that has...
    Monday 1 September 2025
    SMIC tightens grip on Beijing unit in latest wave of China wafer fab mergers
    China's SMIC said it will acquire the remaining 49% stake in its subsidiary, SMIC North Integrated Circuit Manufacturing (Beijing), also known as SMIC North, through an issuance of...
    Monday 1 September 2025
    APCB faces pressure after capacity reduction, eyes boost from DDR5, optical modules in 2026
    Taiwan-based PCB manufacturer APCB is launching two new products in 2025, following significant capacity downsizing in 2024. However, the company noted that the new QSFP optical module...
    Monday 1 September 2025
    Huawei launches AI SSDs to ease China's chip bottlenecks
    China's drive for self-sufficiency in AI has taken a new turn with Huawei's launch of AI solid-state drives (SSDs), aimed at easing severe shortages of high-bandwidth memory (HBM)...
    Monday 1 September 2025
    DDR4 demand eases at high levels, contract prices climbing through year-end
    Memory spot prices surged in the second quarter of 2025 but have since stabilized at high levels. DDR4 supply remains constrained, yet the earlier rush to secure inventory has eased,...
    Monday 1 September 2025
    Intel receives US$5.7B government investment; shareholding deal still under negotiation
    Intel CFO David Zinsner recently revealed that the company has received a US$5.7 billion subsidy from the US government under the CHIPS and Science Act. This funding is part of an...
    Monday 1 September 2025
    Amkor revises site plan for Arizona advanced packaging facility
    Amkor Technology, Inc. announced on August 28 that it will relocate the planned site of its new advanced semiconductor packaging and test facility in Arizona to the Peoria Innovation...
    Monday 1 September 2025
    Weekly news roundup: Intel revives AI chip fight with Jaguar Shores; Samsung may invest in Intel packaging push
    Below are the top DIGITIMES Asia stories from August 25 to 31, 2025.
    Monday 1 September 2025
    TSMC to raise foundry prices by 5-10% across advanced nodes in 2026
    TSMC plans to increase foundry prices for its advanced semiconductor processes by approximately 5% to 10% in 2026, according to sources in the IC design industry.
    Monday 1 September 2025
    Cambricon's second act: From Huawei's castoff to China's AI hopeful
    China's Cambricon Technologies, a leading domestic AI chip startup, has endured a turbulent rise marked by the brilliance of its founding brothers and the pressure of shifting geopolitics...
    Monday 1 September 2025
    Samsung steps up hiring in US as Tesla and Apple orders drive expansion
    Samsung Electronics is stepping up hiring for its US semiconductor operations, posting a wave of openings for engineers and process specialists in Austin and Taylor, Texas. The roles,...
    Monday 1 September 2025
    South Korea’s HBM pioneer highlights hybrid bonding and compute-in-memory trends
    As artificial intelligence and high-performance computing continue to advance rapidly, high-bandwidth memory (HBM) paired with GPUs has become a critical battleground in the semiconductor...
    Monday 1 September 2025
    India roundup: Modi turns US 50% tariff blow into reform push
    The US's 50% tariff on India took effect on August 27, dealing a blow to Indian exporters. India's semiconductor push is gaining traction.
    Sunday 31 August 2025
    Intel veteran to head ADI’s Oregon fab as leadership exodus deepens

    Narahari Ramanuja, a 25-year Intel veteran and former director of advanced packaging technology development, is leaving the company to...

    33/306 pages
    biz
    BIZ FOCUS
    Sep 9, 12:48
    Meet ADLINK's cExpress-R8: The compact solution to demanding and diverse industrial workloads
    Tuesday 30 September 2025
    AT&S Highlights AI-Driven Sustainable Manufacturing at CMIA 2025
    Wednesday 24 September 2025
    GUC Launches Next - Generation 2.5D/3D APT Platform Leveraging TSMC's Latest 3DFabric and Advanced Process Technologies
    Wednesday 24 September 2025
    Wise Integration Appoints Ghislain Kaiser, Successful High-Tech Entrepreneur & Former Intel Executive, as CEO to Lead Global Growth
    biz