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    NEWS TAGGED CHIPS + COMPONENTS
    Thursday 17 July 2025
    China's Wingtech reboots C-suite as it doubles down on semiconductors
    Wingtech Technology announced on July 15 a sweeping leadership overhaul as it shifts its core strategy toward semiconductors, following the divestiture of its consumer electronics...
    Thursday 17 July 2025
    Adata surges on memory boom, eyes AI and Biotech for next growth wave
    Taiwanese memory module maker Adata Technology reported after-tax profit of NT$462 million (US$15 million) in June 2025, marking a dramatic turnaround from a loss in the same month...
    Thursday 17 July 2025
    Malaysia’s states compete to lead national push in IC design

    Malaysia is ramping up efforts to grow its domestic integrated circuit (IC) design industry, as key states such as Selangor, Sarawak,...

    Thursday 17 July 2025
    Can GlobalFoundries' MIPS move chip away at Arm's edge AI dominance?
    While Intel's new CEO Lip-Bu Tan is still pondering how to find a path forward for its foundry business, US-based semiconductor foundry giant GlobalFoundries (GF) recently announced...
    Thursday 17 July 2025
    What killed China's rising 5G chip hopeful? The untold collapse of Jian Wen Lu Semiconductor

    Founded in 2016 by former Tokyo Seimitsu (Accretech) engineer Sheng Jinghao, Jian Wen Lu (Zhejiang) Semiconductor was once considered...

    Wednesday 16 July 2025
    LG enters hybrid bonding tool race, challenging Samsung and Hanwha
    LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth...
    Wednesday 16 July 2025
    As Huawei Ascend courts the Middle East and Southeast Asia, Washington raises red flags
    In early July, the US Department of Commerce issued a stark warning: using Huawei's Ascend AI chips "anywhere in the world" could be considered a violation of US export controls....
    Wednesday 16 July 2025
    Broadcom launches Tomahawk Ultra AI networking chip built on TSMC's 5nm process to challenge Nvidia
    Broadcom has launched its latest Tomahawk Ultra Ethernet switch chip, fabricated using TSMC's 5nm process, targeting high-performance AI infrastructure with a design aimed squarely...
    Wednesday 16 July 2025
    Yageo again extends Shibaura tender deadline ahead of crucial Taiwan talks
    Yageo has extended the deadline for its tender offer to acquire Japan's Shibaura Electronics for a fifth time, citing ongoing regulatory review under Japan's Foreign Exchange and...
    Wednesday 16 July 2025
    Samsung, S&S Tech advance EUV mask localization to reduce reliance on Japan's Hoya
    Samsung Electronics is accelerating efforts to localize the production of extreme ultraviolet (EUV) blank masks in South Korea through a collaboration with domestic partner S&S...
    Wednesday 16 July 2025
    ASML posts strong results, eyes growth amid China curbs and tariff concerns
    ASML reported robust second-quarter earnings, with sales rising 23% year-over-year to EUR7.69 billion (US$8.94 billion), driven by upgrade demand and cost efficiencies. While tariff...
    Wednesday 16 July 2025
    Semco targets automotive, industrial MLCCs amid AI surge
    Generative artificial intelligence (AI) and autonomous driving technologies are fueling structural growth in multilayer ceramic capacitors, with AI servers and automotive electronics...
    Wednesday 16 July 2025
    Penang's OSAT boom: ASE, Tongfu, Inari lead charge in advanced packaging
    Malaysia has steadily developed its outsourced semiconductor assembly and testing (OSAT) industry, with Penang — often called the "Silicon Valley of the East" — at its...
    Wednesday 16 July 2025
    From decline to recovery: Japan's semiconductor lessons for South Korea
    Facing mounting challenges at home and intensifying global competition, South Korea's semiconductor industry is at a crossroads. Now, a growing chorus of experts is urging Seoul to...
    Wednesday 16 July 2025
    Hanmi Semiconductor says hybrid bonders too costly for HBM4, HBM5 production
    Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation high-bandwidth memory production, as the South Korean company...
    33/294 pages
    Research Report Database
    BIZ FOCUS
    Aug 5, 11:49
    Cultivating OCP, embracing open source
    Wednesday 13 August 2025
    Advanced WLP and back-end solutions at SEMICON Taiwan 2025
    Wednesday 9 July 2025
    TRI unveils new multi-camera AOI, TR7500 SIII Ultra
    Wednesday 13 August 2025
    Alif Semiconductor vying for market dominance in battery-powered generative AI applications and Edge AI
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES