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Monday 20 April 2026
Wooptix advances testing and production capabilities in targeting entry into leading foundries by 2028
Spanish optical inspection startup Wooptix officially unveiled its first inspection system, Phemet, in November 2025. The company stated that its first-generation prototype has already...
Monday 20 April 2026
Odisha to break ground on India's first advanced 3D chip packaging unit
Odisha broke ground on India's first advanced 3D chip packaging unit on April 19, 2026, a move that could reshape global semiconductor supply chains by adding high-end heterogeneous...
Monday 20 April 2026
Commentary: Spain's IC design ecosystem revives as EU chip sovereignty demand grows
Amid rising geopolitical tensions linked to semiconductors, European countries and industries are increasingly anxious about semiconductor autonomy. This concern has empowered many...
Monday 20 April 2026
Zhen Ding plans Hong Kong listing for subsidiary to boost global IC substrate presence
Printed circuit board (PCB) giant Zhen Ding Technology held a board meeting on April 17 and approved plans for its subsidiary, Leading Interconnect Semiconductor Technology (LIST),...
Monday 20 April 2026
SOCAMM2 race intensifies as SK Hynix starts mass production, while Micron and Samsung push competing designs
SK Hynix has begun mass production of its 192GB SOCAMM2 memory module, marking a major step in the commercialization of next-generation low-power server DRAM designed for AI workloads,...
Monday 20 April 2026
Samsung reportedly signals exit from LPDDR4 market as memory industry shifts toward LPDDR5
Memory makers are accelerating the phase-out of older mobile DRAM generations, with policies on LPDDR4 and DDR4 increasingly converging toward end-of-life (EOL) management as the industry...
Monday 20 April 2026
Samsung tests domestic EUV masks to cut Japan reliance at 4nm

Samsung Electronics has begun testing domestic EUV blank masks in its 4nm foundry production line, a shift aimed at cutting reliance on...

Monday 20 April 2026
Cerebras revives IPO bid as AI boom fuels growth and high-profile partnerships

Cerebras Systems has renewed its push to go public, filing for an initial public offering (IPO) after shelving an earlier attempt amid regulatory...

Monday 20 April 2026
Weekly news roundup: Samsung launches voluntary retirement; Qualcomm moves into custom DRAM with CXMT
Below are the most-read DIGITIMES Asia stories from the week of April 13-19, 2026:
Monday 20 April 2026
As 2D NAND fades, UMC faces steep hurdles to enter a shrinking market

The global retreat from 2D NAND flash production is no longer a possibility but an emerging certainty. As major memory makers exit the segment,...

Monday 20 April 2026
Canary Islands push into semiconductors, build on space tech base

The Canary Islands, an Atlantic archipelago off northwest Africa, have long been defined by tourism rather than technology.

Monday 20 April 2026
MSP+ eyes 2026 growth with new Yangmei plant, advances in Micro LED and CPO
Micraft System Plus (MSP+), a supplier of mass transfer and laser technology equipment, will officially open its new Yangmei factory in northern Taiwan in May 2026, significantly boosting...
Monday 20 April 2026
Samsung files injunction to prevent union from occupying chip facilities
Samsung Electronics has taken legal action amid escalating labor disputes with its union, filing for an injunction at a South Korean court on April 16, 2026, to prevent the union from...
Monday 20 April 2026
Taiyo Yuden raises MLCC prices, Murata takes the lead, Samsung to follow suit
Japanese electronic components maker Taiyo Yuden recently issued a price increase notice, announcing that it will raise prices on some products starting in May, specifically in the...
Sunday 19 April 2026
Corning leads glass substrate race as South Korea's KCC and LX Glass face steep challenges
Glass core substrates, valued for their low dielectric loss and warpage reduction, are key to next-generation advanced semiconductor packaging. In South Korea, traditional glass makers...