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    NEWS TAGGED CHIPS + COMPONENTS
    Monday 1 September 2025
    DDR4 demand eases at high levels, contract prices climbing through year-end
    Memory spot prices surged in the second quarter of 2025 but have since stabilized at high levels. DDR4 supply remains constrained, yet the earlier rush to secure inventory has eased,...
    Monday 1 September 2025
    Intel receives US$5.7B government investment; shareholding deal still under negotiation
    Intel CFO David Zinsner recently revealed that the company has received a US$5.7 billion subsidy from the US government under the CHIPS and Science Act. This funding is part of an...
    Monday 1 September 2025
    Amkor revises site plan for Arizona advanced packaging facility
    Amkor Technology, Inc. announced on August 28 that it will relocate the planned site of its new advanced semiconductor packaging and test facility in Arizona to the Peoria Innovation...
    Monday 1 September 2025
    Weekly news roundup: Intel revives AI chip fight with Jaguar Shores; Samsung may invest in Intel packaging push
    Below are the top DIGITIMES Asia stories from August 25 to 31, 2025.
    Monday 1 September 2025
    TSMC to raise foundry prices by 5-10% across advanced nodes in 2026
    TSMC plans to increase foundry prices for its advanced semiconductor processes by approximately 5% to 10% in 2026, according to sources in the IC design industry.
    Monday 1 September 2025
    Cambricon's second act: From Huawei's castoff to China's AI hopeful
    China's Cambricon Technologies, a leading domestic AI chip startup, has endured a turbulent rise marked by the brilliance of its founding brothers and the pressure of shifting geopolitics...
    Monday 1 September 2025
    Samsung steps up hiring in US as Tesla and Apple orders drive expansion
    Samsung Electronics is stepping up hiring for its US semiconductor operations, posting a wave of openings for engineers and process specialists in Austin and Taylor, Texas. The roles,...
    Monday 1 September 2025
    South Korea’s HBM pioneer highlights hybrid bonding and compute-in-memory trends
    As artificial intelligence and high-performance computing continue to advance rapidly, high-bandwidth memory (HBM) paired with GPUs has become a critical battleground in the semiconductor...
    Monday 1 September 2025
    India roundup: Modi turns US 50% tariff blow into reform push
    The US's 50% tariff on India took effect on August 27, dealing a blow to Indian exporters. India's semiconductor push is gaining traction.
    Sunday 31 August 2025
    Intel veteran to head ADI’s Oregon fab as leadership exodus deepens

    Narahari Ramanuja, a 25-year Intel veteran and former director of advanced packaging technology development, is leaving the company to...

    Sunday 31 August 2025
    Women lead 18% of listed firms in Taiwan, championing AI innovation in 2025
    The Taiwan Women on Boards Association and EY jointly hosted the 2025 Hard Talk, Soft Power, Bold Future Forum on August 27, attracting nearly 300 female directors, CEOs, and professional...
    Saturday 30 August 2025
    Huawei develops AI SSDs to cut reliance on HBM, putting Korean chipmakers on edge
    Huawei is preparing to commercialize solid-state drives tailored for artificial intelligence, a move that industry analysts say could challenge the dominance of high-bandwidth memory...
    Saturday 30 August 2025
    TSMC supplier AMC rewires its future with warpage-control materials after LCD collapse

    Taiwan's LCD panel industry, which peaked at over NT$1 trillion in 2007, collapsed within years and became unprofitable. The decline...

    Saturday 30 August 2025
    Samsung, SK Hynix lose US waiver for China fabs
    The U.S. Department of Commerce has announced the revocation of waivers that allowed a select group of foreign semiconductor manufacturers to export U.S.-origin semiconductor manufacturing...
    Friday 29 August 2025
    South Korean media points to TSMC as main cause of Samsung's AP procurement cost surge
    Samsung Electronics' smartphone division is reportedly struggling with escalating cost pressures, largely attributed to the rapid rise in prices for mobile application processors...
    8/300 pages
    9/11 Veeam Platform Webinar
    BIZ FOCUS
    Aug 5, 11:49
    Cultivating OCP, embracing open source
    Wednesday 3 September 2025
    Tescan Unveils New Global Brand Platform 'The Art of Discovery' with APAC Rollout at SEMICON Taiwan
    Wednesday 3 September 2025
    Micraft System Plus Unveils Proprietary Thermo-Compression Bonder, Expands into Advanced Packaging Market
    Wednesday 3 September 2025
    SK hynix Introduces Industry's First Commercial High NA EUV
    Summary of Tech Supply Chain News!
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES