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Friday 17 April 2026
Topoint bond deal signals wider supply risk for global AI hardware makers
The surge in AI-grade high-speed computing is pushing printed circuit board manufacturing toward thicker, higher-layer designs, creating a strategic, global shortage of advanced coated...
Friday 17 April 2026
Spanish startup Openchip targets 2028 launch on agentic AI wave
Openchip's growth and product roadmap could reshape AI computing supply chains and deployment costs globally, offering lower-power alternatives and CPU-independent modules that could...
Friday 17 April 2026
UMC signals 2026 wafer price adjustment amid tightening demand and capacity pressure
United Microelectronics Corp. (UMC) is expected to raise wafer foundry prices in the second half of 2026, as demand for logic and memory-related applications remains resilient and...
Friday 17 April 2026
China outlines AI-led investment push and industrial upgrading under new five-year plan framework
China is preparing a new round of large-scale investment and industrial upgrading centered on AI infrastructure, advanced manufacturing, and strategic emerging industries, according...
Friday 17 April 2026
China wafer maker NSIG lifts revenue on 300mm momentum
National Silicon Industry Group (NSIG) reported full-year 2025 revenue growth driven by higher 300mm wafer shipments, though pricing pressure and high fixed costs weighed on margin...
Friday 17 April 2026
TSMC remains top choice for European AI chip startups amid capacity scramble
European efforts to advance sovereign AI and chip autonomy are gaining momentum, but European AI chip startups say they still primarily rely on TSMC for high-performance computing...
Friday 17 April 2026
TSMC revises advanced process and packaging strategy
TSMC chairman C.C. Wei emphasized persistent capacity shortages during the company's earnings call, noting that 3nm technology accounted for about 25% of first-quarter 2026 revenue...
Friday 17 April 2026
Taiwan's OSAT expansion could tighten global test capacity and raise costs
Taiwan's outsourced semiconductor assembly and test industry is expanding rapidly, driven by AI, high-performance computing, and memory demand. Global supply chains may face tighter...
Friday 17 April 2026
The tumor chip from Taiwan that catches what mouse trials miss
A year-old startup from Hsinchu, Taiwan is preparing to make its American debut. Fluidiconic Bio will join four other Taiwanese startups at the Plug and Play Silicon Valley Summit...
Friday 17 April 2026
Intel expands foundry push with Samsung executive hire
Intel, which is working to scale its outsourced chip manufacturing business, has hired Samsung Electronics executive Shawn Han to strengthen its foundry operations and customer engagement...
Friday 17 April 2026
Analysis: ASML lifts 2026 guidance on strong EUV demand
ASML delivered first-quarter 2026 results that exceeded expectations, prompting management to raise its full-year guidance despite a cautious outlook for the second quarter. The company...
Friday 17 April 2026
ASML extends Low NA EUV to 2031, ramps up High NA production
ASML's confirmation that memory-chip demand underpinned its stronger-than-expected results for the first quarter of 2026 — along with its updated EUV roadmaps — has broad...
Friday 17 April 2026
Japan backs Sony image sensor expansion with up to US$380 million subsidy
Japan has announced government support for Sony's image sensor expansion project in Kumamoto, underscoring the strategic importance of semiconductor supply chains for artificial intelligence...
Friday 17 April 2026
Tongfu Microelectronics profit jumps on AI chip packaging, AMD demand

Tongfu Microelectronics posted strong 2025 results, supported by AI and automotive chip demand, while reinforcing its position in the...

Friday 17 April 2026
Analysis: Intel, Musk advance TeraFab partnership, echoing Apple's TSMC shift

Tesla CEO Elon Musk has aligned his TeraFab megafab initiative with Intel, in a move that had been signaled in recent months.