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Tuesday 2 September 2025
Hanwha Semitech advances fluxless bonding to address HBM packaging strains
As high-bandwidth memory (HBM) moves to taller stacks with denser chip-to-chip I/O connections, thermal compression bonding (TC bonder) technology is hitting bottlenecks. Hanwha Semitech...
Tuesday 2 September 2025
South Korea's Nextin lands SK Hynix deal, plans expansion in Japan, US, and Europe
South Korea-based optical wafer inspection equipment manufacturer Nextin has made strides in the high-bandwidth memory (HBM) segment, gaining traction after launching its dedicated...
Tuesday 2 September 2025
China's GPU startup Lisuan secures US$70 million as Dosilicon deepens stake, despite heavy losses
Dosilicon Co. has doubled down on Lisuan Technology, a Chinese GPU startup with no revenue but soaring investor attention. The Shanghai firm raised CNY500 million (US$70 million)...
Monday 1 September 2025
Column: Modern computational methods transform semiconductor manufacturing landscape
Since 2000, semiconductor manufacturing has increasingly depended on advanced computational techniques, notably first principles calculations and machine learning, with quantum computing...
Monday 1 September 2025
Taiwan's Co-tech to halt standard copper foil, double down on AI and 5G specialty demand
Co-tech Development is shifting further into high-performance copper foil for AI servers and 5G networks, confirming it will discontinue standard-grade foil production by early 2026...
Monday 1 September 2025
TPCA Show to kick off in October with Unimicron chair as keynote speaker
The technology supply chain will gather for a series of exhibitions in the second half of 2025, including Taiwan's major PCB industry event, the TPCA Show, which will take place from...
Monday 1 September 2025
Rapidus 2nm chip matches TSMC's logic density, outpaces Intel in performance

Rapidus is preparing to launch its most advanced chip yet, a 2nm process called "2HP," that could put it nearly on par with TSMC's N2...

Monday 1 September 2025
Samsung and SK Hynix waiver revoked: Korean chipmakers hobbled, China memory benefits
The Trump administration has revoked long-standing exemptions that allowed Samsung Electronics and SK Hynix to use US equipment freely at their chip plants in China, a move that has...
Monday 1 September 2025
SMIC tightens grip on Beijing unit in latest wave of China wafer fab mergers
China's SMIC said it will acquire the remaining 49% stake in its subsidiary, SMIC North Integrated Circuit Manufacturing (Beijing), also known as SMIC North, through an issuance of...
Monday 1 September 2025
APCB faces pressure after capacity reduction, eyes boost from DDR5, optical modules in 2026
Taiwan-based PCB manufacturer APCB is launching two new products in 2025, following significant capacity downsizing in 2024. However, the company noted that the new QSFP optical module...
Monday 1 September 2025
Huawei launches AI SSDs to ease China's chip bottlenecks
China's drive for self-sufficiency in AI has taken a new turn with Huawei's launch of AI solid-state drives (SSDs), aimed at easing severe shortages of high-bandwidth memory (HBM)...
Monday 1 September 2025
DDR4 demand eases at high levels, contract prices climbing through year-end
Memory spot prices surged in the second quarter of 2025 but have since stabilized at high levels. DDR4 supply remains constrained, yet the earlier rush to secure inventory has eased,...
Monday 1 September 2025
Intel receives US$5.7B government investment; shareholding deal still under negotiation
Intel CFO David Zinsner recently revealed that the company has received a US$5.7 billion subsidy from the US government under the CHIPS and Science Act. This funding is part of an...
Monday 1 September 2025
Amkor revises site plan for Arizona advanced packaging facility
Amkor Technology, Inc. announced on August 28 that it will relocate the planned site of its new advanced semiconductor packaging and test facility in Arizona to the Peoria Innovation...
Monday 1 September 2025
Weekly news roundup: Intel revives AI chip fight with Jaguar Shores; Samsung may invest in Intel packaging push
Below are the top DIGITIMES Asia stories from August 25 to 31, 2025.