COG (chip-on-glass) packaging demand has picked up recently as some Taiwan-based suppliers of TDDI (touch and display driver integrated) chips adopt the method to replace COF (chip-on-film)...

The planned launch of foldable smartphones by vendors other than Samsung Electronics such as Huawei and other Chinese brands, will benefit Taiwan's supply chain makers related to...

With more LCD panel suppliers capable of producing in commercial volume OLED displays for smartphones, Taiwan-based driver IC firms and related backend houses are gearing up to grow...

As China's leading smartphone and telecom equipment maker, Huawei is moving at full throttles to strengthen its capabilities for the upcoming 5G commercialization era by placing orders...

Unimos Microelectronics, a re-invested memory backend service affiliate of China's Tsinghua Unigroup, has recently kicked off volume production at its 3D NAND memory chips packaging...

Chip-on-film (COF) packaging demand for panel-use driver ICs, demand for memory chips including niche-market DRAM and automotive NOR flash, and demand for automotive touch and display...

Smartphone vendors intend to promote their all-screen models in 2019 to boost their unit sales amid stagnant global demand for smartphones. With all-screen smartphones adopting TDDI...

Testing house ChipMOS Technologies plans to raise its quotes particularly those for TDDI chips by about 5% in early October, according to industry sources. The price adjustment is...

Driver IC backend specialists have inked supply deals with several of their fabless clients, and have promised sufficient capacity for COF (chip-on-film) packaging over the next three...

Demand for TDDI (touch and display driver integration) chips is set to ramp up starting the third quarter, with Taiwan-based backend firms including Chipbond Technology and ChipMOS...

Japan gaming consoles provider Nintendo is aggressively bracing for the upcoming robust shipments of its star product Switch series gaming machines with the rollout of heavyweight...

ChipMOS Technologies has seen its COF (chip-on-film) packaging production capacity run at full utilization, thanks to strong demand for TDDI (touch and display driver integration)...

Chip on film (COF) packaging substrate supplier JMC Electronics and COF back-end service firms Chipbond Technology and ChipMOS Technologies are set to enjoy brisk sales in the second...

Backend house ChipMOS Technologies has signed a five-year syndicated loan for NT$12 billion (US$401.4 million) with 11 local banks in Taiwan, according to a company filing with the...

Backend firm ChipMOS Technologies has announced net profits of NT$22.8 million (US$0.77 million) for the first quarter of 2018, down 86% sequentially and 99% on year, with EPS coming...