Taiwan-based memory modules packagers Orient Semiconductor Electronics (OSE) and ChipMos Technologies are expected to see their revenues pick up month by month in the second half...
A ramp-up in orders for NAND flash memory will boost revenues at backend houses ChipMOS Technologies and Orient Semiconductor Electronics (OSE) in the second half of 2019, according...
Chip-on-film (COF) substrate supplier JMC Electronics has enjoyed robust demand for semi-additive tape COF packaging services, boasting clear order visibility through the first half...
Backend house ChipMOS Technologies expects a pick-up in demand for DRAM in the second half of 2019, while new orders for NAND flash devices will start generating revenues.
Taiwan-based memory backend specialists have seen clear order visibility through the fourth quarter of 2019, as they have directly or indirectly tapped into the supply chains of major...
Taiwan-based IC backend supply chain players are optimistic about their performance prospects for the second half of 2019 in line with TSMC's positive outlook about demand for high-end...
Clear order visibility for diverse IC packaging materials is seen through the end of the third quarter of the year thanks mainly to increasingly robust demand from OSAT (outsourced...
Taiwan's handset TDDI IC supply chain for Huawei, including designers, backend COF service providers and substrate suppliers, have turned guardedly optimistic about their business...
COF packaging demand for automotive OLED displays has emerged, which may further tighten market supply as capacity expansion will remain quite limited in the short term, according...
With the US trade sanctions likely to prove disastrous to Huawei, Taiwan semiconductor supply chain partners can hardly give clear-cut prospects for the third quarter of 2019 and...
ChipMOS Technologies, which provides backend services for mainly memory chips and display driver ICs, expects to post sequential revenue growth starting the second quarter of 2019.
With Nintendo's Switch reportedly to become available in China, Macronix International is expected to see its ROM chip shipments pick up later in 2019, according to industry source...
Backend houses have seen orders for handset-use TDDI (touch and display driver integration) chips ramp up significantly, prompting them to allocate part of their COF (chip on film)...