Logic IC backend specialist Greatek Electronics is constructing two new factories, which are set to be completed for commercial runs in 2022, but the company has already seen clients...
TSMC and other major high-tech firms in Taiwan have reported little impact from a five-hour rolling power blackout that affected many parts of the country on May 13.
Demand for packaging materials for processing high-end display driver ICs (DDI) remains strong, as backend houses including Chipbond Technology and ChipMOS Technologies still maintain...
Major Taiwan-based OSATs including ASE Technology, Powertech Technology (PTI), Chipbond Technology and ChipMOS Technologies have seen their order preparation times extended to three...
Display driver IC (DDI) backend specialists Chipbond Technology and ChipMOS Technologies have seen unstable capacity utilization for processing small- to medium-size applications due...
OSATs have been notified by their Japan-based packaging materials suppliers including Showa Denko about a potential supply shortfall of as much as 50% between May and June, according...
Backend house ChipMOS Technologies will expand production capacity for memory chips by 30-40% in 2021 to meet strong demand from major memory module makers in Taiwan, according to...
Persistently strong demand for MOSFET chips and niche-type DRAM have kept backend specialists including Walton Advanced Engineering, ChipMos Technologies and GEM Services running at...
Semiconductor materials distributors are expected to gain profit momentum from brisk sales of COG or COF packaging materials driven by robust demand for e-paper and ESL (electronic...
Taiwan's display driver IC (DDI) backend specialist ChipMOS Technologies expects to post a double-digit revenue growth in 2021 with better profits than 2020, driven by robust DDI demand,...
Major memory probe card vendors in the US and Japan have seen a surge in demand from DRAM suppliers, with delivery lead times for their orders already extended to around 20 weeks from...
Packaging materials suppliers have seen a surge in orders from display driver IC (DDI) backend specialists, and are poised to enjoy strong DDI demand throughout 2021, according to...
Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are...
Chipmakers including TSMC and UMC have started buying water by the truckload for their foundries in Southern Taiwan Science Park (STSP), as reservoirs in southern Taiwan face dwindling...
Taiwan's IC backend supply chain players are poised to embrace another robust year in 2021 driven by strong demand for 5G and Wi-Fi 6 applications, after logging full capacity utilization...
