As artificial intelligence continues to redefine the architecture and demands of modern computing, ASE is positioning Co-Packaged Optics (CPO) and advanced packaging at the center...
Broadcom has introduced its next-gen Ethernet switch chip, Jericho4, at the 2025 OCP APAC Summit, marking a key move toward scaling AI data center connectivity across regions. The...
Taiwan plays a uniquely strategic role in Google's global operations and its expanding artificial intelligence infrastructure, according to Chris Verne, a longtime Google executive...
As AI infrastructure continues to reshape global supply chains, the Open Compute Project (OCP) APAC Summit held in Taipei on August 5, 2025, highlighted the Asia-Pacific region's expanding...
AI data center chipmaker Astera Labs will showcase its next-gen interconnect technologies at this week's Open Compute Project (OCP) APAC event. In an exclusive interview with DIGITIMES,...
The Open Compute Project APAC Summit (OCP APAC) will officially open in Taipei in early August 2025. American IC design giant Broadcom, which holds a critical position in cloud AI...
With the 2025 OCP APAC Summit set to kick off next week in Taipei, industry attention is turning toward the next wave of AI and high-performance computing (HPC) infrastructure.
Over 100 business and technology leaders from across our customer and partner network gathered for the EdgeOpen Consortium APAC 2025 event, held at ADLINK headquarters in Taoyuan,...
Microsoft is reportedly laying off around 6,000 employees, or about 3% of its global workforce, with most of the cuts concentrated in the US. The tech giant has also made organizational...
Czech-based electron microscope manufacturer TESCAN is undergoing a strategic shift, expanding into advanced semiconductor packaging through its growing expertise in failure analysis...
Olaf Kratge, Head of Regional Market Management APAC of Hilscher Gesellschaft, a globally recognized leader in industrial communication solutions, gave a keynote speech at D-Forum...
The Indian government has initiated a major upgrade of its semiconductor capabilities at the Semiconductor Laboratory (SCL), India's first wafer fab, in Mohali with an RFP. This move...
During the 25th Taiwan Circuit Board Industry International Exhibition 2024 at the Taipei Nangang Exhibition Center from 23-25 October 2024, we had the pleasure of meeting and interviewing...
