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    NEWS TAGGED APAC
    Wednesday 3 September 2025
    Tescan Unveils New Global Brand Platform 'The Art of Discovery' with APAC Rollout at SEMICON Taiwan

    Tescan Group proudly introduces its new global brand platform The Art of Discovery at this year's Microscopy Conference (MC) in Karlsruhe, Germany. Built on the belief...

    Tuesday 26 August 2025
    Research Insights: Broadcom defends Ethernet ecosystem as NVLink and UALink push specialized interconnects
    At the OCP APAC Summit, Ethernet and UALink advocates clashed over data center interconnect architectures. Kurtis Bowman, UALink board chair and AMD's director of architecture and...
    Thursday 14 August 2025
    TSMC integrates CoWoS packaging with Coupe photonics for AI performance boost
    Dr. Shang Y. Hou, Director of TSMC's High Performance Packaging Integration Division, delivered a keynote at the OCP APAC Summit 2025. He showcased how the chipmaker is combining its...
    Monday 11 August 2025
    Weekly news roundup: 'China for China' Strategy, Xiaomi's open-source voice AI, and Broadcom at OCP APAC
    Below are the top DIGITIMES Asia stories from Aug 4 to Aug 10, 2025. The top three topics include 'China for China' drives Western chipmakers' strategy, Xiaomi releases open-source...
    Monday 11 August 2025
    From cost burden to growth engine: AI revolutionizes advanced packaging
    At the OCP APAC 2025 conference, a high-profile panel brought together senior executives from TSMC, ASE, MediaTek, and Synopsys to examine how chiplets, advanced packaging, and next-generation...
    Thursday 7 August 2025
    Nvidia launches 800V HVDC architecture, passive component leaders enter the power supply chain
    The power revolution in AI data centers has attracted global passive component leader Murata to actively participate. At the 2025 OCP APAC Summit held in Taiwan, Murata unveiled a...
    Thursday 7 August 2025
    UALink, Broadcom spar over Ethernet's role in AI
    Despite Nvidia's absence at the 2025 OCP APAC Summit, rival factions within the anti-NVLink camp clashed over competing interconnect strategies for next-generation AI infrastructure...
    Thursday 7 August 2025
    ASE challenges TSMC’s photonics play with CPO packaging push
    At the inaugural Open Compute Project (OCP) APAC Summit in Taipei, ASE Group Executive Vice President Tingu Yin Chang said surging AI computing demand has become the primary catalyst...
    Wednesday 6 August 2025
    Chiplet ecosystem gains momentum with Intel, TSMC, MediaTek backing

    Leading semiconductor companies called for stronger adoption of open chiplet standards at the OCP APAC Summit 2025 in Taipei, highlighting...

    Wednesday 6 August 2025
    OCP APAC 2025: ASE doubles down on co-packaged optics as AI reshapes semiconductor design
    As artificial intelligence continues to redefine the architecture and demands of modern computing, ASE is positioning Co-Packaged Optics (CPO) and advanced packaging at the center...
    Wednesday 6 August 2025
    Broadcom scales AI cloud with Jericho4 and bets on open interoperability
    Broadcom has introduced its next-gen Ethernet switch chip, Jericho4, at the 2025 OCP APAC Summit, marking a key move toward scaling AI data center connectivity across regions. The...
    Tuesday 5 August 2025
    OCP APAC Summit 2025: Google sees Taiwan as key hub in global AI strategy
    Taiwan plays a uniquely strategic role in Google's global operations and its expanding artificial intelligence infrastructure, according to Chris Verne, a longtime Google executive...
    Tuesday 5 August 2025
    Asia's moment in the AI age: APAC rises as infrastructure powerhouse at OCP, Taiwan forges global tech ties
    As AI infrastructure continues to reshape global supply chains, the Open Compute Project (OCP) APAC Summit held in Taipei on August 5, 2025, highlighted the Asia-Pacific region's expanding...
    Tuesday 5 August 2025
    Interview: Astera Labs: AI infrastructure enters 2.0 with open AI interconnect options
    AI data center chipmaker Astera Labs will showcase its next-gen interconnect technologies at this week's Open Compute Project (OCP) APAC event. In an exclusive interview with DIGITIMES,...
    Monday 4 August 2025
    Exclusive: Broadcom exec weighs in on Nvidia's NVLink strategy and silicon photonics future
    The Open Compute Project APAC Summit (OCP APAC) will officially open in Taipei in early August 2025. American IC design giant Broadcom, which holds a critical position in cloud AI...
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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook