Dr. Shang Y. Hou, Director of TSMC's High Performance Packaging Integration Division, delivered a keynote at the OCP APAC Summit 2025. He showcased how the chipmaker is combining...
Below are the top DIGITIMES Asia stories from Aug 4 to Aug 10, 2025. The top three topics include 'China for China' drives Western chipmakers' strategy, Xiaomi releases open-source...
At the OCP APAC 2025 conference, a high-profile panel brought together senior executives from TSMC, ASE, MediaTek, and Synopsys to examine how chiplets, advanced packaging, and next-generation...
The power revolution in AI data centers has attracted global passive component leader Murata to actively participate. At the 2025 OCP APAC Summit held in Taiwan, Murata unveiled a...
Despite Nvidia's absence at the 2025 OCP APAC Summit, rival factions within the anti-NVLink camp clashed over competing interconnect strategies for next-generation AI infrastructure...
At the inaugural Open Compute Project (OCP) APAC Summit in Taipei, ASE Group Executive Vice President Tingu Yin Chang said surging AI computing demand has become the primary catalyst...
As artificial intelligence continues to redefine the architecture and demands of modern computing, ASE is positioning Co-Packaged Optics (CPO) and advanced packaging at the center...
Broadcom has introduced its next-gen Ethernet switch chip, Jericho4, at the 2025 OCP APAC Summit, marking a key move toward scaling AI data center connectivity across regions. The...
Taiwan plays a uniquely strategic role in Google's global operations and its expanding artificial intelligence infrastructure, according to Chris Verne, a longtime Google executive...
As AI infrastructure continues to reshape global supply chains, the Open Compute Project (OCP) APAC Summit held in Taipei on August 5, 2025, highlighted the Asia-Pacific region's...
AI data center chipmaker Astera Labs will showcase its next-gen interconnect technologies at this week's Open Compute Project (OCP) APAC event. In an exclusive interview with DIGITIMES,...
The Open Compute Project APAC Summit (OCP APAC) will officially open in Taipei in early August 2025. American IC design giant Broadcom, which holds a critical position in cloud AI...
With the 2025 OCP APAC Summit set to kick off next week in Taipei, industry attention is turning toward the next wave of AI and high-performance computing (HPC) infrastructure.
