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Wednesday 8 July 2009
Winbond completes transition to 300mm fab production
Taiwan's Winbond Electronics, which has shifted its focus from standard DRAM to niche memory and NOR flash, has recently completed its migration to 300mm wafer fab production, according...
Thursday 2 July 2009
TSMC processes over five million 12-inch wafers based on sub 0.13-micron nodes
Taiwan Semiconductor Manufacturing Company (TSMC) has cumulatively shipped over five million 12-inch equivalent wafers of chips processed with sub 0.13-micron processes, according...