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NEWS TAGGED 3D-STACKING
Tuesday 20 June 2017
Samsung ramps up 64-layer V-NAND memory production
Samsung Electronics has begun volume production of 64-layer, 256Gb V-NAND flash memory for use with an expanding line-up of storage solutions for server, PC and mobile applications,...
Tuesday 29 January 2013
STATS ChipPAC, UMC unveil 3D IC developed under open ecosystem model
STATS ChipPAC and United Microelectronics Corporation (UMC) have jointly announced the first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem...
Tuesday 20 November 2012
STATS ChipPAC to expand operations in Korea
STATS ChipPAC has announced plans to expand its semiconductor assembly and test operation in South Korea. The Singapore-based backend house added that it has signed a non-binding...
Monday 2 April 2012
Amkor licenses proprietary through-mold-via technology to Shinko
Amkor Technology has announced that the company has granted Shinko Electric Industries a non-exclusive license to its proprietary through-mold-via (TMV) technology.
Friday 16 December 2011
Chip equipment spending to decline following two years of growth, says Gartner
Worldwide semiconductor capital equipment spending is expected to total US$51.7 billion in 2012, a 19.5% decline from projected 2011 spending of US$64.2 billion, according to Gartn...
Tuesday 30 August 2011
Amkor, Globalfoundries team up for advanced assembly, test solutions
Amkor Technology and Globalfoundries have entered into a strategic partnership to develop integrated assembly and test solutions for advanced silicon nodes, according to the companies...
Tuesday 25 January 2011
Nanya, ITRI team up for 3D stacked DRAM
Taiwan-based Nanya Technology has teamed up with government-backed Industrial Technology Research Institute (ITRI) to develop a through silicon via (TSV) technology for high-capacity...
Thursday 1 July 2010
ITRI sets up 3D IC experimental lab
The Taiwan government-backed Industrial Technology Research Institute (ITRI) has announced the establishment of an experimental lab, which deploys 12-inch wafer through silicon via...
Monday 21 June 2010
Elpida, PTI and UMC enter joint development deal for 3D-TSV technology
Elpida Memory, Powertech Technology (PTI) and United Microelectronics Corporation (UMC) have jointly announced their entry into a 3-way cooperation to advance 3D IC integration technologies...
Friday 30 April 2010
Major growth in TSV metrology/inspection equipment expected, says The Information Network
The market for metrology/inspection equipment for 3D through silicon via (TSV) semiconductor packaging looms large, according to The Information Network. The desire for smaller, lighter...
Thursday 15 October 2009
Applied Materials, ITRI team up for 3D chip stack technology
Applied Materials has announced its collaboration with the Taiwan government-backed Industrial Technology Research Institute (ITRI) to accelerate the development and commercialization...
Friday 9 October 2009
Osram infrared Platinum Dragon in stack chip technology
The infrared Platinum Dragon from Osram Opto Semiconductors provides a high radiance from a small surface. With its one square millimeter thin-film chip in stack technology it generates...
Tuesday 6 October 2009
Suss MicroTec teams up with ITRI for development in 3D integration
Suss MicroTec, a supplier of process and test solutions for the semiconductor industry and related markets, has announced that it is engaging with the Industrial Technology Research...
Tuesday 6 October 2009
IMEC sets major step towards 3D integration of DRAM on logic
Leuven, Belgium - September 30, 2009 - IMEC and its 3D integration partners have taped-out Etna, a new 3D chip integrating a commercial DRAM chip on top of a logic IC. The new 3D...
Friday 2 October 2009
3D IC packaging to be mature within 3 years, says ASE chief officer
Advanced 3D packaging has been adopted in image sensor ICs used in camera lens modules which recently entered volume production, and will be applied into CPUs, baseband ICs, and handset...