Suss MicroTec, a supplier of process and test solutions for the semiconductor industry and related markets, has announced that it is engaging with the Industrial Technology Research...

Leuven, Belgium - September 30, 2009 - IMEC and its 3D integration partners have taped-out Etna, a new 3D chip integrating a commercial DRAM chip on top of a logic IC. The new 3D...

Advanced 3D packaging has been adopted in image sensor ICs used in camera lens modules which recently entered volume production, and will be applied into CPUs, baseband ICs, and handset...

Powertech Technology (PTI) aims to turn the China plant it is buying from Spansion into its major production base for non-memory packaging and testing, covering logic ICs, SiP (system...

Unlike conventional SoC or SiP solutions that integrate ICs on a two-dimensional (2D) surface, using through silicon via (TSV) technology in a package that stacks ICs in a three-dimensional...

Taiwan's Semiconductor Industry Promotion Office under the Ministry of Economic Affairs (MOEA) and Industrial Technology Research Institute (ITRI) recently gathered experts to discuss...

Driven by growing demand for strong IC design integration, Taiwan's Industrial Technology Research Institute (ITRI) recently established a consortium for advanced stacked-system technology...