Intel has announced plans to invest more than US$5 billion to build a new chip manufacturing facility at its site in Chandler, Arizona. Designated Fab 42, it will be built as a 300mm...
The semiconductor industry enjoyed over 30% revenue growth in 2010, with unit sales also rising an impressive 31%, according to Semico Research. But wafer demand, based on semiconductor...
STATS ChipPAC on September 15 celebrated the opening of a new manufacturing facility to process 300mm wafers using embedded wafer-level BGA (eWLB) technology. The Singapore-based chip...
Following a weak 2009, global demand for silicon used in semiconductor manufacturing is expected to rebound robustly in 2010, led by shipments of 300mm (12-inch) wafers, according...
STATS ChipPAC has expanded the embedded wafer-level ball-grid array (eWLB) technology to reconstituted 300mm wafers, according to the company. By adding capacity through 300mm wafer...
The emergence of state-of-the-art BCD (Bipolar-CMOS-DMOS) platform technologies is having a far reaching effect on the analog/mixed-signal IC landscape, the Petrov Group has commented...
The Shanghai municipal government will invest 4.5 billion yuan (US$658.7 million) in a new 12-inch (300mm) wafer fab to be built by a joint venture of Hua Hong NEC (HHNEC) and Grace...
United Microelectronics Corporation (UMC) has begun implementing a capacity expansion project for 45/40nm production at its Singapore-based 300mm (12-inch) wafer fab - Fab 12i, according...
Suss MicroTec, a supplier of process and test solutions for the semiconductor industry and related markets, has announced that it is engaging with the Industrial Technology Research...
Texas Instruments (TI) has announced the opening of its manufacturing facility in Richardson, Texas. The chipmaker said it expects to begin moving equipment into the facility in Oc...
Spansion has claimed its foundry agreement with Semiconductor Manufacturing International Corporation (SMIC) is still valid, though the schedule to ramp 65nm production at SMIC's 300mm...
United Microelectronics Corporation (UMC) has been working closely with customers, including FPGA specialist Xilinx, to volume produce 45/40nm products at its 300mm (12-inch) fabs,...
Winbond Electronics, a Taiwan-based DRAM maker that has diversified its products to include niche memory and NOR flash, has said its capital spending for 2009 may be less than its...
The semiconductor industry has long been preoccupied with smaller transistors and larger silicon wafers, in its effort to meet the ever-increasing demands of consumer technology. While...
