News tagged 300mm at DIGITIMES

NEWS TAGGED 300MM

Wednesday 30 September 2026

NSIG chair exit brings leadership succession into focus

National Silicon Industry Group (NSIG) chairman Haitao Jiang has resigned from all positions at the company, prompting the Shanghai-listed semiconductor materials supplier to begin...

Wednesday 30 September 2026

GlobalFoundries Singapore capacity utilization tops 90% as silicon photonics expansion hits equipment lead-time bottleneck

GlobalFoundries (GF) is expanding its Singapore footprint following its acquisition of local silicon photonics foundry Advanced Micro Foundry (AMF), integrating 200mm and 300mm silicon...

Tuesday 29 September 2026

Vanguard chairman says AI slowdown won't free up chip capacity

Vanguard International Semiconductor (VIS) and NXP Semiconductors' joint venture, VisionPower Semiconductor Manufacturing Company (VSMC),...

Sunday 27 September 2026

South Korea's 300mm research gap: Daejeon pitches an open fab as a US$1.46 billion fix

Daejeon is seeking to build a roughly KRW2 trillion (approx. US$1.46 billion) national semiconductor research hub centered on an open 300mm manufacturing and demonstration fab, aiming...

Monday 21 September 2026

Tower Semiconductor to make Japan its largest optical chip base

Tower Semiconductor plans to make Japan its largest manufacturing base for optical communications semiconductors after expanding silicon...

Friday 18 September 2026

Resonac grows 300mm SiC crystal, marking a substrate milestone

Resonac has grown and processed a 300mm silicon carbide (SiC) single crystal. This development could shape the future of power electronics used worldwide in electric vehicles, renewable...

Wednesday 2 September 2026

IBM's quantum pitch to chip audience: bottleneck is now manufacturing

IBM's case for quantum computing no longer rests on physics. At Semicon Taiwan 2026 on September 1, the company's argument was that AI has outrun what silicon can supply, that no amount...

Monday 31 August 2026

China silicon wafers enter AI-led upcycle: prices rise, 12-inch capacity expands

Hangzhou Lion Microelectronics plans to invest about CNY3 billion (approx. US$446 million) in a new 12-inch silicon wafer project in Jiaxing,...

Friday 21 August 2026

China silicon wafer maker NSIG nears 1.2 million monthly 300mm capacity after 90% shipment jump

National Silicon Industry Group (NSIG) reported a 36.51% rise in first-half 2026 revenue as shipments of 300mm semiconductor silicon wafers increased more than 90%, though continued...

Wednesday 19 August 2026

PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips

As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and...

Friday 14 August 2026

Rapidus targets 8-reticle interposers by 2030

Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...

Wednesday 15 July 2026

SK Siltron begins 300mm wafer production at KRW2.3 trillion Gumi plant

SK Siltron has begun volume production and customer shipments from a KRW2.3 trillion (approx. US$1.54 billion) expansion of its Gumi wafer...

Monday 6 July 2026

SEMI warns Trump admin against meddling in memory market

SEMI has warned the Trump administration that intervening in memory-chip pricing or production capacity could worsen a historic supply...

Friday 26 June 2026

SK Siltron to bring new 300mm wafer capacity online as AI demand lifts shipments

SK Siltron is preparing to bring a new silicon wafer manufacturing facility online in South Korea next month. The expansion comes as AI...

Thursday 18 June 2026

TSMC, ASML and Imec push 2D transistors toward manufacturing

Imec, ASML and TSMC have demonstrated a 300mm integration route for 2D-material n-type and p-type field-effect transistors, marking a...

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