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NEWS TAGGED 300MM
Friday 21 August 2026
China silicon wafer maker NSIG nears 1.2 million monthly 300mm capacity after 90% shipment jump
National Silicon Industry Group (NSIG) reported a 36.51% rise in first-half 2026 revenue as shipments of 300mm semiconductor silicon wafers increased more than 90%, though continued...
Wednesday 19 August 2026
PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips
As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and...
Friday 14 August 2026
Rapidus targets 8-reticle interposers by 2030
Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...
Wednesday 15 July 2026
SK Siltron begins 300mm wafer production at KRW2.3 trillion Gumi plant

SK Siltron has begun volume production and customer shipments from a KRW2.3 trillion (approx. US$1.54 billion) expansion of its Gumi wafer...

Monday 6 July 2026
SEMI warns Trump admin against meddling in memory market

SEMI has warned the Trump administration that intervening in memory-chip pricing or production capacity could worsen a historic supply...

Friday 26 June 2026
SK Siltron to bring new 300mm wafer capacity online as AI demand lifts shipments

SK Siltron is preparing to bring a new silicon wafer manufacturing facility online in South Korea next month. The expansion comes as AI...

Thursday 18 June 2026
TSMC, ASML and Imec push 2D transistors toward manufacturing

Imec, ASML and TSMC have demonstrated a 300mm integration route for 2D-material n-type and p-type field-effect transistors, marking a...

Tuesday 16 June 2026
ASML, TSMC, and imec move 2D transistors closer to manufacturing reality
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor...
Monday 18 May 2026
India's Tata Electronics partners with ASML to support first 300mm fab ramp-up
Tata Electronics has signed a memorandum of understanding with ASML to support the establishment and ramp-up of its upcoming 300mm semiconductor fab in Dholera, Gujarat, marking a...
Thursday 23 April 2026
Japan's LSTC launches optoelectronic advanced packaging project around Rapidus cluster
Research on optoelectronic integration — referring to the application of optical communication technology to computing — is gaining momentum. Its semiconductor packaging...
Friday 17 April 2026
China wafer maker NSIG lifts revenue on 300mm momentum
National Silicon Industry Group (NSIG) reported full-year 2025 revenue growth driven by higher 300mm wafer shipments, though pricing pressure and high fixed costs weighed on margin...
Saturday 11 April 2026
Intel unveils ultra-thin GaN chiplet as it advances AI-era systems foundry strategy
Intel Foundry has announced a breakthrough in gallium nitride (GaN) chiplet technology, unveiling what it describes as the world's thinnest GaN chiplet as part of its broader push...
Thursday 12 February 2026
SEMI: AI and HBM lift 2025 silicon wafer shipments, revenue still dips
Worldwide silicon wafer shipments increased 5.8% in 2025 to 12,973 million square inches (MSI), while wafer revenue declined 1.2% to US$11.4 billion, according to the year-end analysis...
Thursday 13 November 2025
Trymax - Plasma-based etching, stripping and curing process equipment maker

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum,...

Tuesday 11 February 2025
Sumco to end silicon wafer production at Miyazaki plant by 2026
Japanese silicon wafer manufacturer Sumco has announced plans to cease silicon wafer production at its Miyazaki plant in Japan by the end of 2026, as part of its strategy to improve...