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    China opens STAR Market IPO route for large AI model companies
    10h 49min ago
    Physical AI and cabin-driving integration to drive China’s smart driving supply chain in 2H26
    10h 49min ago
    Commentary: BYD’s humanoid robot push intensifies competition with robotics startups
    10h 49min ago
    Groq CEO sees GPU and LPU as complementary as AI compute demand grows
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    YMTCs NAND share rose to 13% as South Korean rivals watch closely
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    Global suppliers race accelerate: TSMC’s first CoPoS demo tools enter validation
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    NEWS TAGGED 300MM
    Thursday 18 June 2026
    TSMC, ASML and Imec push 2D transistors toward manufacturing

    Imec, ASML and TSMC have demonstrated a 300mm integration route for 2D-material n-type and p-type field-effect transistors, marking a...

    Tuesday 16 June 2026
    ASML, TSMC, and imec move 2D transistors closer to manufacturing reality
    ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor...
    Monday 18 May 2026
    India's Tata Electronics partners with ASML to support first 300mm fab ramp-up
    Tata Electronics has signed a memorandum of understanding with ASML to support the establishment and ramp-up of its upcoming 300mm semiconductor fab in Dholera, Gujarat, marking a...
    Thursday 23 April 2026
    Japan's LSTC launches optoelectronic advanced packaging project around Rapidus cluster
    Research on optoelectronic integration — referring to the application of optical communication technology to computing — is gaining momentum. Its semiconductor packaging...
    Friday 17 April 2026
    China wafer maker NSIG lifts revenue on 300mm momentum
    National Silicon Industry Group (NSIG) reported full-year 2025 revenue growth driven by higher 300mm wafer shipments, though pricing pressure and high fixed costs weighed on margin...
    Saturday 11 April 2026
    Intel unveils ultra-thin GaN chiplet as it advances AI-era systems foundry strategy
    Intel Foundry has announced a breakthrough in gallium nitride (GaN) chiplet technology, unveiling what it describes as the world's thinnest GaN chiplet as part of its broader push...
    Thursday 12 February 2026
    SEMI: AI and HBM lift 2025 silicon wafer shipments, revenue still dips
    Worldwide silicon wafer shipments increased 5.8% in 2025 to 12,973 million square inches (MSI), while wafer revenue declined 1.2% to US$11.4 billion, according to the year-end analysis...
    Thursday 13 November 2025
    Trymax - Plasma-based etching, stripping and curing process equipment maker

    Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum,...

    Tuesday 11 February 2025
    Sumco to end silicon wafer production at Miyazaki plant by 2026
    Japanese silicon wafer manufacturer Sumco has announced plans to cease silicon wafer production at its Miyazaki plant in Japan by the end of 2026, as part of its strategy to improve...
    Tuesday 1 October 2024
    Global 300mm fab equipment spending to hit US$400 billion from 2025 to 2027, says SEMI
    Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. The robust spending is being driven by the regionalization...
    Thursday 12 September 2024
    Infineon develops 300mm GaN technology
    Infineon Technologies has announced the development of the world's first 300mm power gallium nitride (GaN) wafer technology. The company claims to be the first to effectively implement...
    Friday 23 August 2024
    Mitsubishi Materials develops world's largest rectangular silicon substrate for AI chips
    Mitsubishi Materials has announced the development of the world's largest rectangular silicon substrate, a technology gaining attention due to advancements in advanced packaging. The...
    Monday 19 August 2024
    TI to receive up to US$1.6 billion in CHIPS Act funding
    Texas Instruments (TI) and the US Department of Commerce have signed a non-binding preliminary memorandum of terms for up to US$1.6 billion in proposed direct funding under the CHIPS...
    Tuesday 6 August 2024
    Silicon wafer shipments increase in 2Q24
    Worldwide silicon wafer shipments increased 7.1% quarter-on-quarter to 3.035 billion square inches in the second quarter of 2024, but saw an 8.9% decline from the 3.33 billion square...
    Monday 29 July 2024
    OSATs expect sales growth in 2H24
    Semiconductor backend services providers generally believe sales will improve in the second half of 2024, but the strength of the growth momentum remains to be seen.
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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook