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NEWS TAGGED 300MM
Saturday 31 October 2026
Infineon's 300mm GaN push turns Europe's power-chip strength into an AI infrastructure bet

The aggressive deployment of infrastructure-scale AI projects is rapidly driving up compute demand as chip architectures continue to scale across...

Wednesday 14 October 2026
300mm fab equipment spending to hit US$227 billion by 2029, SEMI says
Global spending on 300mm front-end fab equipment is projected to reach US$149 billion in 2026, up 31% from a year earlier. Spending is expected to keep growing at double-digit rates...
Wednesday 30 September 2026
NSIG chair exit brings leadership succession into focus
National Silicon Industry Group (NSIG) chairman Haitao Jiang has resigned from all positions at the company, prompting the Shanghai-listed semiconductor materials supplier to begin...
Wednesday 30 September 2026
GlobalFoundries Singapore capacity utilization tops 90% as silicon photonics expansion hits equipment lead-time bottleneck
GlobalFoundries (GF) is expanding its Singapore footprint following its acquisition of local silicon photonics foundry Advanced Micro Foundry (AMF), integrating 200mm and 300mm silicon...
Tuesday 29 September 2026
Vanguard chairman says AI slowdown won't free up chip capacity

Vanguard International Semiconductor (VIS) and NXP Semiconductors' joint venture, VisionPower Semiconductor Manufacturing Company (VSMC),...

Sunday 27 September 2026
South Korea's 300mm research gap: Daejeon pitches an open fab as a US$1.46 billion fix
Daejeon is seeking to build a roughly KRW2 trillion (approx. US$1.46 billion) national semiconductor research hub centered on an open 300mm manufacturing and demonstration fab, aiming...
Monday 21 September 2026
Tower Semiconductor to make Japan its largest optical chip base

Tower Semiconductor plans to make Japan its largest manufacturing base for optical communications semiconductors after expanding silicon...

Friday 18 September 2026
Resonac grows 300mm SiC crystal, marking a substrate milestone
Resonac has grown and processed a 300mm silicon carbide (SiC) single crystal. This development could shape the future of power electronics used worldwide in electric vehicles, renewable...
Wednesday 2 September 2026
IBM's quantum pitch to chip audience: bottleneck is now manufacturing
IBM's case for quantum computing no longer rests on physics. At Semicon Taiwan 2026 on September 1, the company's argument was that AI has outrun what silicon can supply, that no amount...
Monday 31 August 2026
China silicon wafers enter AI-led upcycle: prices rise, 12-inch capacity expands

Hangzhou Lion Microelectronics plans to invest about CNY3 billion (approx. US$446 million) in a new 12-inch silicon wafer project in Jiaxing,...

Friday 21 August 2026
China silicon wafer maker NSIG nears 1.2 million monthly 300mm capacity after 90% shipment jump
National Silicon Industry Group (NSIG) reported a 36.51% rise in first-half 2026 revenue as shipments of 300mm semiconductor silicon wafers increased more than 90%, though continued...
Wednesday 19 August 2026
PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips
As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and...
Friday 14 August 2026
Rapidus targets 8-reticle interposers by 2030
Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...
Wednesday 15 July 2026
SK Siltron begins 300mm wafer production at KRW2.3 trillion Gumi plant

SK Siltron has begun volume production and customer shipments from a KRW2.3 trillion (approx. US$1.54 billion) expansion of its Gumi wafer...

Monday 6 July 2026
SEMI warns Trump admin against meddling in memory market

SEMI has warned the Trump administration that intervening in memory-chip pricing or production capacity could worsen a historic supply...