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STATS ChipPAC intros 300mm embedded WLB wafer manufacturing

Press release

Apr 13, 2010, 12:00 0

STATS ChipPAC has expanded the embedded wafer-level ball-grid array (eWLB) technology to reconstituted 300mm wafers, according to the company...

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STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility

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