Taiwan Semiconductor Manufacturing Company (TSMC) is expanding its monthly 12-inch capacity to 240,000 wafers at the end of 2010, rising by 37% from a year earlier, and the capacity...
Speculation has circulated in Taiwan that Texas Instruments' (TI) 12-inch wafer foundry plant, which is about to enter volume production for analog chips, will allow the chip vendor...
Elpida Memory's planned TDR (Taiwan depositary receipt) issue has received approval from Taiwan's Industrial Development Bureau (IDB) under the Ministry of Economic Affairs (MOEA)...
It was not long ago that Taiwan was considered just a provider of back-end (assembly and test) services for the semiconductor industry. However, over the past two decades the country...
LCD driver IC design houses will transition into 12-inch processes at the end of 2010 to the first quarter of 2011. Chipbond Technology is currently the only backend chip packager...
MJC Probe (MPI) has seen its order visibility for LED probers and sorters extend to the first quarter of 2011, according to company president Steve Chen.
Macronix International's board of directors has approved a budget of NT$27.5 billion (US$900 million) to expand capacity at its 12-inch fab, an increase of NT$7 billion from the company's...
Packaging and testing house ChipMOS Technologies (Bermuda) has revealed plans to add a new, 12-inch gold bumping production line in Taiwan with the installation set to complete by...
Global silicon shipments in terms of square inches will rise to record levels in 2010, according to semiconductor manufacturing market research firm iSuppli. Shipments of silicon...
Cando, a subsidiary of AU Optronics (AUO), expects its touch panel module plant in Suzhou, China to have a monthly capacity of 600,000 units at the end of 2010, increasing from the...
With its lead in advanced process capacity, Taiwan Semiconductor Manufacturing Company (TSMC) is expected to be the largest beneficiary of increased outsourcing by IDMs, Nobunaga...
NOR flash and mask ROM chipmaker Macronix International has obtained a syndicated loan worth NT$18 billion (US$564 million) from 15 banks, to fund the smooth operation of its new...
STATS ChipPAC on September 15 celebrated the opening of a new manufacturing facility to process 300mm wafers using embedded wafer-level BGA (eWLB) technology. The Singapore-based...
Packaging and testing house Chipbond Technology has reported better-than-expected revenue and profit results for the second quarter of 2010, reflecting strong market demand for LCD...
Macronix International will invest a total of almost NT$30 billion (US$936 million) in its recently-acquired 12-inch wafer fab at the Hsinchu Science Park (HSP), northern Taiwan in...
