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NEWS TAGGED 12-INCH
Friday 5 November 2010
MPI sees LED equipment order visibility through 1Q11
MJC Probe (MPI) has seen its order visibility for LED probers and sorters extend to the first quarter of 2011, according to company president Steve Chen.
Tuesday 26 October 2010
Macronix scales up investment budget for 12-inch capacity expansion
Macronix International's board of directors has approved a budget of NT$27.5 billion (US$900 million) to expand capacity at its 12-inch fab, an increase of NT$7 billion from the company's...
Tuesday 5 October 2010
ChipMOS to expand into 12-inch gold bumping
Packaging and testing house ChipMOS Technologies (Bermuda) has revealed plans to add a new, 12-inch gold bumping production line in Taiwan with the installation set to complete by...
Thursday 30 September 2010
Shipments of semiconductor silicon to jump 23.6% in 2010, says iSuppli
Global silicon shipments in terms of square inches will rise to record levels in 2010, according to semiconductor manufacturing market research firm iSuppli. Shipments of silicon...
Wednesday 29 September 2010
Cando to triple touch panel module monthly capacity at Suzhou plant by the end of 2010
Cando, a subsidiary of AU Optronics (AUO), expects its touch panel module plant in Suzhou, China to have a monthly capacity of 600,000 units at the end of 2010, increasing from the...
Friday 17 September 2010
TSMC to benefit most from IDM outsourcing, says Digitimes Research
With its lead in advanced process capacity, Taiwan Semiconductor Manufacturing Company (TSMC) is expected to be the largest beneficiary of increased outsourcing by IDMs, Nobunaga...
Friday 17 September 2010
Macronix signs NT$18 billion syndicated loan
NOR flash and mask ROM chipmaker Macronix International has obtained a syndicated loan worth NT$18 billion (US$564 million) from 15 banks, to fund the smooth operation of its new...
Wednesday 15 September 2010
STATS ChipPAC opens new plant for 300mm eWLB wafer manufacturing
STATS ChipPAC on September 15 celebrated the opening of a new manufacturing facility to process 300mm wafers using embedded wafer-level BGA (eWLB) technology. The Singapore-based...
Monday 9 August 2010
Chipbond posts strong 2Q10 results; gives cautious outlook
Packaging and testing house Chipbond Technology has reported better-than-expected revenue and profit results for the second quarter of 2010, reflecting strong market demand for LCD...
Wednesday 28 July 2010
Macronix to spend NT$30 billion on 12-inch fab over two years, says president
Macronix International will invest a total of almost NT$30 billion (US$936 million) in its recently-acquired 12-inch wafer fab at the Hsinchu Science Park (HSP), northern Taiwan in...
Tuesday 20 July 2010
Nanya steps up 12-inch fab expansion
DRAM maker Nanya Technology has ramped up wafer starts at its 12-inch fab to 40,000 units a month since July, and converted half of the production to 50nm, according to the company...
Friday 16 July 2010
UMC to ramp up capacity of Singapore-based subsidiary
United Microelectronics Corporation (UMC) plans to ramp the capacity of its 12-inch fab in Singapore, UMCi, by 40,000 12-inch wafers, according to the company. UMCi currently rolls...
Friday 16 July 2010
UMC buys 12-inch tools from TI
United Microelectronics Corporation (UMC) has announced that it is looking to further increase its production capacity with the purchase of numerous 12-inch CMOS chip manufacturing...
Wednesday 14 July 2010
TSMC to break ground for new 12-inch fab on July 16
Taiwan Semiconductor Manufacturing Company (TSMC) will break ground soon for the construction of Fab 15 at the Central Taiwan Science Park (CTSP), according to an invitation to the...
Wednesday 14 July 2010
ProMOS to complete sale of 12-inch fab to Macronix in September
ProMOS Technology has revealed that it will complete the previously-announced sale of its 12-inch wafer fab at the Hsinchu Science Park (HSP), and hand over operation to Macronix...