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Tuesday 15 September 2026
DIGITIMES Insight: AI sends the semiconductor market toward US$1.6T, with memory doing the heavy lifting
DIGITIMES Intelligence forecasts the global semiconductor market will expand from US$791.7 billion in 2025 to US$1.6 trillion in 2026, representing year-on-year growth of 109.1%.
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Tuesday 15 September 2026
Tesla's rare-earth-free Cybercab challenges China's grip on EV magnets
With Tesla's EV ambitions growing amid a years-long push toward full electrification, the deployment of the Cybercab has emerged as a major experiment testing the boundaries of autonomous driving.
Tuesday 15 September 2026
Apple's foldable debut set to further widen Samsung Display's OLED lead
Samsung Display could emerge as one of the biggest supply-chain beneficiaries of Apple's entry into foldable smartphones, as the Korean panel maker already accounts for about two-thirds of global foldable smartphone panel shipments, with Apple set to become a major new source of demand.
Tuesday 15 September 2026
Murata considers bigger MLCC expansion as AI server demand extends beyond 2028

Murata Manufacturing is considering a new, potentially larger expansion of multilayer ceramic capacitor (MLCC) capacity beyond its existing investment plans, as demand from AI servers is expected to remain strong through the end of the decade.

Tuesday 15 September 2026
AI servers are eating MLCC capacity, and Chinese suppliers are taking what's left

AI servers are reshaping the global multilayer ceramic capacitor (MLCC) market. Murata Manufacturing and Samsung Electro-Mechanics (SEMCO) are steering limited capacity toward high-value server components, tightening conventional supply, lifting prices, and creating an opening for Chinese suppliers in PCs.

Tuesday 15 September 2026
China's Guoxin Micro buys its way into power-chip manufacturing

Unigroup Guoxin Microelectronics plans to acquire WeEn Semiconductors for CNY1.9 billion (≈ US$283 million), giving the Chinese specialty IC supplier in-house wafer manufacturing and a faster route into power semiconductors.

Tuesday 15 September 2026
South Korea updates AI safeguards as Microsoft sets shutdown rules

South Korea is updating its artificial intelligence security guidance as companies deploy AI agents capable of operating with limited human supervision, while Microsoft is proposing model-level rules requiring its systems to remain subject to human interruption and shutdown.

Tuesday 15 September 2026
BYD's 2027 triple play could rewrite the EV race

BYD is lining up solid-state batteries, faster charging, and higher-level automated driving around 2027, potentially removing several of the remaining barriers separating electric vehicles from gasoline cars.

Tuesday 15 September 2026
Beyond H100: China's GPU makers chase scale, not just parity

China's domestic GPU industry is entering a tougher phase: matching high-end accelerator performance is no longer enough. Vendors must now combine competitive chips with interconnects, software stacks, and clusters capable of training increasingly large AI models.

Tuesday 15 September 2026
China's humanoid robot race, Part 1: Mass production outruns proven demand

China's humanoid robot industry is moving from prototypes to industrial production. The next test is no longer whether robots can be built at scale, but whether they can work reliably and cheaply enough to make that scale economically viable.

Tuesday 15 September 2026
Minebea Mitsumi pauses M&A to chase AI hardware demand
Minebea Mitsumi has halted its push for new acquisitions and is shifting resources toward producing ball bearings, motors and actuators for AI hardware, as demand tied to data centers, humanoid robots and Nvidia components accelerates.
Tuesday 15 September 2026
Samsung's Cheonan plant reallocates packaging capacity from Exynos to HBM
Samsung Electronics is accelerating the restructuring of its semiconductor packaging footprint. Its Cheonan facility is gradually phasing out packaging operations for the Exynos mobile application processor (AP), and repurposing the equipment for high-bandwidth memory (HBM) production.
Tuesday 15 September 2026
Samsung, SK Hynix diverge on cell design for sub-10nm DRAM in 2028

Samsung Electronics and SK Hynix are preparing to move DRAM below the 10nm threshold in 2028, with the two memory makers pursuing different cell structures as conventional scaling becomes increasingly difficult.

Tuesday 15 September 2026
China's space-computing race moves beyond single satellites: Shanghai's gigawatt-scale AI ambition lands in orbit
While the US showcases its strength as one of the world's established space powers — reinforced by SpaceX's growing dominance in satellite connectivity — a quieter but equally ambitious force is accelerating half a world away: China's push to build integrated, fully networked orbital infrastructure that goes beyond single-satellite launches.
Tuesday 15 September 2026
OEM/EMS AI servers: August revenue trends, operational outlook

Taiwan's original equipment manufacturer/electronics manufacturing services (OEM/EMS) sector is witnessing a structural split between explosive demand for artificial intelligence (AI) infrastructure and softening demand for legacy consumer device assembly in 2026. Monthly revenue data highlight how suppliers anchored to high-density compute racks, GPU-based servers, and high-speed network switches are delivering massive year-over-year gains, whereas manufacturers more reliant on standard notebooks face component supply bottlenecks.

Tuesday 15 September 2026
China's EV boom enters a phase of overcapacity cleanup
Within a relatively short span of time, China has built a formidable EV industry that has proved difficult for any other country to match globally, nurtured by years of industrial policy, infrastructure investment and government support.