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Monday 23 June 2025
Weekly news roundup: Taiwan's Huawei export ban, Nvidia H20 blocked by US, TSMC-Samsung 2nm showdown
Below are the most-read DIGITIMES Asia stories from June 16 to June 22, 2025. Top developments include tighter US chip restrictions on China, updates on the next-gen 2nm race from TSMC and Samsung Electronics, and new disruptions in global supply chains driven by rare earth curbs and AI chip controls
Monday 23 June 2025
India roundup: Why Taiwan's chip ban could quietly impact India
Taiwan's entity list against Chinese entities may impact India as India is accelerating chip collaborations with foreign giants
Monday 23 June 2025
NTT faces headwinds in co-packaged optics effort, pins hopes on Rapidus
Japanese telecommunications company NTT is encountering significant challenges in its efforts to mass-produce co-packaged optics (CPO), a next-generation technology increasingly critical for AI-driven data centers. Although the company has invested heavily in photonics integration, its path to large-scale commercialization remains uncertain
Saturday 21 June 2025
What Ren Zhengfei didn’t say—lessons for Taiwan’s tech playbook
In a rare and insightful interview with People's Daily, Huawei founder Ren Zhengfei shared his perspective under the headline "The, Huawei founder Ren Zhengfei shared his perspective under the headline "The More Open a Country Is, the More It Advances."
Saturday 21 June 2025
Beijing sends signal with Huawei: sanctions won’t stop AI ambitions
Just as US and Chinese officials resumed trade negotiations in London, China's state-run People's Daily did something unusual: it ran a rare front-page interview with Huawei's founder, Zhengfei Ren. Although a rather peculiar timing, but not likely a coincidence
Saturday 21 June 2025
Applied Materials to set up semiconductor innovation hub in Bengaluru, aiming for US$2 billion impact
The Economic Times reported that Applied Materials is set to establish a cutting-edge Innovation Center for Semiconductor Manufacturing (ICSM) in Bengaluru, India, with the potential to catalyze over US$2 billion in future investments, according to Suraj Rengarajan, managing director and head of the semiconductor products group at Applied Materials India. His remarks follow the Karnataka government's recent approval of three semiconductor projects, including Applied's proposal
Saturday 21 June 2025
India grants Starlink license to operate satellite internet services
India has granted a license to Elon Musk's Starlink, paving the way for the satellite internet service to operate in the country. India's Communications Minister Jyotiraditya Scindia announced this on social media, calling it a "next frontier of connectivity" for India. The licence follows the recent issuance of the GMPCS permit from the Department of Telecommunications
Saturday 21 June 2025
Nidec's Takisawa taps China's robot boom with precision tool push
Takisawa Machine Tool, a subsidiary of Japan's Nidec Corp., is leveraging its parent company's extensive sales networks and industrial connections to expand its presence in China's rapidly developing automation and humanoid robotics market. The move is designed to boost sales of Takisawa's high-precision lathes and machining tools in a competitive landscape dominated by both Japanese and Chinese firms
Friday 20 June 2025
GBM expands AI product line via Lincstech acquisition, focus on Singapore and Malaysia operations
Global Brands Manufacture (GBM), a PCB and EMS subsidiary of Walsin Technology, recently held a shareholders' meeting led by chairman Yu-Heng Chiao to discuss acquiring Japan's Lincstech. The deal aims to boost the company's presence in AI servers, semiconductors and expand production in Singapore
Friday 20 June 2025
China to inject US$19 billion in consumer subsidies as trade-in policy expands
In a continued push to stimulate domestic demand, China is set to release an additional CNY138 billion (approx. US$19 billion) in the second half of 2025 to fund subsidies for its nationwide "old-for-new" consumer trade-in program. The policy covers a wide range of household and consumer electronics, including home appliances, kitchen and bathroom equipment, smartphones, and automobiles
Friday 20 June 2025
South Korea's Dongjin Semichem licenses OLED material patents to Merck and Idemitsu Kosan
South Korea's Dongjin Semichem has licensed its OLED material patents to major companies, including Germany's Merck and Japan's Idemitsu Kosan, highlighting its technological prowess and strong patent portfolio
Friday 20 June 2025
Foxconn reportedly to manufacture iPhone enclosures in India, expands Tamil Nadu presence
Foxconn is preparing to manufacture iPhone enclosures in India for the first time, marking a significant expansion of its local operations. According to sources cited by the Economic Times, the company plans to set up a dedicated unit at the ESR Industrial Park in Oragadam, Tamil Nadu, adjacent to its upcoming display module assembly plant
Friday 20 June 2025
Intel-backed SATAS begins pilot line construction at Sharp's factory in Japan
The Semiconductor Assembly Test Automation and Standardization Research Association (SATAS), spearheaded by Intel Corporation in Japan, announced on June 19, 2025, that it has begun constructing a pilot semiconductor back-end production line at Sharp Corporation's Kameyama facility in Mie Prefecture. In addition to equipment installation, SATAS has initiated environmental preparation work for several buildings within the site
Friday 20 June 2025
NIO spins off chip division, wants slice of Nvidia's AI pie

NIO has launched a new chip design subsidiary — Anhui Shenji Technology — in a strategic move to become a full-stack provider of smart driving technologies. The unit will support NIO's vehicle platforms and expand into supplying chips to external OEMs, while laying the groundwork for future fundraising and strategic investor participation

Friday 20 June 2025
Samsung and SK Hynix reportedly accelerate VCT DRAM development as stepping stone to 3D DRAM
Samsung and SK Hynix are advancing vertical channel transistor (VCT) technology through 4F² DRAM prototypes as a transitional step toward 3D DRAM, while Micron is bypassing VCT entirely to focus directly on true 3D DRAM development, signaling a strategic divergence in next-generation memory architectures
9/11 Veeam Platform Webinar
Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES