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Friday 22 August 2025
Nvidia's HBM supply chain to undergo major reshuffle in 2026
The high-bandwidth memory (HBM) supply landscape for Nvidia is expected to experience significant changes in 2026. Currently, about 90% of Nvidia's HBM is supplied by SK Hynix, but forecasts indicate that SK Hynix's share will drop to around 50% in 2026
Friday 22 August 2025
China signals soft resistance to US-approved Nvidia H20 shipments
On August 11, 2025, US President Donald Trump announced that Nvidia's H20 chips were approved for shipment to China. Before this, at the end of July 2025, reports indicated that Nvidia had placed an order with TSMC for 300,000 H20 chips as inventory to meet strong demand from China
Friday 22 August 2025
Xiaomi readies next-gen XRing O2 chip as it pushes toward 2nm and beyond
Xiaomi is accelerating its in-house semiconductor development. After unveiling its first 3nm flagship SoC, the XRing O1, in 2025, industry sources say the company is now developing its successor, the XRing O2, slated for release as early as the second quarter or third quarter of 2026
Thursday 21 August 2025
Yulon Finance stabilizes core business momentum with 75.3% annual revenue growth in Southeast Asia for 1H25
Yulon Finance, a car finance firm of the Yulon Group, held its online earnings call for the second quarter of 2025 on August 20. The company summarized its second-quarter 2025 operating results around three main pillars: risk control optimization, performance stabilization, and new business expansion. Through proactive strategic adjustments, these core areas have not only generated stable revenue but also laid a solid foundation for future growth
Thursday 21 August 2025
Lessons from South Korea as Taiwan prepares AI basic law with clearly defined terms
South Korea is set to implement the Basic Act on the Development of Artificial Intelligence and the Establishment of the Foundation for Trustworthiness (the AI Basic Act) in January 2026. However, following the bill's passage, numerous controversies have emerged, particularly regarding the definitions of various concepts and regulated entities. Industry observers emphasize that legislation must focus on promoting industrial development while avoiding imposing excessive obligations and responsibilities on businesses
Thursday 21 August 2025
Chinese AI startup Butterfly Effect moves HQ to Singapore as its AI agent Manus surges to US$90M run rate

China's AI startup Butterfly Effect has revealed financial results for the first time, projecting an annualized revenue run rate of US$90 million, largely fueled by its flagship AI agent service Manus

Thursday 21 August 2025
Nvidia's impossible dilemma: trust on a string between Washington and Beijing
Nvidia's H20 chips have unexpectedly emerged as a new flashpoint in the intensifying tech rivalry between the United States and China. Reports that Washington installs trackers on servers using Nvidia chips from Dell and Super Micro during shipment have fueled Beijing's suspicions, deepening its long-standing distrust of American chip security
Thursday 21 August 2025
Samsung's Lee Jae-yong hints at 2026 chip comeback after US visit
Samsung Electronics Executive Chairman Lee Jae-yong returned to South Korea this week after more than two weeks in the US, telling reporters at the airport he was "ready for 2026." His rare display of confidence has fueled speculation of a sweeping rebound for Samsung's semiconductor business within the next two years
Thursday 21 August 2025
LG Electronics reportedly to offer voluntary retirement amid media division losses
LG Electronics reportedly plans to launch a voluntary retirement scheme targeting employees in its Media & Entertainment Solutions (MS) division, seeking organizational efficiency amid continuing financial strain. The MS division has reported significant losses largely attributed to external economic pressures and market competition
Thursday 21 August 2025
Volkswagen deepens China bet with Xpeng in global E/E Race
European and Japanese automakers are increasingly turning to Chinese carmakers to navigate the accelerating transformation of vehicle electronics and electrification in the world's largest auto market. With software-defined vehicles gaining momentum, electronics and electrification architectures are no longer exclusive to battery electric vehicles, but now extend to plug-in hybrids and even internal combustion engine cars. China, once a follower in the global auto industry, is now reshaping its rules
Thursday 21 August 2025
SJ Semiconductor advances 3D packaging as key Huawei partner, climbs global OSAT rankings
China's semiconductor packaging and testing firm SJ Semiconductor (SJ Semi) has made significant headway with the completion of its third production facility, J2C, in Jiangyin's high-tech zone, alongside the topping-out of a new R&D building. Industry executives say the milestone underscores tangible progress in expanding advanced packaging capacity, strengthening China's competitiveness in high-end outsourced semiconductor assembly and test (OSAT) services
Thursday 21 August 2025
South Korea denies US plans to acquire Samsung shares amid CHIPS Act speculation
The South Korean presidential office has dismissed reports that the US government intends to purchase shares of Samsung Electronics Co., stating there is no factual basis for such claims. The clarification follows widespread speculation fueled by recent comments from US officials
Thursday 21 August 2025
Analysis: Can Chinese EVs win over Taiwan? Safety, data, and supply chain remain key questions

Reports that Chinese automaker BYD may enter the Taiwanese market through indirect channels have sparked widespread debate, reflecting growing interest—alongside skepticism—toward Chinese electric vehicles (EVs). While some Taiwanese consumers are intrigued by the value proposition, many industry experts remain wary of potential safety and privacy risks

Thursday 21 August 2025
China LED firms hike prices up to 10%; Taiwan pivots to AI
China's LED industry is facing a new round of price hikes in 2025 as rising raw material costs squeeze margins. MLS Co., Ltd., Kinglight, and Syntec Technology led the move with increases of 5–10%, prompting peers to follow. Taiwanese manufacturers remain skeptical, citing weak end-market demand that makes higher prices difficult to sustain
Thursday 21 August 2025
Chinese firms enter advanced hybrid bonding race as global chipmakers accelerate
With Moore's Law losing momentum, advanced packaging has become the industry's next significant lever to drive performance gains. At the center of this race is hybrid bonding, widely seen as the next-generation interconnect. The technology is quickly transitioning from the lab to mass production, laying the groundwork for future advances in memory and high-bandwidth memory (HBM)