SK Hynix addressed concerns about the potential impacts of tightening US export controls on its fabrication operations in China, adding no change in the company's validated end user (VEU) status and highlighting strategic plans to meet demand while navigating evolving regulations
With Japan agreeing to invest US$550 billion in US markets and open sectors including automobiles, rice, and agricultural products under a new trade agreement in exchange for the US to cut its reciprocal tariffs on Japan to 15%, sources from industry analysts believe the deal is unlikely to reshape Japanese consumers' auto preferences
In SK Hynix's second-quarter earnings call, the company emphasized strong confidence in the sustained growth of HBM, driven by increasing AI workloads and emerging applications like AI agents. He also outlined the company's technological advances in next-generation DRAM, including the upcoming 1C Nano process and innovative 3D and vertical gate memory architectures
Nvidia's H20 chip has re-entered the Chinese market but is facing an underwhelming reception, as influential tech leaders increasingly favor local semiconductor alternatives. Zhou Hongyi, co-founder and chairman of 360 Security Technology Inc. (Qihoo 360), said the H20 chip has lost its price-performance advantage in China. He noted that 360 has switched exclusively to domestic chips — specifically Huawei's — reflecting a wider industry shift
Samsung Electronics is preparing a strategic challenge to SK Hynix's dominance in sixth-generation high-bandwidth memory with an ambitious technological leap that could reshape the HBM4 supply landscape
Taiwan-based Auden Techno Corp., a leading provider of radio frequency (RF) antenna solutions, broke ground on a new manufacturing facility in Vietnam's Hải Dương Province on July 21, 2025, underscoring the company's efforts to expand global production capacity and reinforce its international supply chain resilience
Taiwan continues to dominate the global outsourced semiconductor assembly and test (OSAT) market, but China is catching up quickly. Driven by state-backed chip self-reliance efforts, China's OSAT industry has expanded at pace, steadily closing the market share gap across the Taiwan Strait. A recent industry-led initiative gaining traction in China is also pushing back against cutthroat pricing that has undermined profitability
AWS has confirmed that its last overseas research institute, located in Shanghai, has officially disbanded, stating that this organizational adjustment aligns with the company's future strategic direction and resource allocation
SK Group chairman Chey Tae-won recently visited OpenAI's headquarters in San Francisco for a private meeting with CEO Sam Altman, according to reports from South Korean outlets Maeil Business Newspaper and Yonhap News Agency. The visit marks the third known encounter between the two executives, following previous meetings in Seoul in February 2025 and San Francisco in June 2024
Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth memory), marking a pivotal shift in advanced memory packaging. Testing is underway, with commercialization dependent on market demand and investment viability
Samsung has reported strong pre-orders in Taiwan for its latest Galaxy Z7 series, with the vendor assessing the feasibility of bringing its trifold devices to the Taiwanese market when they are released at the end of the year at the earliest
South Korea has laid out an ambitious vision to become a major player in the new space economy, with a long-term goal of landing on the Moon using domestically developed rockets and building a permanent lunar economic base. But as Seoul sketches bold plans reaching into mid-century, the country's space industry is already confronting growing turbulence — from stalled rocket orders to a quiet exodus of specialized talent
Samsung Electronics plans to begin mass production of its 2nm semiconductor process in the second half of 2025. Although reports indicate that Samsung is currently trailing TSMC in yield rates, the company is reportedly identifying solutions to improve performance
Goertek Microelectronics Inc., a spin-off from Shenzhen-listed Goertek Inc., has refiled its prospectus for a listing on the main board of the Hong Kong Stock Exchange. This marks its second attempt after a previous application lapsed earlier in 2025, as the company targets growth in the global smart sensing and system-in-package (SiP) market
China's artificial intelligence sector is entering a new phase, shifting from model development to large-scale deployment, while a fierce battle for AI talent intensifies across the value chain. As of June 2025, Chinese authorities had approved and rolled out 433 large language models (LLMs), reflecting a surge in activity from algorithm design to sector-specific commercial adoption