CONNECT WITH US
Friday 4 September 2026
Taiwan to expand industrial land for AI hardware boom
Taiwan's government says it will expand industrial land development to meet surging demand for AI infrastructure hardware, as global suppliers race to add capacity through 2027...
LATEST STORIES
Monday 7 September 2026
Every Chinese CPU maker grew in 1H26 but only one grew on processors
Revenue rose at every Chinese chip company examined in the first half of 2026 amid the domestic-substitution push, but the interim filings show three quite different businesses hiding under one label. One has reached real scale and is now funding its expansion from the balance sheet rather than from operations. One is repairing its margins on a genuinely homegrown instruction set at a fraction of the scale. And the cohort's most spectacular profit number is not a processor story at all.
Monday 7 September 2026
China's JCET seeks US$968M for AI-driven packaging expansion

JCET Group is preparing a CNY6.5 billion (approx. US$968 million) private share placement to expand advanced packaging and testing capacity across high-performance computing (HPC), power modules, wafer-level packaging and memory, sharpening its exposure to AI infrastructure and China's domestic semiconductor supply chain.

Monday 7 September 2026
Exclusive: DIGITIMES' top 3 at K-Safety Expo 2026 shows where intelligent safety is heading — act 'before' disaster strikes
The most consequential safety technologies are often judged by what happens after something goes wrong: how fast an alarm sounds, how quickly rescuers arrive, or how effectively protective equipment limits injury.
Sunday 6 September 2026
K-Safety Expo 2026: Safety gets smarter as six innovators win foreign media honors
The BEST OF K-SAFETY EXPO Global Media Awards on September 3 offered a revealing snapshot of where safety technology is heading: away from passive protection and toward systems that can sense danger, interpret it, and increasingly act before humans intervene.
Sunday 6 September 2026
Hanmi's 2.5D bonders pass Taiwan foundry qualification as packaging outsourcing expands
South Korea's Hanmi Semiconductor has reportedly begun supplying 2.5D packaging bonders to an unnamed Taiwanese foundry after the equipment passed mass-production qualification, giving the company an important production foothold as Taiwan's advanced-packaging supply chain expands beyond foundry-owned lines.
Sunday 6 September 2026
K-Safety Expo 2026: Beyond AI, Korea re-engineers the human layer of industrial safety
Not every safety breakthrough spotted across the K-Safety Expo 2026 floor in Busan came with an AI camera attached.
Saturday 5 September 2026
Exclusive: South Korea's safety AI boom is being built from the top down, BEXCO says
South Korea's safety-tech sector may be increasingly filled with AI cameras, robots, drones, and predictive systems, but BEXCO general manager Tom Choi argues that the force pushing many of those technologies toward actual deployment begins somewhere less glamorous: government policy.
Saturday 5 September 2026
Samsung, SK chiefs to meet Nvidia's Huang in New York amid US investment pressure
Samsung Electronics Chairman Jay Y. Lee and SK Group Chairman Tae-won Chey are traveling to New York at the end of September 2026 to meet Nvidia CEO Jensen Huang again as Washington presses South Korean companies to expand US investment. The planned trip is drawing market attention because Samsung Electronics and SK Hynix are already pursuing large-scale spending in the US and could discuss further business ties on the sidelines of the event.
Saturday 5 September 2026
Interview: China Tier 1 supplier Jingwei Hirain shares lessons from EV race
"Demo is not a product," Jingwei Hirain president Chengjian Fan told DIGITIMES in an interview, arguing that China's new-energy vehicle industry has learned hard lessons as fast-moving startups, deep in-house development, and tougher supplier scrutiny reshape the market. He said software demand has increased more than tenfold compared with the internal combustion engine era, while the fastest mass-production delivery cycle in China has been as short as 12 months.
Saturday 5 September 2026
Samsung SDI nears solid-state battery mass production, eyes China supply chain
Reports that Samsung SDI's procurement team recently visited the Chinese production facilities of battery material maker Tinci Materials have drawn significant attention within China's industry. As Samsung SDI prepares to initiate mass production of all-solid-state batteries in the second half of 2027, its supply chain strategy and upcoming moves are rapidly becoming a major focal point in the Chinese market.
Saturday 5 September 2026
Commentary: China builds three-pronged memory strategy around CXMT, YMTC, XMC
China's memory industry is shifting from a single-champion model towards a three-pronged structure. ChangXin Memory Technologies (CXMT) is building its position in DRAM, Yangtze Memory Technologies (YMTC) in 3D NAND, while Wuhan Xinxin Semiconductor Manufacturing (XMC) is concentrating its next phase on NOR Flash, 3D integration and optoelectronics.
Friday 4 September 2026
South Korea taps chip windfall for next tech push
South Korea is turning a semiconductor-driven tax windfall into a broader technology investment push, directing record fiscal firepower toward chips, Nvidia's Vera Rubin computing platform, AI data centers, robotics and the power and water infrastructure needed to support them.
Friday 4 September 2026
Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4 output for Nvidia's Vera Rubin AI platform.
Friday 4 September 2026
Fujitsu says useful quantum computers may need far fewer qubits than expected
For years the quantum industry has worked on a discouraging assumption: that a machine capable of doing anything commercially useful would need a million qubits or more. Fujitsu told a Taipei audience that the number is coming down sharply, and that its own work is part of the reason.
Friday 4 September 2026
China's EUV gap may stretch 10–15 years, but DUV gains test Western export controls
China may remain 10–15 years away from developing domestic extreme ultraviolet (EUV) lithography, according to assessments from UBS and Zeiss, highlighting the technological gap Beijing still faces in replicating the chipmaking equipment required for leading-edge AI processors.