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Thursday 15 January 2026
Trump invokes Section 232 to levy 25% tariff on Nvidia H200, AMD MI325X chips
On January 14, US President Donald Trump signed a proclamation invoking Section 232 of the Trade Expansion Act of 1962 to impose an immediate 25% tariff on a narrow category of advanced semiconductors, citing national security risks from heavy US reliance on foreign chip supply chains
LATEST STORIES
Friday 16 January 2026
Challenges mount for China's solar industry as tax rebates end
China is phasing out export tax rebates for the solar industry, marking an end to a crucial lifeline that has propped up the industry for more than a decade
Friday 16 January 2026
China's solar braces for 2Q26 shakeout as export tax rebate ends
China's solar industry is heading into a volatile period as an impending export tax policy change exposes structural strains across the supply chain, increasing the risk of a market shakeout in the second quarter of 2026
Friday 16 January 2026
China expedites photoresist localization to reduce Japan reliance
With China and Japan launching successive anti-dumping probes and export controls on rare earths and key semiconductor materials, the risk of China's advanced-process supply chain being "choked" by critical material shortages is rising
Friday 16 January 2026
Tesla CEO reveals China's AI edge as xAI sparks US data center power race
According to Business Insider, Elon Musk, CEO of Tesla and founder of xAI, recently highlighted China's dominant position in AI computing power during a podcast, warning that the country will far surpass others globally in supporting AI operations
Friday 16 January 2026
Huawei matches Nvidia in China's AI chip market, 2026 power shift in play
Soaring demand for high-end computing power, combined with geopolitical pressure and supply-chain constraints, is reshaping China's AI chip market at a structural level. Bernstein estimates that Huawei's share of China's AI chip market rose from about one-third of Nvidia's level in 2024 to reach parity with Nvidia in 2025. The shift marks a new phase in which domestic suppliers are taking the lead
Friday 16 January 2026
South Korea seeks matching US tariff breaks after Taiwan's chip pact agreement

South Korean industry and government officials are monitoring a new trade agreement between the US and Taiwan that links semiconductor investment to import duty exemptions, with officials in Seoul saying that any future US-South Korea talks should not leave Korea worse off than Taiwan. Officials view the terms as a potential benchmark for future US-South Korea trade negotiations

Friday 16 January 2026
US drops China drone proposal; Taiwan suppliers press ahead
The US Department of Commerce has withdrawn a previously proposed plan to restrict imports of Chinese-made drones, a move that some observers view as a goodwill signal ahead of an expected meeting between US President Donald Trump and Chinese President Xi Jinping
Thursday 15 January 2026
South Korea's memory chip giants pivot back to capacity expansion

As the global memory market enters a prolonged upcycle, South Korea's two leading memory chipmakers, Samsung Electronics and SK Hynix, are expected to post record operating profits in 2026. Combined operating profit could exceed KRW300 trillion (approx. US$210 billion), roughly double the level recorded in 2025

Thursday 15 January 2026
Maxscend's first annual loss exposes fab-lite strain and legal risks
Maxscend Microelectronics is heading for its first annual loss since going public, marking a sharp reversal for one of China's leading RF chipmakers as it struggles with a costly business transition, intensifying competition, and mounting legal pressure from Japan's Murata Manufacturing
Thursday 15 January 2026
Hanmi Semiconductor leans into EMI shielding as satellite and 6G demand grows
Hanmi Semiconductor has drawn industry attention in recent years for its thermal compression bonding equipment used in high-bandwidth memory production. As low-earth-orbit satellite deployments expand and the industry moves toward 6G, the company's electromagnetic interference shielding equipment is also gaining importance
Thursday 15 January 2026
Samsung reportedly files new HBM trademarks as HBM4 advances
Samsung Electronics has reportedly filed a series of new trademarks related to high bandwidth memory as it advances preparations for its sixth-generation HBM4 products
Thursday 15 January 2026
China's WUS to build US$300m optical-electrical PCB hub for AI systems
WUS Printed Circuit (Kunshan) Co. plans to invest up to US$300 million in a high-density optical-electrical printed circuit board (PCB) project aimed at supporting next-generation packaging and interconnect requirements for AI servers, high-performance computing (HPC), and advanced networking systems
Wednesday 14 January 2026
China lifts semiconductor equipment localization to 35%
China's push to localize its semiconductor equipment supply chain has reached an unexpected milestone. Domestic tools accounted for 35% of chipmaking equipment used in 2025, up from 25% a year earlier and well above the government's original 30% target. Data from Jiemian News, SCMP, and Cacnews show localization has risen from just 7% in 2020, a nearly 400% increase in five years. In key process steps such as etching and thin-film deposition, Chinese tools now exceed 40% adoption
Wednesday 14 January 2026
SK Hynix to invest in new advanced packaging plant amid AI memory demand
SK Hynix has announced plans to invest KRW19 trillion (US$13.02 billion) to construct a new advanced packaging facility, P&T7, in Cheongju, North Chungcheong Province, South Korea. The move aims to meet growing demand for AI memory and bolster the company's semiconductor capabilities, particularly in high bandwidth memory (HBM)
Wednesday 14 January 2026
Samsung will adopt South Korea-made mask blanks to EUV process to reduce reliance on Japan
Samsung Electronics is set to introduce South Korea-made mask blanks into its extreme ultraviolet (EUV) process starting as early as the second quarter of 2026. According to ET News and The Elec, Samsung is in the final evaluation stages of its EUV mask blanks with local supplier S&S Tech and is expected to be completed by January 2026, or by February at the latest. This is the first time Samsung will use domestically produced mask blanks in its EUV process