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Thursday 15 January 2026
Trump invokes Section 232 to levy 25% tariff on Nvidia H200, AMD MI325X chips
On January 14, US President Donald Trump signed a proclamation invoking Section 232 of the Trade Expansion Act of 1962 to impose an immediate 25% tariff on a narrow category of advanced semiconductors, citing national security risks from heavy US reliance on foreign chip supply chains
LATEST STORIES
Thursday 15 January 2026
South Korea's memory chip giants pivot back to capacity expansion

As the global memory market enters a prolonged upcycle, South Korea's two leading memory chipmakers, Samsung Electronics and SK Hynix, are expected to post record operating profits in 2026. Combined operating profit could exceed KRW300 trillion (approx. US$210 billion), roughly double the level recorded in 2025

Thursday 15 January 2026
Maxscend's first annual loss exposes fab-lite strain and legal risks
Maxscend Microelectronics is heading for its first annual loss since going public, marking a sharp reversal for one of China's leading RF chipmakers as it struggles with a costly business transition, intensifying competition, and mounting legal pressure from Japan's Murata Manufacturing
Thursday 15 January 2026
Hanmi Semiconductor leans into EMI shielding as satellite and 6G demand grows
Hanmi Semiconductor has drawn industry attention in recent years for its thermal compression bonding equipment used in high-bandwidth memory production. As low-earth-orbit satellite deployments expand and the industry moves toward 6G, the company's electromagnetic interference shielding equipment is also gaining importance
Thursday 15 January 2026
Samsung reportedly files new HBM trademarks as HBM4 advances
Samsung Electronics has reportedly filed a series of new trademarks related to high bandwidth memory as it advances preparations for its sixth-generation HBM4 products
Thursday 15 January 2026
China's WUS to build US$300m optical-electrical PCB hub for AI systems
WUS Printed Circuit (Kunshan) Co. plans to invest up to US$300 million in a high-density optical-electrical printed circuit board (PCB) project aimed at supporting next-generation packaging and interconnect requirements for AI servers, high-performance computing (HPC), and advanced networking systems
Wednesday 14 January 2026
China lifts semiconductor equipment localization to 35%
China's push to localize its semiconductor equipment supply chain has reached an unexpected milestone. Domestic tools accounted for 35% of chipmaking equipment used in 2025, up from 25% a year earlier and well above the government's original 30% target. Data from Jiemian News, SCMP, and Cacnews show localization has risen from just 7% in 2020, a nearly 400% increase in five years. In key process steps such as etching and thin-film deposition, Chinese tools now exceed 40% adoption
Wednesday 14 January 2026
SK Hynix to invest in new advanced packaging plant amid AI memory demand
SK Hynix has announced plans to invest KRW19 trillion (US$13.02 billion) to construct a new advanced packaging facility, P&T7, in Cheongju, North Chungcheong Province, South Korea. The move aims to meet growing demand for AI memory and bolster the company's semiconductor capabilities, particularly in high bandwidth memory (HBM)
Wednesday 14 January 2026
Samsung will adopt South Korea-made mask blanks to EUV process to reduce reliance on Japan
Samsung Electronics is set to introduce South Korea-made mask blanks into its extreme ultraviolet (EUV) process starting as early as the second quarter of 2026. According to ET News and The Elec, Samsung is in the final evaluation stages of its EUV mask blanks with local supplier S&S Tech and is expected to be completed by January 2026, or by February at the latest. This is the first time Samsung will use domestically produced mask blanks in its EUV process
Wednesday 14 January 2026
SK Hynix reportedly trims consumer memory, shifts focus to servers

Surging demand for AI hardware is prompting memory makers to reassess their product portfolios as resources shift toward higher-margin enterprise and data center markets. Following Micron's decision to exit its Crucial consumer business late last year, market speculation has emerged that SK Hynix may also be reviewing its exposure to consumer-grade memory products

Wednesday 14 January 2026
Iluvatar CoreX sets three-generation GPU plan, eyes H200 performance
As China's domestic GPU developers accelerate public listings and expand both technological and capital investment, competition is shifting toward next-generation computing power. Iluvatar CoreX said it will unveil a three-generation GPU roadmap on January 26, 2026, outlining a new GPGPU architecture, cloud-based AI training and inference products, and high-performance computing infrastructure plans
Wednesday 14 January 2026
China's new export trio drives 2025 trade growth
China's total trade in goods reached CNY45.47 trillion (approx. US$6.51 trillion) in 2025, marking a 3.8% year-over-year increase and setting a new record, the General Administration of Customs announced on January 14. Exports rose 6.1% to CNY26.99 trillion, while imports edged up 0.5% to CNY18.48 trillion, maintaining China's status as the largest merchandise trader globally
Wednesday 14 January 2026
China extends anti-dumping tariffs on US and Korean polysilicon
As China–US technological and industrial rivalry intensifies, Beijing is strengthening its trade defence measures. China's Ministry of Commerce announced on the 13th that anti-dumping duties on imported solar-grade polysilicon from the US and South Korea will be extended for another five years from January 14, 2026
Wednesday 14 January 2026
DeepSeek V4 and the new economics of AI compute
In early 2025, as most Silicon Valley AI firms focused on stacking high-end GPUs and expanding parameter counts, Chinese startup DeepSeek took a different path. Using a pragmatic engineering approach under constrained computing resources, it delivered model performance that exceeded market expectations and caught the AI community off guard. At the time, many dismissed it as a one-off "cost-performance ambush." In hindsight, it now appears more like a prelude
Wednesday 14 January 2026
South Korea's tech independence drive under scrutiny over China links
South Korea's push to build sovereign artificial intelligence foundation models is facing heightened scrutiny as several domestic contenders in a government-backed selection process are accused of relying on Chinese technologies, raising questions about how independence should be defined in national AI development
Wednesday 14 January 2026
CXMT launches US$4bn bid to break DRAM market control
Surging artificial intelligence (AI) workloads have triggered a global shortage of HBM, tightening DRAM and NAND supply and pushing prices sharply higher. US PC maker HP is now evaluating memory procurement from China's ChangXin Memory Technologies (CXMT) to relieve mounting supply pressure