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Tuesday 28 July 2026
Magnitude 7.1 quake strikes Japan's Kumamoto; TSMC activates emergency protocols at local fab
A powerful earthquake struck Japan's Kyushu region at 4:27 p.m. on July 28. The Japan Meteorological Agency initially estimated the quake at magnitude 7.1 with a depth of 6.2 miles (10 kilometers). The strongest shaking was recorded in Uki City and Hikawa Town in Kumamoto Prefecture, reaching seismic intensity 7 on Japan's scale. TSMC's Japan fab in Kikuyo Town experienced an intensity of 5+, and a tsunami warning was issued.
Tuesday 28 July 2026
CXMT's record IPO and Apple talks collide with US curbs as DRAM tightens

AI-driven demand is tightening the global memory market just as China's leading DRAM producer, ChangXin Memory Technologies, or CXMT, accelerates capacity expansion after a record IPO.

Tuesday 28 July 2026
SK Hynix enters LPDDR6 production race with Xiaomi first in line
SK Hynix reportedly plans to begin mass production and shipments of LPDDR6 in the second half of 2026, with Xiaomi expected to become its first customer for mobile devices. Industry sources said an early LPDDR6 launch would strengthen SK Hynix's position in premium mobile DRAM and lay the groundwork for expansion into AI server memory.
Tuesday 28 July 2026
AI memory demand lifts WF6 prices as PERIC Special Gases adopts market-based pricing
Surging demand for AI servers and advanced memory devices is tightening the global supply of tungsten hexafluoride (WF6), drawing increased attention to one of the semiconductor industry's most important specialty gases.
Tuesday 28 July 2026
China speeds up 4 new cars a day, intensifying shakeout

China's blistering pace of new-car launches — expected to average four new vehicles a day in the first half of 2026 — is shifting from a market-winning tactic to a key driver of industry reshuffling and shakeouts, intensifying cutthroat competition in the auto market.

Tuesday 28 July 2026
Samsung eyes Chinese DRAM sourcing to cut costs, expand budget-phone share in China
Samsung Electronics is evaluating the use of lower-cost Chinese DRAM in some smartphones as it seeks to offset rising component costs and regain momentum in China's highly competitive budget handset market.
Tuesday 28 July 2026
Anthropic seeks SK Hynix supply for AI chips, SK chair says

Anthropic has asked SK Hynix to help supply chips for its own in-house AI chip production, SK Group chairman Chey Tae-won said. He made the remarks at a recent AI summit in San Francisco, where he also disclosed that South Korea's three new investment plans in semiconductor expansion, AI data centers and physical AI would total more than US$3 trillion.

Tuesday 28 July 2026
China reportedly starts making homegrown DUV chipmaking tools; threatens ASML's stranglehold on semiconductor equipment
China has begun manufacturing domestically developed immersion deep ultraviolet lithography machines, a potential turning point in its effort to build a self-sufficient semiconductor industry free from Western equipment controls.
Tuesday 28 July 2026
China display giant BOE rejects low-price race, turns to innovation to lift panel value
BOE, the world's largest display-panel maker and one of China's leading technology companies, is moving away from low-price competition and plans to raise the value of Chinese display products through technological innovation.
Tuesday 28 July 2026
From models to chips: Anthropic chip ambitions pull Korea deeper into the AI silicon race
The push toward deeper sovereign control over the critical hardware stack underpinning AI models is gaining traction following news of Anthropic's outreach to SK hynix for supplies related to producing its own chips, spanning early design planning and key component procurement.
Tuesday 28 July 2026
EYEQ Lab completes 200mm SiC line validation with yield above 90%

South Korean power semiconductor maker EYEQ Lab has completed mass-production validation of its dedicated 8-inch, or 200mm, silicon carbide (SiC) line in Busan, achieving an average yield above 90%, ET News reported, citing industry sources.

Tuesday 28 July 2026
Energy storage unicorn expands in Baotou as China's industry chain accelerates integration
Inner Mongolia HyperStrong Technology is a major production subsidiary established by Beijing HyperStrong Technology in Baotou, Inner Mongolia. Its development offers a useful case study as competition intensifies among China's battery energy storage system integrators.
Tuesday 28 July 2026
China's Yunnan Germanium wins long-term InP wafer order as AI optical demand rises
Yunnan Germanium has secured a major supply deal for indium phosphide (InP) wafers, underscoring how AI data center buildouts are reshaping global demand for high-speed optical parts. The contract could bolster the company's revenue base, but execution risks, capacity expansion, and market swings will determine how much benefit reaches investors and customers worldwide.
Tuesday 28 July 2026
China faces AI compute divide as advanced capacity falls short and lower-tier resources sit underused
China's AI computing infrastructure is developing along two sharply divergent paths. As large language models and AI agents gain traction across industries, rapidly rising token consumption is driving shortages of advanced computing capacity. At the same time, portions of the country's installed lower- and mid-tier capacity remain underutilized because of software compatibility issues, weak coordination between supply and demand, and inadequate resource scheduling.
Monday 27 July 2026
South Korea, AMD team up to integrate homegrown NPUs with CPUs and GPUs
South Korea and AMD have agreed to build and demonstrate heterogeneous AI computing infrastructure integrating AMD CPUs and GPUs with homegrown neural processing units, as Seoul seeks to give its AI chip industry practical reference models and a path into the global AI computing supply chain.