China's domestic compute chipmaker Hygon Information Technology reported strong earnings growth, underscoring its rising role in China's AI and data center infrastructure buildout

At SEMICON China 2026, Applied Materials and ASML kept a low profile under tightening US export controls, while domestic Chinese suppliers dominated visibility and floor presence

On March 31, Chinese Premier Li Qiang signed Order No. 834 issued by the State Council, which was officially released on April 7 as the Regulations of the State Council on Industrial Chain and Supply Chain Security (hereinafter referred to as the Regulations). The Ministry of Justice released detailed explanations publicly, and the Regulations took immediate effect upon release

Indium phosphide (InP), a critical material for long-distance optical communication, has become essential for AI-driven high-speed data transmission. However, China's export restrictions have triggered a shortage of InP substrates, creating a bottleneck in manufacturers' capacity expansion worldwide. The supply chain acknowledges that due to China's export curbs and the technical challenges of producing InP substrates, major international players remain cautious about increasing investments. The timeline for resolving this shortage remains uncertain

Arm recently unveiled its first self-developed AGI CPU, marking a significant milestone as the company shifts from a pure technology IP licensor to a standard CPU supplier competing directly with Advanced Micro Devices (AMD), Ampere, and Intel

China's auto market is undergoing a structural shift in the first quarter of 2026. While joint-venture giants such as Volkswagen and Toyota have posted strong sales, a deeper divergence is emerging. Domestic manufacturers, adopting a development model closer to consumer electronics and emphasizing vertical integration, are charting a path fundamentally different from the traditional, foreign-led automotive system

The "brain" of a drone plays a critical role in flight missions. While Taiwanese manufacturers have advantages in drone hardware production, integrating the core control systems remains a challenge

Open-source AI agent project OpenClaw, colloquially referred to as "raising lobsters," is gaining momentum in China. The launch of its official China mirror on April 1 is pushing activity beyond developer circles into cloud platforms and major tech firms, turning the project into a focal point for platform competition

Below are the most-read DIGITIMES Asia stories from the week of March 30-April 5, 2026

In recent years, space has emerged as a central arena of global strategic competition, drawing heavy investment from the US, China, Russia, Japan, South Korea, and India. Among them, China has moved aggressively to commercialize its space sector, encouraging private start-ups to develop rockets and satellites while building an independent ecosystem in low-Earth orbit. The aim is to narrow the gap with SpaceX

China's semiconductor equipment market is emerging as a critical growth engine for South Korean suppliers, driven by accelerating AI deployment and tighter restrictions on US vendors. Demand for advanced packaging tools is running ahead of expectations, with high-bandwidth memory (HBM) and 2.5D packaging advancing in tandem as central pillars of future growth. At the same time, Beijing's push for supply chain localization is reshaping competitive dynamics and limiting foreign access

Facing the risk of a prolonged Iran conflict, Samsung Electronics and SK Hynix have reportedly begun strengthening their helium supply chain management for semiconductor manufacturing. Both companies plan to diversify suppliers beyond the Middle East and adjust import ratios by country to maintain stable supply chains

AI data center demand is tightening memory supply while NAND makers phase out low-capacity legacy nodes. Shenzhen Techwinsemi Technology said rising NAND prices are squeezing margins for devices priced near CNY1,000, even as supply shifts create new growth opportunities. The company has secured partnerships with leading Chinese smartphone vendors

The explosive growth in artificial intelligence (AI) servers and high-performance computing (HPC) is driving up the value of key components like ABF substrates. With ongoing bottlenecks in the global supply chain for advanced packaging substrates, South Korea's Samsung Electro-Mechanics (Semco) has proactively restructured its product lineup and increased prices. This move reflects not only rising raw material costs but also a structural shift where demand far exceeds supply