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Monday 6 July 2026
China TPU chipmaker Zhonghao Xinying launches Xuyu AI processor to challenge GPU-based computing

Zhonghao Xinying (Hangzhou) Technology has launched its new self-developed high-performance TPU AI processor, Xuyu, alongside Taize 2.0, a software-hardware integrated AI computing platform built around the chip.

Monday 6 July 2026
Asahi Kasei to expand Taiwan photoresist film capacity for AI chip packaging
Asahi Kasei, one of the notable suppliers of Sunfort dry film photoresist in Japan, has initiated a fab expansion project in Taiwan. The newly established plant is expected to further elevate capacity performance in cutting and processing semiconductor packaging substrates.
Monday 6 July 2026
Samsung Electro-Mechanics, Sumitomo Chemical to form glass-core venture for chip substrates

Samsung Electro-Mechanics signed a final agreement on July 2 with Sumitomo Chemical's Korean subsidiary Dongwoo Fine-Chem to form a joint venture that will produce glass cores, a key material used in next-generation semiconductor package substrates, the companies said.

Saturday 4 July 2026
China's CR Micro raises power chip prices as Chinese suppliers push fresh hikes

China Resources Microelectronics (CR Micro), a Chinese power semiconductor integrated device manufacturer, has notified customers and partners that it will raise prices across its entire product lineup starting July 1, with increases beginning at 15%.

Saturday 4 July 2026
Samsung and SK Hynix seek substrate price cuts for the second half of 2026
Samsung Electronics and SK Hynix are reportedly pressing South Korean semiconductor substrate suppliers to lower prices for the second half of 2026, even as memory demand remains in a Super Cycle. According to ET News, the talks have intensified pressure across the supply chain as raw material costs stay high and substrate makers warn of margin erosion.
Saturday 4 July 2026
Anthropic tightens controls as Chinese firms route around Claude restrictions
Anthropic is stepping up efforts to block unauthorized access to Claude after reports that Chinese companies, including Ant Group and ByteDance, have used overseas entities, cloud services, and VPNs to work around its restrictions. Financial Times reported that the company has increased detection measures as it tries to prevent users in China from reaching its AI tools through indirect channels.
Saturday 4 July 2026
Commentary: Korea's KRW800tn chip bet risks US fab pressure while Apple profits from memory shock
South Korean President Lee Jae-myung, Samsung Electronics, and SK Hynix have announced the country's largest-ever semiconductor expansion plan, while soaring memory prices have opened a separate fight between Micron and Apple.
Friday 3 July 2026
Ubtech's U1 companion robots test whether China is ready for AI intimacy

Ubtech has launched the U1 series, its first mass-produced full-size bionic humanoid robot line, under the U World sub-brand, testing China's market for AI companion robots beyond industrial and service uses.

Friday 3 July 2026
China's polarizer makers seek price hikes as material bottlenecks bite

Chinese polarizer film suppliers are seeking higher prices from panel makers after raw-material and logistics costs rose in the second quarter, exposing a weak point in China's display-material supply chain.

Friday 3 July 2026
China's Z.ai ramps up AI rivalry with Anthropic, OpenAI via GLM-5.2

Chinese AI company Z.ai, also known as Zhipu AI, is escalating its challenge to US leaders Anthropic and OpenAI with the release of its open-weight GLM-5.2 model and a new AI coding assistant, underscoring China's growing competitiveness in frontier AI.

Friday 3 July 2026
South Korea bets on southwest semiconductor cluster, but key hurdles remain
South Korea on June 29 unveiled a large-scale investment plan for the country's Honam region in the southwest, which mainly covers the city of Gwangju and North and South Jeolla provinces, including semiconductor clusters for Samsung Electronics and SK Hynix, AI data centers, and regional infrastructure. The plan is seen as a key move by the South Korean government to respond to surging AI chip demand, excessive industrial concentration in the Seoul capital area, and pressure for balanced regional development.
Friday 3 July 2026
India and Japan deepen economic security ties at New Delhi summit
Japanese Prime Minister Sanae Takaichi held her first summit with Indian Prime Minister Narendra Modi in New Delhi on July 2, during a three-day visit that both governments framed as the next step in a long-running partnership.
Friday 3 July 2026
Samsung escalates South Korea buildout: maps fresh US$90 billion chip, display, battery push in central region

Samsung Group detailed plans on July 2 to invest KRW140 trillion (US$90 billion) in display panels, batteries, chips, and chip materials in South Korea's central Chungcheong region.

Friday 3 July 2026
SK Hynix puts US$64 billion into Cheongju chip buildout
SK Hynix plans to invest KRW100 trillion (approx. US$64.38 billion) to build new NAND memory chip and advanced packaging facilities in Cheongju, betting that AI demand will keep tightening supply for storage and server memory.
Friday 3 July 2026
Samsung eyes marquee AI win as Anthropic explores custom chip beyond Nvidia

Anthropic is exploring a custom AI chip and has held talks with Samsung Electronics as a potential manufacturing partner, joining OpenAI, Google, Amazon, Microsoft and Meta in the race to control AI infrastructure.