CONNECT WITH US
Friday 4 September 2026
Taiwan to expand industrial land for AI hardware boom
Taiwan's government says it will expand industrial land development to meet surging demand for AI infrastructure hardware, as global suppliers race to add capacity through 2027...
LATEST STORIES
Monday 7 September 2026
NEC reportedly ends quantum computer hardware development, shifts focus to annealing
Japan's NEC has halted development of gate-based quantum-computer hardware, marking a strategic retreat from a field the company helped pioneer, while continuing to invest in quantum annealing and quantum-inspired computing services.
Monday 7 September 2026
DeepSeek plans to buy 160,000 Huawei chips as China aims to wean itself off Nvidia
DeepSeek is reportedly planning to purchase 160,000 Huawei chips for its large 1 GW data center currently under construction in the Chinese province of Inner Mongolia. This would make it among the largest clusters of Huawei chips deployed to date, as the Chinese authorities attempt to wean the country off Nvidia chips, but still struggle with insufficient domestic manufacturing capacity.
Monday 7 September 2026
China's power battery sector maintains strong growth momentum as global market presence expands
China's power battery industry has reported robust growth through the first seven months of 2026, driven by rising demand across both electric vehicles and stationary energy storage applications. According to the latest data from the Ministry of Industry and Information Technology of the People's Republic of China (MIIT), cumulative sales of power batteries reached 790.4 gigawatt-hours (GWh) between January and July, representing a 37.1% year-over-year increase.
Monday 7 September 2026
SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E
SK Hynix is accelerating its shift to sixth-generation 10nm-class 1c DRAM, with the process expected to account for roughly 34% of its DRAM production by the fourth quarter as the company prepares for HBM4E and seeks greater cost efficiency.
Monday 7 September 2026
Naura 3D DRAM etching breakthrough could give CXMT a new path beyond EUV
China's Naura Technology has demonstrated a selective etching process for 64-layer 3D DRAM structures, potentially giving domestic memory makers another route to raise transistor density while access to advanced EUV lithography remains restricted.
Monday 7 September 2026
India says it cannot build electronics without China and has started easing the rules to prove it
India is selling its semiconductor build-out abroad as a hedge against an over-concentrated supply chain. The officials running it are unusually candid that the hedge cannot be built without the country it hedges against. Asked at a media briefing in Taipei on 4 September how New Delhi views the role of Chinese companies in India's chip and electronics supply chain, S. Krishnan, secretary of India's Ministry of Electronics and Information Technology, opened with a line that would be politically awkward in most capitals: "We need to be realistic."
Monday 7 September 2026
Huawei Kirin 2026 challenges 3D chip heat limits with Tau Scaling Law
Huawei is using measured data from its upcoming Kirin 2026 processor to challenge a key concern around vertically stacked logic: that higher transistor density inevitably brings more heat.
Monday 7 September 2026
Every Chinese CPU maker grew in 1H26 but only one grew on processors
Revenue rose at every Chinese chip company examined in the first half of 2026 amid the domestic-substitution push, but the interim filings show three quite different businesses hiding under one label. One has reached real scale and is now funding its expansion from the balance sheet rather than from operations. One is repairing its margins on a genuinely homegrown instruction set at a fraction of the scale. And the cohort's most spectacular profit number is not a processor story at all.
Monday 7 September 2026
China's JCET seeks US$968M for AI-driven packaging expansion

JCET Group is preparing a CNY6.5 billion (approx. US$968 million) private share placement to expand advanced packaging and testing capacity across high-performance computing (HPC), power modules, wafer-level packaging and memory, sharpening its exposure to AI infrastructure and China's domestic semiconductor supply chain.

Monday 7 September 2026
Exclusive: DIGITIMES' top 3 at K-Safety Expo 2026 shows where intelligent safety is heading — act 'before' disaster strikes
The most consequential safety technologies are often judged by what happens after something goes wrong: how fast an alarm sounds, how quickly rescuers arrive, or how effectively protective equipment limits injury.
Sunday 6 September 2026
K-Safety Expo 2026: Safety gets smarter as six innovators win foreign media honors
The BEST OF K-SAFETY EXPO Global Media Awards on September 3 offered a revealing snapshot of where safety technology is heading: away from passive protection and toward systems that can sense danger, interpret it, and increasingly act before humans intervene.
Sunday 6 September 2026
Hanmi's 2.5D bonders pass Taiwan foundry qualification as packaging outsourcing expands
South Korea's Hanmi Semiconductor has reportedly begun supplying 2.5D packaging bonders to an unnamed Taiwanese foundry after the equipment passed mass-production qualification, giving the company an important production foothold as Taiwan's advanced-packaging supply chain expands beyond foundry-owned lines.
Sunday 6 September 2026
K-Safety Expo 2026: Beyond AI, Korea re-engineers the human layer of industrial safety
Not every safety breakthrough spotted across the K-Safety Expo 2026 floor in Busan came with an AI camera attached.
Saturday 5 September 2026
Exclusive: South Korea's safety AI boom is being built from the top down, BEXCO says
South Korea's safety-tech sector may be increasingly filled with AI cameras, robots, drones, and predictive systems, but BEXCO general manager Tom Choi argues that the force pushing many of those technologies toward actual deployment begins somewhere less glamorous: government policy.
Saturday 5 September 2026
Samsung, SK chiefs to meet Nvidia's Huang in New York amid US investment pressure
Samsung Electronics Chairman Jay Y. Lee and SK Group Chairman Tae-won Chey are traveling to New York at the end of September 2026 to meet Nvidia CEO Jensen Huang again as Washington presses South Korean companies to expand US investment. The planned trip is drawing market attention because Samsung Electronics and SK Hynix are already pursuing large-scale spending in the US and could discuss further business ties on the sidelines of the event.