CONNECT WITH US
Wednesday 16 September 2026
Nvidia's Jensen Huang expected to attend Trump-Xi Summit as tech and trade take center stage
US President Donald Trump and Chinese President Xi Jinping are scheduled to meet on September 24 in Washington for a state dinner now dubbed the "G2 Summit". The meeting follows a turbulent economic period marked by an April 2025 tariff surge where both nations raised levies above 100% before reaching a temporary stalemate...
LATEST STORIES
Thursday 17 September 2026
Samsung looks to outside suppliers as HBM boom shifts priorities
Samsung Electronics has long benefited from a level of vertical integration few technology companies can match, spanning smartphones, memory, chip design, foundry manufacturing and packaging. However, recent sourcing moves suggest those internal links are becoming more selective as individual businesses pursue their own customers, margins and capacity priorities.
Thursday 17 September 2026
Huawei's 3D data center redesign targets the next AI compute density wall
Huawei has unveiled what it calls the world's first 3D data center, introducing a vertically stacked four-layer architecture designed for increasingly dense AI computing clusters and gigawatt-scale infrastructure.
Thursday 17 September 2026
Huawei aims to become 'China's Nvidia,' rules out building satellites or spacecraft

Huawei's internal Heart Voice Community recently published minutes from a discussion between Guo Ping, chairman of Huawei's supervisory board, and newly hired employees, offering a glimpse into the company's ambitions in AI, computing, semiconductors, and future technologies.

Wednesday 16 September 2026
Analysis: Jensen Huang is in Trump's ear; what it means for Taiwan's chip supply chain
"The narrative is much more practical," Nvidia CEO Jensen Huang said of China's approach to artificial intelligence (AI) at the All-In Summit 2026, contrasting it with US warnings about AI bringing civilization to an end.
Wednesday 16 September 2026
SK Hynix union approves revised pay deal after 25-vote rejection

SK Hynix's production workers' union has approved a revised pay agreement that raises the cash share of employee profit-sharing bonuses, ending weeks of uncertainty after members rejected the previous proposal by just 25 votes.

Wednesday 16 September 2026
SK Hynix, Intel in talks on US production to ease memory crunch
SK Hynix is in talks with Intel about a potential deal that could give the South Korean company its first memory chip manufacturing operation in the US, as tight supply pushes customers and governments to secure more domestic capacity.
Wednesday 16 September 2026
Apple reportedly accepts Samsung's 1Q27 memory hike, raising the 2027 smartphone cost floor
Apple's acceptance of sharply higher Samsung Electronics memory prices for early 2027 is putting a number on the cost of the AI boom for smartphones. The reported agreement comes just days after Apple limited the iPhone 18 Pro price increase to US$100, highlighting its willingness to absorb part of a historic rise in memory costs to defend shipments and market position.
Wednesday 16 September 2026
Hanmi Semiconductor reportedly lands first back-end foothold at Terafab
Hanmi Semiconductor has reportedly secured an order to supply advanced packaging equipment to Elon Musk's Terafab, marking the first known entry by a South Korean back-end equipment supplier into the planned US semiconductor megaproject.
Wednesday 16 September 2026
Huawei reportedly scales back AITO role as Seres takes greater control
Huawei and Seres, a Chongqing-based premium manufacturer of high-end electric NEVs, are reportedly adjusting their smart vehicle partnership in the AITO brand. Huawei would shift toward a more asset-light role, and Seres would take greater control over AITO's product, marketing, sales, and service operations.
Wednesday 16 September 2026
Apple, Intel links sharpen focus on Lens Technology's next glass growth markets
Lens Technology is pushing its precision-glass expertise into two higher-value markets that could reshape its growth profile: Apple-linked foldable devices and Intel-linked through-glass-via (TGV) substrates.
Wednesday 16 September 2026
South Korean NPU startups face validation hurdle in push for global sales

South Korea's neural processing unit (NPU) startups are moving from chip development toward commercial deployment, but limited experience operating at scale remains a major hurdle to winning global customers.

Wednesday 16 September 2026
China's humanoid robot race, Part 2: Upstream profits gather around dexterous hands
Humanoid robot makers are cutting prices and scaling production, yet much of the industry remains unprofitable. Upstream suppliers are starting to show a different economics — especially in dexterous robotic hands.
Wednesday 16 September 2026
DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies

SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with the HBM4E generation, a move that could reduce its reliance on TSMC and give the memory maker greater supply and cost flexibility.

Tuesday 15 September 2026
Tesla's rare-earth-free Cybercab challenges China's grip on EV magnets
With Tesla's EV ambitions growing amid a years-long push toward full electrification, the deployment of the Cybercab has emerged as a major experiment testing the boundaries of autonomous driving.
Tuesday 15 September 2026
Apple's foldable debut set to further widen Samsung Display's OLED lead
Samsung Display could emerge as one of the biggest supply-chain beneficiaries of Apple's entry into foldable smartphones, as the Korean panel maker already accounts for about two-thirds of global foldable smartphone panel shipments, with Apple set to become a major new source of demand.