After more than a decade away, Apple may be preparing to return to the enterprise server market. According to The Information, as reported by Reuters, the company is developing an enterprise AI server powered by its planned M8 Ultra chip and has discussed adopting Nvidia's NVLink Fusion interconnect technology.
Huawei founder Zhengfei Ren made a public appearance in Shenzhen on September 22 for talks with Dongfeng Motor general manager Changjun Feng that also included other Huawei executives. The two sides discussed deeper strategic cooperation in smart vehicles, alongside coordinated product development and technology innovation.
Chinese President Xi Jinping's visit to the US is heightening anxiety across the global auto industry, where suppliers, dealers, and lawmakers fear it could open the door to Chinese carmakers in America. For readers worldwide, the issue matters because it could reshape EV pricing, supply chains, jobs, and trade tensions far beyond the US market.
Japan's Leading-edge Semiconductor Technology Center (LSTC) is building a public-private-academic framework around Rapidus, which plans to mass-produce 2-nanometer chips in 2027, to advance next-generation semiconductor research and talent development and give Japan a unique edge in the global race for advanced process technology.
When Chinese President Xi Jinping meets US President Donald Trump at the White House on September 24, trade will be the most measurable front of their rivalry. Since the first Section 301 tariffs took effect in July 2018, US imports of Chinese technology hardware have fallen sharply. Rare earth magnets are the exception: Washington cannot easily replace them, which gives Beijing leverage as the one-year Busan truce nears its November 10 expiry.
Biwin Storage Technology plans to invest CNY4.5 billion (approx. US$672 million) in the third phase of its wafer-level advanced packaging and testing project, expanding 2.5D integration and compute-memory co-packaging capacity as AI and high-performance computing lift demand for advanced packaging.
