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Wednesday 20 May 2026
AMD makes history with first overseas AI DevDay in Shanghai, targeting deeper China partnerships
Advanced Micro Devices (AMD) chair and CEO Lisa Su led the company's China team in Shanghai for AMD AI DevDay 2026 on May 19. The event marks the first time it has been held outside the US, drawing large crowds of Chinese artificial intelligence (AI) developers, supply chain partners, and corporate customers
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Thursday 21 May 2026
SK Hynix reportedly shifts Cheongju mask fab toward HBM yield push
SK Hynix is reportedly moving to reshape part of its Cheongju campus around wafer testing, a shift that underscores how high-bandwidth memory, or HBM, is putting new pressure on the back end of the chipmaking process
Thursday 21 May 2026
China uses iron-fist policies to expel inefficient TOPCon capacity from solar supply chain
China's top-down policies are creating a tech elimination battle in its solar supply chain. Because of severe oversupply in the mainstream N-type tunnel oxide passivated contact (TOPCon) technology, combined with intensifying internal competition and price-cutting wars, the overall solar industry is on a downfall. For TOPCon companies suffering long-term losses and struggling to survive, the Chinese government has directly ordered local governments to "prohibit bailouts," therefore accelerating industry reshuffling and the elimination of inefficient production capacity
Thursday 21 May 2026
Exclusive: TOPCon faces funding cuts while HJT and BC receive government support
As China's solar market enters a downfall, market sources indicate that China's central government is reshaping the industry landscape through an aggressive dual-track strategy. On one hand, authorities continue tightening funding for the mainstream tunnel oxide passivated contact (TOPCon) technology. On the other hand, they are launching targeted national-level support measures for higher-efficiency next-generation technologies such as heterojunction (HJT) and back-contact (BC)
Thursday 21 May 2026
Commentary: China builds its memory twin engines; IPO push for YMTC, CXMT intensifies

China's memory chip industry is entering a critical capital markets phase, with YMTC formally launching IPO counselling and CXMT resuming its STAR Market listing review after updating its prospectus. The parallel moves mark an accelerated push by China's two leading memory chipmakers to secure long-term funding and expand their role in the global semiconductor industry

Thursday 21 May 2026
Samsung labor dispute adds pressure to memory chip market
Surging demand for AI data center infrastructure has already pushed the memory market into a structural shortage. Now, Samsung Electronics' labor dispute is adding another layer of uncertainty for DRAM and NAND Flash prices
Thursday 21 May 2026
How South Korea is pitching itself to Silicon Valley's startup elite
South Korea made its case to Silicon Valley investors and startups on the first day of the Plug and Play May Summit in Sunnyvale, positioning Seoul not as an emerging market but as a fully operational launch pad for global technology products
Thursday 21 May 2026
Nvidia excludes China from its outlook while citing analyst estimates of US$1 trillion in hyperscaler capex by 2027
Nvidia continues to exclude Chinese data center compute revenue from its outlook, with CFO Colette Kress citing uncertainty around whether H200 imports will be allowed into the country despite recent US export license approvals
Thursday 21 May 2026
South Korea bets on KIST, LG to catch up in humanoid robots
South Korea has launched a five-year public-private project to build a domestic AI humanoid robot platform, bringing together KIST, LG affiliates, universities, and a hospital as the country looks to narrow the gap with the US and China in next-generation robotics
Thursday 21 May 2026
Moonshot AI abandons offshore structure to pursue landmark Hong Kong IPO

Moonshot AI, the Beijing-based generative AI unicorn behind the widely popular Kimi chatbot, has informed its shareholders that it intends to dismantle its offshore corporate framework to clear a regulatory path for an initial public offering (IPO), likely in Hong Kong

Thursday 21 May 2026
US targets Hua Hong's 7nm nodes while China targets South Korean partners to evade sanctions

The US Department of Commerce (DOC) has reportedly issued "is-informed" letters to several major wafer fab equipment (WFE) manufacturers, ordering an immediate halt to tool shipments destined for Hua Hong Semiconductor, China's second-largest foundry. The restrictions specifically target two facilities within the Hua Hong Group, including its subsidiary Huali Microelectronics, which US officials believe are being positioned to scale China's most sophisticated logic nodes

Thursday 21 May 2026
SMIC, Hua Hong form materials supply platform to cut China chip chain reliance on US

China's semiconductor self-sufficiency drive has taken another step forward, with SMIC and Hua Hong Group jointly establishing Shanghai Electronic Materials International Supply Chain, in what market observers view as more than a conventional materials procurement platform

Thursday 21 May 2026
China memory supplier Biwin's AI photonics funding raises questions about strategy and risk
China's AI infrastructure race is entering a new phase, with industry focus shifting from raw computing power toward data transmission efficiency
Thursday 21 May 2026
Analysis: Lens Technology seeks control of Ju Teng to expand beyond Apple
Lens Technology's bid for control of Ju Teng International Holdings is putting renewed focus on changes in the notebook supply chain, as the Chinese supplier seeks to reduce its reliance on Apple and broaden its product portfolio
Thursday 21 May 2026
Samsung averts strike with last-minute labor deal, but deeper divisions remain
With less than an hour remaining before a planned strike was set to begin, Samsung Electronics and its labor union reached a tentative agreement late on May 20, narrowly avoiding what industry observers estimated could have triggered supply-chain disruptions worth more than KRW100 trillion (approx. US$66.8 billion)
Wednesday 20 May 2026
Alibaba's T-Head doubles down on AI infrastructure with Zhenwu M890
Alibaba Cloud has unveiled the Zhenwu M890, a new proprietary AI training and inference chip developed by its semiconductor subsidiary T-Head Semiconductor, as the Chinese cloud group accelerates its push into full-stack AI infrastructure for the agentic AI era