Samsung Electronics is slowing its investment schedule for 1d DRAM, the seventh-generation 10nm-class DRAM node, as a sharp surge in memory prices makes it more profitable to squeeze output from existing production lines than to rush costly next-generation processes to market, The Bell reported on June 23.

LG Chem is discussing whether to expand production of copper-clad laminate, or CCL, a core material used in semiconductor packaging, as demand tied to artificial intelligence chips accelerates, Herald Business reported.

China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic substitution are driving a new capacity cycle.

Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers, ETNews and Yonhap reported.

Samsung Group is expected to announce a domestic investment plan worth more than KRW1,000 trillion (approx. US$648 billion) on June 29, when South Korean President Lee Jae-myung chairs a public briefing at the presidential office in Seoul on what his administration is calling the country's "three mega-projects for a great leap forward," Maeil Business Newspaper reported.

SK Hynix is racing to complete the first cleanroom at its massive Yongin Semiconductor Cluster in Gyeonggi Province, South Korea, by February 2027, ahead of rival capacity expansion timelines. The site's first fabrication facility will break from conventional flat-floor layouts, stacking production floors three levels high in a pioneering triple-deck fab design.