Artificial intelligence (AI) is reshaping the global semiconductor supply chain and accelerating transformation in IC packaging and testing. As Qualcomm moves into the AI data center space to challenge Nvidia, OSAT vendors are entering a new phase of technology upgrade and supply-chain reorganization

Over the past decade, China's tech sector has surged across chip design, foundry, and packaging. Yet beneath the slogan of "technological self-reliance", two corporate storms have laid bare the contradictions between global ambition and domestic control, exposing the limits of China's bid to lead the semiconductor world on its own terms

Following an internal R&D overhaul, Intel has rolled out its application-specific integrated circuit (ASIC) business to establish a fresh revenue stream beyond CPUs and GPUs. The company is banking on decades of x86 IP accumulation and its integrated device manufacturer (IDM) model to challenge top IC design rivals such as Nvidia, AMD, Broadcom, Marvell, MediaTek, and Alchip

As the APEC summit in late October approaches, US President Donald Trump aims to broker a historic China-US trade deal and push for a Russia-Ukraine ceasefire. However, stalled negotiations have raised concerns that Taiwan could become a bargaining chip between Washington and Beijing