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Tuesday 29 September 2026
Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win
In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC advanced packaging executive, reflected on the early development of CoWoS...
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Monday 28 September 2026
Column: For physical AI, maps are turning into memory
A robot that can map a factory floor still cannot necessarily find the box it has been asked to move, or remember what it saw on its last visit. For autonomous robots, building the map is increasingly just the beginning. What comes next — searching for objects, navigating to specified locations, remembering what the robot has seen, and retrieving that information for model reasoning in complex environments — is where the new applications and challenges lie.
Saturday 26 September 2026
DIGITIMES Insight: China's memory makers seek scale, funding to close the gap with global leaders
China's two leading memory suppliers are moving to raise capital and expand output as demand for chips grows, a shift that could reshape the country's domestic supply chain. Their efforts reflect a new stage for the sector, but the long-term test will be whether fresh funding can translate into stronger technology, higher yields, and wider customer adoption.
Saturday 26 September 2026
Interview: Taiwan's H2U helps companies manage employee health with AI, eyes third markets with South Korea
When companies discuss ESG, they often emphasize environmental issues and compliance while paying less attention to employee health, a key component of the social dimension, according to Saxon Chen, founder and CEO of Taiwanese digital health technology company H2U Corp.
Friday 25 September 2026
Interview: GMI Cloud bets on Taiwan as a proving ground for global AI expansion
GMI Cloud is making Taiwan a key part of its global AI infrastructure expansion, with a US$500 million investment in an AI factory powered by Nvidia's Blackwell GPUs. Announced in late 2025, the facility is expected to deploy roughly 7,000 GPUs and serve customers including Trend Micro and Wistron.
Friday 25 September 2026
From ISM 1.0 to Semicon 2.0—India's chip subsidy overhaul draws early interest, raises the bar for investors
India's new semiconductor incentive regime is putting more capital at risk for manufacturers, but the first wave of investment commitments suggests lower subsidies have not stopped companies from considering fresh projects.
Thursday 24 September 2026
Commentary: Apple's M8 Ultra AI server plan could pull Apple Silicon into Nvidia's enterprise infrastructure game
After more than a decade away, Apple may be preparing to return to the enterprise server market. According to The Information, as reported by Reuters, the company is developing an enterprise AI server powered by its planned M8 Ultra chip and has discussed adopting Nvidia's NVLink Fusion interconnect technology.
Thursday 24 September 2026
Trump-Xi pre-summit watch: H20 setbacks and Ascend gains reshape China's Nvidia calculus
Ahead of the Trump-Xi summit, the key semiconductor question is no longer simply how much Nvidia hardware Washington will allow China to buy.
Thursday 24 September 2026
Trump-Xi pre-summit watch: China charts a sovereignty-first path for frontier AI
When Donald Trump and Xi Jinping discuss artificial intelligence, the deeper divide may not be over whether AI needs rules, but over what those rules are designed to protect.
Wednesday 23 September 2026
Commentary: Zhengfei Ren rumors expose a deeper chill across China's tech sector
Online rumors that Huawei founder Zhengfei Ren and his family had disappeared from public view have reignited concern over the fate of Chinese technology executives. Ren's younger daughter, Annabel Yao, appeared at a Beijing press conference on September 14, but China's new exit-and-entry rules took effect the next day, drawing fresh attention to executives who have fled, vanished, or faced restrictions.
Wednesday 23 September 2026
Analysis: Foxconn's EV push moves beyond demo and toward scale
Foxconn Group's electric vehicle business is entering a new phase as it shifts from proving the concept to preparing for mass production and wider regional expansion. The change could reshape Taiwan's auto industry and strengthen Foxconn's case as a cross-border EV manufacturer with ambitions far beyond its home market.
Tuesday 22 September 2026
Analysis: Will AI glasses replace the iPhone? —Cook and Ternus see it differently
Following Apple's executive transition, former CEO Tim Cook and new chief John Ternus have presented contrasting visions for the next generation of mobile devices, spotlighting a key strategic divide as the company prepares for the post-iPhone era.
Tuesday 22 September 2026
DIGITIMES Insight: Full-color Micro LED set to exceed 30% of AR glasses shipments in 2027
The industry has converged on a single precondition for consumer adoption of augmented reality (AR) glasses: the product must look like ordinary eyewear. The China International Optoelectronic Exposition (CIOE) 2026 showed how differently the two critical component groups — microdisplays and waveguides — are responding to that constraint. Microdisplay makers are trading away a modest amount of resolution for smaller Micro LED panel areas, pushing light engines below 0.1cc, and pairing those engines with geometric, surface-relief, and volume-holographic waveguides from multiple suppliers to demonstrate complete near-eye modules and, in some cases, complete glasses. Taken together, the show indicates that AR display technology has reached a workable level of maturity.
Monday 21 September 2026
Column: AI usage patterns may be shifting the case for self-hosted servers
A new Anthropic threat intelligence report offers an unusual glimpse into how advanced AI systems are being used under heavy, real-world workloads. The findings suggest that the decision to buy or host AI servers may depend less on model quality alone, and more on which tasks consume tokens, how long they run, and how much operational state they must preserve.
Monday 21 September 2026
DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment
DIGITIMES Intelligence has observed that as the performance of AI accelerators and server CPUs continues to advance, chips are increasing not only in compute core counts and I/O channels but also in integration complexity. Higher integration of high-bandwidth memory (HBM), high-speed SerDes, and chiplet designs makes signal transmission, power delivery, and component interconnects within the package far more complex, driving high-end IC substrates toward larger surface areas and higher layer counts.
Monday 21 September 2026
Analysis: The race to superintelligence meets a demand for restraint — and the industry is split
The extraordinary technological progress humanity has witnessed since AI first emerged has propelled a fundamental shift in industrial development. With experts hailing AI as the next phase of the digital revolution and an extension of Industry 4.0, the technology is increasingly reshaping how industries operate.