Hanmi to launch Wide TC Bonder for HBM5 high stacking in 2026
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AWS pledges US$9 billion for AI expansion in South Korea, eyeing agentic AI leadership
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BOE ramps up 8.6-gen OLED mass production to challenge SDC
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Trump's trade policies trigger Taiwan's US$400 billion US investment surge
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ASE unveils AI-enhanced IDE 2.0 to accelerate chip design and packaging
3min ago in Semiconductors
Automotive lenses drive growth for optical companies
3min ago in Electric Vehicles
Foxconn expects 4Q25 growth as AI servers, ICT products drive demand
3min ago in ICT
CHT Security posts record revenue, profit in 3Q25 with growth across three key margins
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LG Electronics reportedly eyes local manufacturing in India for capital goods
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“Call the mayor”: Jensen Huang’s Computex quip triggers a months-long land tussle for Nvidia’s Taipei HQ
18min ago in Semiconductors
Samsung foundry partners with Anaflash to launch AI MCU, signaling turnaround
Nov 6, 17:42 in Tomorrow's Headlines
SK Telecom's new leadership double down on AI infrastructure as strategic focus
Nov 6, 17:42 in Tomorrow's Headlines
Volkswagen China launches first SOC chip for L3 autonomous driving
Nov 6, 17:42 in Tomorrow's Headlines
CXMT plans to mass-produce HBM3 using MR-MUF technology in 2026
Nov 6, 17:42 in Tomorrow's Headlines
Memory price surge pressures Chinese smartphone makers amid supply tightness
Nov 6, 17:42 in Tomorrow's Headlines
Taiwan's AI-driven exports to US raise concerns over potential currency appreciation
Nov 6, 17:42 in Tomorrow's Headlines