Comments from readers
EDN, December 18; Steve Shen, DIGITIMES Asia
Thursday 18 December 2008
Add your comments
We have recently changed our search engine. Check the Advanced options to learn the new search rules.
- Musk says chip capacity will decide winner of AI race (Mar 21) - EE Times
- Google taps MediaTek for cheaper AI chips (Mar 17) - The Information
- European project gets $260 million for HPC chip sovereignty (Mar 6) - EE Times
- The trouble with MAGA's chipmaking dreams (Mar 3) - Economist
- Automotive chips: Gloom and doom or boom by 2030? (Feb 14) - EE Times
- Deepseek is more Wall Street than Silicon Valley (Feb 3) - Culpium, by Tim Culpan
- Tech CEOs try to reassure Wall Street after DeepSeek shock (Jan 30) - Wall Street Journal
- TSMC to make chips for cryptominer Bitdeer at new US fab (Jan 17) - Culpium, by Tim Culpan
![]()
Exclusive: Ex-TSMC R&D VP on advanced packaging and Morris Chang's visionDouglas Yu, former TSMC R&D vice president, highlighted the development of TSMC's 3D Fabric platform,...
![]()
DIGITIMES 3Q25 EMS/ODM revenue rankingsWe reviewed each company's core business, collected lists of EMS/ODM companies across countries, removed unlisted companies and those without public...
Global data center AI chip packaging market forecast, 2024-2030
Special 20% off early bird sales, the price will go back after 1/15
The ongoing rise of generative AI is driving...
Global semiconductor IDM investment in ASEAN
Global semiconductor IDMs continue to invest in back-end processes in ASEAN; Western firms are more aggressive than Japanese...
Switch 2 hardware and competition status
The Switch 2 launches strongly, shaking up the industry landscape as Nintendo takes on the dual giants Sony and Microsoft
Posted on Dec 18, 13:09
That's easy to fix. Winbond can buy the world-class German R&D department after Qimonda files for bankruptcy. The Taiwan government can provide the financing. Winbond can even add GDDR3, GDDR5, and XDR to its product portfolio.