Major chip vendors have been striving for support from production partners, and Qualcomm reportedly will even appoint a VP dedicated fully to working to secure capacity in Taiwan. Qualcomm and MediaTek are also said to be both stepping up orders for BT substrates to faciliate their shipments of 5G handset APs and mmWave AiP modules. In the server sector, the frigid weather striking Texas and some parts of Mexico has disrupted production at ODMs, but demand in 2021 will remain robust.
Qualcomm gearing up to cement capacity support from Taiwan partners: Qualcomm has been gearing up to seek multiple supply sources for both silicon-based and III-V semiconductors amid increasingly tight capacity at the global IC value chain, and reportedly will install one vice president working exclusively to cement support from production partners in Taiwan, according to industry sources.
Chipmakers placing extra orders for BT substrates amid tight supply: As supply of high-end BT substrates has turned tight in the first quarter of 2021, major chipmakers including Qualcomm and MediaTek are moving aggressively to secure more capacity support from Taiwan IC substrate makers to meet increasing demand for 5G handset APs and mmWave AiP modules in the months ahead, according to industry sources.
Server supply from North America disrupted by cold weather: Server supply from Mexico, a major production hub for Taiwanese ODMs, is expected to be undermined by the recent frigid weather hitting the northern part of the country and the US state of Texas, according to sources from the upstream server supply chain.
