Bits + chips
Unimicron to spend NT$6-7 billion for capacity ramp in 2011
Olivia Hu, Taipei; Steve Shen, DIGITIMES

Unimicron Technology will invest NT$6-7 billion (US$207-241 million) to ramp up its capacity for HDI boards and flip-chip chip-scale packaging (FC CSP) substrates in 2011 to meet increasing demand from the smartphone and tablet PC sectors, according...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.