Monday 13 May 2019
Unimicron to pour US$20 billion into FC substrate biz over next 4 years
Unimicron Technology has disclosed plans to invest a total of NT$20 billion (US$644.7 million) in R&D and expanding production capacity for advanced flip-chip (FC) substrates...
Wednesday 5 September 2018
FCBGA substrate supply tight on packaging demand for pre-5G chips
Taiwan IC backend service firms have seen increasing flip-chip packaging orders from China chipmaker HiSilicon now actively carrying out volume production of pre-5G chip products,...
Wednesday 3 September 2014
Niching looks to ramp up LED leadframe and FC CSP substrate shipments in 2015
IC packaging material and tool distributor Niching Industrial looks to ramp up its shipments of EMC-based (epoxy molding compound) LED leadframes and FC CSP substrates to drive revenue...
Thursday 4 July 2013
Machvision reports on-year revenue growth for June
PCB and IC substrate inspection equipment maker Machvision has reported consolidated revenues of NT$80.29 million (US$2.68 million) for June, up 13.9% sequentially and 79.8% on year...
Wednesday 20 July 2011
Kinsus Interconnect reports strong IC substrate orders for July-August
IC-packaging substrate maker Kinsus Interconnect Technology has stated that it has landed sufficient orders for July and August with order momentum to further strengthen onward month...
Wednesday 20 July 2011
Strong growth for semiconductor equipment in advanced packaging market, says Information Network
Advanced packaging is currently growing at a 18% compound annual rate, and equipment manufacturers will be major beneficiaries, according to market research firm The Information Ne...
Friday 20 May 2011
NPC to ramp up CPU-use FC substrate output
Nan Ya PCB (NPC) will be able to grow its output of flip-chip (FC) substrates for Intel's x86 CPUs later in the second quarter of 2011, on the strength of improved yields, according...
Tuesday 26 April 2011
Nan Ya PCB looks to strong performance in 2Q11
Nan Ya PCB expects its second-quarter 2011 performance to be stronger than the first-quarter's due to a pick-up in orders from the IT segment as well as an improvement of yield rates...
Monday 31 January 2011
Unimicron to spend NT$6-7 billion for capacity ramp in 2011
Unimicron Technology will invest NT$6-7 billion (US$207-241 million) to ramp up its capacity for HDI boards and flip-chip chip-scale packaging (FC CSP) substrates in 2011 to meet...
Monday 10 January 2011
Nan Ya PCB sampling FC substrates for new Intel platform
Taiwan's Nan Ya PCB (NPC) has begun sampling six- to 12-layer flip-chip (FC) substrates for Intel's recently-announced Sandy Bridge processors, as well as Japan-based Ibiden Electronics...
Tuesday 14 December 2010
STATS ChipPAC sees over 50% growth in flip chip business
STATS ChipPAC has seen its flip chip business grow more than 50% in 2010 compared to 2009, according to the company, adding that shipments of flip chip packages have surpassed 250...
Friday 5 November 2010
Nanya PCB October sales grow 6% on month
Buoyed by rising demand for PCBs used in consumer electronics products, and CPU-use flip-chip (FC) substrates, Nanya PCB (NPC) saw October 2010 revenues increase 6.04% sequentially...
Thursday 21 October 2010
Nanya PCB to get more FC substrate backend orders from Intel on better yields
Nanya PCB (NPC) is actively improving its production yield rates for CPU-use flip-chip (FC) substrate packaging in order to gain a larger share of orders from Intel, according to...
Tuesday 22 June 2010
Nanya PCB to expand FC substrate capacity by 30%
Nanya PCB (NPC) has announced plans to boost its monthly output of flip-chip (FC) substrates to 40 million units by the end of 2010, up from the current level of 30 million units...
Monday 21 June 2010
PCB maker Unimicron raises 2Q10 revenue guidance
PCB and IC substrate maker Unimicron Technology has revised upward its second-quarter revenues guidance to a sequential 15-20% growth from a 10% growth projected previously thanks...
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