Unimicron Technology has disclosed plans to invest a total of NT$20 billion (US$644.7 million) in R&D and expanding production capacity for advanced flip-chip (FC) substrates...
Taiwan IC backend service firms have seen increasing flip-chip packaging orders from China chipmaker HiSilicon now actively carrying out volume production of pre-5G chip products,...
IC packaging material and tool distributor Niching Industrial looks to ramp up its shipments of EMC-based (epoxy molding compound) LED leadframes and FC CSP substrates to drive revenue...
PCB and IC substrate inspection equipment maker Machvision has reported consolidated revenues of NT$80.29 million (US$2.68 million) for June, up 13.9% sequentially and 79.8% on year...
IC-packaging substrate maker Kinsus Interconnect Technology has stated that it has landed sufficient orders for July and August with order momentum to further strengthen onward month...
Advanced packaging is currently growing at a 18% compound annual rate, and equipment manufacturers will be major beneficiaries, according to market research firm The Information Ne...
Nan Ya PCB (NPC) will be able to grow its output of flip-chip (FC) substrates for Intel's x86 CPUs later in the second quarter of 2011, on the strength of improved yields, according...
Nan Ya PCB expects its second-quarter 2011 performance to be stronger than the first-quarter's due to a pick-up in orders from the IT segment as well as an improvement of yield rates...
Unimicron Technology will invest NT$6-7 billion (US$207-241 million) to ramp up its capacity for HDI boards and flip-chip chip-scale packaging (FC CSP) substrates in 2011 to meet...
Taiwan's Nan Ya PCB (NPC) has begun sampling six- to 12-layer flip-chip (FC) substrates for Intel's recently-announced Sandy Bridge processors, as well as Japan-based Ibiden Electronics...
STATS ChipPAC has seen its flip chip business grow more than 50% in 2010 compared to 2009, according to the company, adding that shipments of flip chip packages have surpassed 250...
Buoyed by rising demand for PCBs used in consumer electronics products, and CPU-use flip-chip (FC) substrates, Nanya PCB (NPC) saw October 2010 revenues increase 6.04% sequentially...
Nanya PCB (NPC) is actively improving its production yield rates for CPU-use flip-chip (FC) substrate packaging in order to gain a larger share of orders from Intel, according to...
Nanya PCB (NPC) has announced plans to boost its monthly output of flip-chip (FC) substrates to 40 million units by the end of 2010, up from the current level of 30 million units...
PCB and IC substrate maker Unimicron Technology has revised upward its second-quarter revenues guidance to a sequential 15-20% growth from a 10% growth projected previously thanks...
