Status of global wafer foundry industry, 2023

Strategize Confidently with Insights into Samsung

Compal reportedly to make ultra-thin notebook for Dell, says paper

Commercial Times, April 15; Joseph Tsai, DIGITIMES Asia Wednesday 15 April 2009 0

Compal Electronics has landed ultra-thin notebook orders using Intel's CULV CPUs from Dell which are expected to start shipping in August, according to a Chinese-language Commercial Times report citing sources at component makers.

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