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Nov 3
Oracle to sell US$20 billion in stocks and bonds as concerns grow over debt-fueled expansion
Oracle aims to raise US$20 billion through selling stock and issuing bonds to fund its AI build-out. Its stock value dropped after the company filed the plans, a sign that investors are growing wary of hyperscalers' increasing debt before anticipated AI revenues trickle in.
OpenAI has appointed Jill Hazelbaker, formerly president and chief corporate affairs officer at Uber, as its chief corporate affairs officer, putting a veteran of tech and political communications in charge of shaping how the AI developer engages the public and the institutions influencing AI's future.
Alphabet, Meta Platforms, Microsoft, Amazon, and Oracle have disclosed more than US$3 trillion in future commitments for leases, equipment purchases, energy, and construction as the AI infrastructure race accelerates, signaling that the data center investment boom will continue. The spending surge is also intensifying concerns over financing, power supplies, and water resources.
DeepSeek plans to use Huawei's Ascend 950 chips as the core training hardware for its next-generation V5 model, potentially extending the companies' partnership from inference to full model training in 2027.
AMD is pursuing a larger role in AI infrastructure by combining its growing server CPU franchise with rack-scale systems, broadening its offering beyond individual processors. The company's earnings call highlighted demand for CPUs that run agents and support accelerators, alongside the first revenue shipments of Helios systems built around its newest AI GPUs.
AMD expects company-wide revenue to grow more than 80% in 2027, an expansion increasingly dependent on delivering AI systems and server processors at scale. Data centers already generate nearly two-thirds of sales, but management's outlook leaves execution and product mix central to how much demand converts into revenue and profit.
AMD is preparing for another difficult year in PCs even as demand for its data center products exceeds available supply. The company's earnings call exposed the widening gap between its businesses: higher component costs are weighing on PC purchases, gaming revenue is contracting, and embedded processors are providing a separate source of growth. Chief executive Lisa Su nevertheless expects company-wide revenue to grow more than 80% in 2027.
Supermicro's latest results show its expansion into complete AI data center systems gaining scale, while leaving open how much of that growth can translate into durable profitability and cash. Record sales lifted earnings sharply, but the company retained less of each sales dollar than in the preceding quarter and continued to consume operating cash.
Palantir reported third-quarter 2026 revenue results that nearly doubled from the previous year. Its performance comes on the back of higher US commercial revenue, overtaking government-related earnings for the first time.

Modern cryptography relies heavily on trapdoor one-way functions: mathematical operations that are easy to perform but difficult to reverse without additional information. Quantum computing and advances in artificial intelligence, however, are raising questions about how long this protection can last.

Taiwan eyes US FDPR alignment to block AI transshipment
Nov 4, 07:52
As US export controls make it increasingly difficult for China and other restricted nations to obtain advanced chips and AI servers, Taiwan is taking proactive measures to tighten its own export controls and prevent the nation from becoming a transshipment loophole. Under the Agreement on Reciprocal Trade (ART) between Taiwan and the US, Taiwan's Ministry of Economic Affairs (MOEA) plans to align local regulations with the US Foreign Direct Product Rule (FDPR).
Foxconn is leveraging its precision manufacturing and vertical integration capabilities to strengthen its position in AI infrastructure, where rapid server upgrades increasingly demand tighter component tolerances and faster system delivery. At its recent Technology Day, the company demonstrated how its expertise in materials processing, optical communications assembly, AI racks, and modular data centers can shorten the path from product design to deployment.