Realtek Semiconductor quantified its AI business for the first time at an investor conference on October 29, setting a target for high-performance computing (HPC) and edge AI revenue—including automotive and robotics applications—to exceed 30% of total revenue by 2030. These businesses currently account for a high-single-digit percentage of revenue, as AI expands into infrastructure and edge devices.

Foxconn and Nvidia took center stage at Hon Hai Tech Day 2026 (HHTD 26) on October 30, showcasing their latest collaboration in AI infrastructure, including Nvidia's newly unveiled DSX Pod Compute Container and the Spectrum-X co-packaged optics (CPO) switch manufactured by Foxconn.

Hon Hai Tech Day 2026 (HHTD 26) continued to focus on next-generation AI infrastructure. Although the event featured slightly fewer robots than in 2025, it still maintained a dedicated robotics exhibition area where Foxconn and its partners showcased the latest developments in smart manufacturing technology. Participants included KUKA, ABB, and Yaskawa, which are among the four major robotics families, as well as Japanese passive-component manufacturer TDK. Taiwan-based companies including Hiwin, TM Robot, and TECO also joined the exhibition.

Taiwan's economy has stayed in "booming" territory for a record 10th consecutive month, according to the monitoring indicator compiled by the National Development Council (NDC), the government's monthly gauge of the business cycle. The streak, which began in December 2025, reflects continued strength in shipments of electronic and information and communications technology (ICT) products, and surpasses the previous high of nine straight months set from February to October 2021.

Hon Hai (Foxconn) and TECO Electric & Machinery showcased a jointly developed modular data center at Hon Hai Tech Day 2026, highlighting a factory-built approach to AI infrastructure. The 40-foot container integrates computing, cooling, power, energy management, and fire protection systems, as the companies target rising global demand for AI computing capacity.

Foxconn chairman Young Liu said the company's core strengths are processing capabilities and vertical integration, as the manufacturer seeks to move beyond its long-standing image as a simple "Box Mover." At its 2026 Hon Hai Tech Day, Liu described an end-to-end model spanning design, components, assembly, software integration, and global logistics.

Foxconn Chairman Young Liu said at the opening of Hon Hai Tech Day 2026 (HHTD26) on October 30 that the company's core competitive strengths lie in its "processing capabilities" and "vertical integration," as the company seeks to dispel the perception that it is merely a "box mover" handling basic system assembly.

Thailand-based precision sheet-metal manufacturer Jinpao Precision has entered the supply chain of a leading Thailand-based power-management company on the strength of its resilient manufacturing capabilities and highly adaptable product layout strategy. The company is accelerating its expansion in Thailand to capture growing AI demand as it furthers its efforts in high-end power cabinets, backup battery unit (BBU) systems, and energy-storage components.

Marvell is reportedly in advanced talks to acquire Lumentum, a major laser supplier, in a deal that could be announced as early as next week if no other technology giant intervenes. Based on Lumentum's current market capitalization of approximately US$83 billion, the transaction would be Marvell's largest acquisition ever.

South Korean AI chip developers HyperAccel and Rebellions are moving beyond standalone accelerators to develop integrated data center systems, seeking to combine domestic processors, memory, and networking technologies into infrastructure capable of handling different AI workloads at lower cost.

Nvidia is reportedly evaluating billions of dollars in credit support for UK neocloud provider Nscale to help cover power and construction costs for a data center in West Virginia. Nscale faces simultaneous pressure to accelerate the launch of the Nvidia chip-powered campus, which is expected to be used by AI startup Anthropic, while preparing for an initial public offering (IPO), underscoring how AI infrastructure competition is expanding from chip supply to financing and construction capabilities.