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Jun 16
Nvidia sells US$25 billion in bonds as investors seek foothold in AI boom
Nvidia launched a sale of US$25 billion worth of high-grade bonds on June 15, ultimately garnering up to US$85 billion in orders, or more than triple the bond's original size. This is one of several debt offerings this year from tech giants, which are responding to investor excitement and a need for cash to capitalize on the AI boom.
A letter dated June 12 from US Commerce Secretary Howard Lutnick to Anthropic CEO Dario Amodei marked the most aggressive federal regulatory intervention targeting a leading generative AI firm to date, as Bloomberg confirmed.

Snap unveiled its new Specs augmented reality (AR) glasses at the Augmented World Expo on June 16. Its offering comes at a time when electronics and AI companies are delving into the competitive smart wearables market, with some at very affordable price points.

WinWay Technologies has bought real estate in California for US$2.28 million to create a local manufacturing and office base, a move that underscores how Asian suppliers are expanding closer to US customers as demand rises for AI, high-performance computing, and chip testing services worldwide.
Chinese AI lab DeepSeek has closed its first external funding round, raising more than CNY50 billion (approx. US$7.4 billion) in a deal that values the large-language model developer at more than US$50 billion and makes it China's most valuable AI startup.
Electronic components distributor WFE Technology has launched a transformation plan to become an investment holding company. The company said smart building demand is boosting its electronic lock business, while AI-driven component demand is lengthening lead times.
Bull and Foxconn to build Nvidia's latest AI servers in Europe
Jun 17, 14:00

Bull, the French computing company, and Foxconn announced Tuesday that they will manufacture systems based on Nvidia's Vera Rubin NVL72 platform in Europe — the first concrete output of a partnership the two companies unveiled just two weeks ago.

Ta Tun Electric Wire and Cable is expanding into North America as semiconductor factories and AI data centers drive stronger demand for high-capacity power infrastructure worldwide. The company said its Arizona office and US certification push are meant to support chipmakers, cloud operators, and the broader energy needs of advanced computing facilities.

Li Auto announced details of its new Mach M100 chip, a self-developed 5nm chip focused on autonomous driving, on June 15. This development marks the latest entry among Chinese automakers into designing in-house chips as they compete on cost and smart-driving features.

Shihlin Electric said on June 17 that it expected double-digit revenue and profit growth for 2026, driven by momentum across five business lines: Taiwan Power grid resilience projects, energy transition initiatives, the AI data center supply chain, turnkey transportation and public works, and exports. Executives at the shareholders' meeting announced that a rising export mix should reduce seasonality between the first and second halves of the year.
Alibaba Group has unveiled its first suite of artificial intelligence (AI) models for robots, taking its Qwen family beyond chatbots and software agents into machines that can navigate, simulate, and manipulate the physical world.
InnoScience Technology, a leading China-based integrated device manufacturer (IDM) in gallium nitride (GaN), has won a sweeping victory in the latest patent ruling against global power component leader Infineon in China. Supply-chain sources said the two sides' GaN patent fight has stretched from the US and Germany to China, and the ruling makes it even harder for Infineon within China's increasingly cutthroat market.