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Jun 26
Qualcomm HBC takes aim at HBM costs in AI data centers

Qualcomm has unveiled its latest AI data center platform, Dragonfly, at its annual investor day, highlighting a new technology it calls High Bandwidth Compute, or HBC, as a key weapon in its challenge to Nvidia, AMD and AI chip startups.

Below are the most-read DIGITIMES Asia stories from the week of June 22-28, 2026:

With growing demand for AI server cooling and power management solutions, power semiconductor design company Potens reported that revenue from its server-related business has risen from 4.5% of total revenue in 2025 to 13.5%, a significant jump that reflects strong momentum in the segment. The company also remains optimistic about continued expansion in the AI, automotive, and motor control markets. Order transfers from Western manufacturers seeking to reduce reliance on China are also materializing.

Malaysia's southern state of Johor could see data centers account for about 40% of its electricity demand by 2035, highlighting mounting pressure on power infrastructure as the region emerges as one of Southeast Asia's fastest-growing digital infrastructure hubs, according to a report by energy consultancy Wood Mackenzie.

Taiwan's Hsinchu Science Park is still attracting semiconductor service companies even as major foundries run short of land, underscoring the park's role in a global supply chain centered on advanced chips. New approvals for testing, materials, and equipment research point to rising demand for services that support production at below 2nm nodes.

Cheng Uei Precision Industry (Foxlink) announced on June 24 that its board of directors has approved the appointment of Freddy Kuo as company president. Speaking publicly for the first time in his new capacity on June 26, Kuo outlined the group's artificial intelligence (AI) transformation strategy, saying the company will evolve from a traditional electronics manufacturing services (EMS) provider into an "AI factory," using smart manufacturing to redefine its global competitive position.

Chinese artificial intelligence developer Zhipu AI, also known as Z.ai, is narrowing the performance gap with leading US AI companies in cybersecurity-focused models, underscoring intensifying technological competition as Washington tightens oversight of advanced AI systems.

Physical AI's next hurdle is not walking, but grasping
Jun 29, 09:34

As Physical AI moves closer to commercial reality, its global impact may depend less on humanoid robots that can run or dance and more on their ability to safely grasp, lift, and manipulate objects. A Massachusetts Institute of Technology professor said the central challenge is touch, force, and real-world control, not simply bigger models or faster computing.

Onsemi's acquisition of Synaptics underscores how global chipmakers are racing to build broader edge AI platforms, with implications that could ripple through data centers, industrial systems, and connected devices. The deal signals a push toward integrated hardware stacks amid intensifying worldwide competition across the AI supply chain.
Micron Technology's latest outlook suggests memory shortages could affect device costs worldwide through 2027, with relief unlikely before 2028. For global consumers, that means smartphones, PCs, tablets, and other electronics may stay expensive, while manufacturers face tighter margins, weaker demand, and more uncertainty over supply and pricing.
Goertek has begun mass production at China's first 12-inch AR optical wafer fab, a milestone that could cut waveguide costs, strengthen the domestic AI smart glasses supply chain and speed up mass-market adoption.
Taiwan's electronics-machinery sector is heading into the second half of 2026 with cautious optimism, as global demand for AI infrastructure, high-end semiconductors, and cloud services continues to support trade. The latest survey suggests the benefits are spreading through supply chains, with implications for manufacturers and consumers worldwide.