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7 days
14 days
Sep
28
2026
Column: For physical AI, maps are turning into memory
South Korea's HBM-linked exports surge as Taiwan, Malaysia emerge as high-value destinations
Weekly news roundup: China gains ground in memory and AI hardware as supply stays tight
Apple keeps iPhone Duo in China, exposing limits of India's phone supply chain
Meta's Muse faces security scrutiny over macOS zero-day, human-agent test
China's Micro Han Xin code takes aim at Data Matrix in semiconductor traceability
Beyond ASML: China rethinks EUV race with light-source strategy
India roundup: India's tech ambitions widen from electronics manufacturing to chips, cloud and talent
Sep
27
2026
Keysight pushes design-to-deployment standard for AI cluster validation
Meta Muse fuels agentic AI demand, tightening CPU supply
Nvidia's push for personal AI computers points to a broader shift toward on-premise compute
China wields LCD pricing power as OLED patent war with Samsung heats up
Beijing escalates domestic chip drive with Broadcom audits
South Korea's 300mm research gap: Daejeon pitches an open fab as a US$1.46 billion fix
Chinese automakers tighten control over supply chains as margins shrink
Sep
26
2026
US and Chinese accounts of Xi's Washington visit agree on the framework, not the fine print
DIGITIMES Insight: China's memory makers seek scale, funding to close the gap with global leaders
Interview: Taiwan's H2U helps companies manage employee health with AI, eyes third markets with South Korea
Samsung foundry recovery gains pace, but 2nm, Taylor fab remain hurdles
Wi-Fi 7 drives enterprise network refresh as channel inventories normalize
SpaceX's AI-in-space bet is worth trillions, but space data centers won't be ready until the 2030s
Acer, Phison split on DRAM outlook as PC memory supply eases
Sep
25
2026
Akamai plans US$5.5 billion cloud buildout after US$11.6 billion Anthropic deal
Singapore brands its chip sector as it tries to move up from manufacturing
Dutch PM presses US to avoid tighter ASML China curbs
Trump-Xi summit leaves rare-earth issue unresolved amid yttrium supply squeeze
Trump-Xi state dinner draws tech titans but no Chinese CEOs
Trump, Xi back AI talks as hotline details remain unclear
Samsung, SK Hynix in the running for PS6 GDDR7 orders
BOE supplies panel for LG's 5K Mini LED gaming monitor
China's autonomous-driving suppliers confront the limits of software moats
CPC, Taipower pay premiums to secure energy supplies, face financial strain
Taiwan keeps door open for Chinese parts in drones
Bright LED Electronics rides PCBA rebound to double-digit growth
Interview: Intel director talks physical AI, business models, and robotics' future
Interview: GMI Cloud bets on Taiwan as a proving ground for global AI expansion
From ISM 1.0 to Semicon 2.0—India's chip subsidy overhaul draws early interest, raises the bar for investors
Rockets are booked until 2029, and suppliers won't expand without firm orders
Sep
24
2026
Microsoft to invest US$10B in Middle East AI infrastructure, despite war risks
Anduril's Taiwan supply chain to grow 15-fold in 2026
Taiwan's homegrown trainer program ends with 66 Brave Eagles delivered
Honda eyes Ohio hybrid plant amid pivot to North America
Grab turns Taiwan into a launchpad for Southeast Asia expansion
ASRock Industrial revenue jumps 95% in 1H26 on North America deal
CXMT gains ground in DRAM as Samsung, SK Hynix shift more capacity to HBM
LG sharpens focus on data centers, robotics, chip materials
AI drives Episil GeSi, PMIC growth
China AI's new moat: low-cost models meet a rapidly localising hardware stack
Peking University Dean's rare Intel China appearance hails AI-plus edge adoption
Yusin Malaysia plant to fully ramp up by 4Q26
United Renewable Energy eyes US plant, space-based solar power in revenue push
Chinese foundry CanSemi seeks US$918M ChiNext listing
Cadence, Synopsys certify TSMC A14 design flows ahead of 2028 production
Alibaba Cloud accelerates AI infrastructure buildout with 20GW target, eight-market expansion
Nscale's biggest customer: a Singapore unit with US$1,000 in capital, owned by ByteDance's AI brand holder
Meta stretches its glasses lineup from US$249 to US$1,299.99 as rivals close in
ASML system sales in Europe remain at zero as EU debates Chips Act 2.0
South Korea chip, panel lines stay on as AI, iPhone demand surges
Beijing Eswin heads for HK IPO as RISC-V growth shifts to autos, industrial chips
Qualcomm sticks with TSMC for both 2nm Snapdragon flagships as Samsung steps up foundry push
Qualcomm splits flagship mobile SoCs into more tiers
IEI sees network security, video growth through 2028
Commentary: Apple's M8 Ultra AI server plan could pull Apple Silicon into Nvidia's enterprise infrastructure game
Samsung reportedly shifts sub-10nm DRAM roadmap toward hybrid bonding
Xi-Trump summit masks AI rift as Chinese AI leaders stay away
Huawei founder Zhengfei Ren reappears in Shenzhen — Dongfeng smart vehicle alliance moves into focus
Qualcomm pushes Snapdragon PCs further into Linux, GoogleBook as AI shifts to the device edge
LG Display scraps Nanjing automotive LCD module sale to Top Run
TSMC locks in 3-6% wafer out price hikes for 2027
Skoda's top earner CEO jumps to Volvo, rattling Volkswagen Group
Eternal Materials eyes 2H26 peak season as precision equipment, advanced packaging shipments rise
Qualcomm bets on earphones as the voice gateway for personal AI
Anthropic joins OpenAI, Google DeepMind in Singapore
Taiwan's Yusin pivots China OE brake pad business from BYD to JV automakers
Anthropic brings in Accenture to audit AI safety
Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC
Xi's US visit stirs alarm over a possible Chinese auto push into America
Garmin drops Micro LED after 1 year, returns to OLED
India reportedly probes LG, Samsung over duties on OLED TV display parts
Alibaba Zhenwu V900 joins Huawei Ascend 960 in race to fill Nvidia's China AI compute gap
Supermicro begins shipping Nvidia Vera Rubin NVL72 AI racks
Qualcomm's PickNik deal brings robotics software to its edge AI push
Intel puts CPU-GPU coordination at center of agentic AI strategy
Trump-Xi pre-summit watch: H20 setbacks and Ascend gains reshape China's Nvidia calculus
Industrial software giants race to build industry world models
How Apple's iPhone Duo uses a 10-layer architecture to minimize crease
Powertech targets quarterly growth in 2026, eyes record high
AUO unveils EPS 2030 blueprint linking sustainability to business value
GMI AI compute leasing business sells out in US as big users lock in long contracts
SK Hynix Indiana HBM plant faces lawsuit
Trump-Xi pre-summit watch: China charts a sovereignty-first path for frontier AI
OUCC sees semiconductor chemical shipments ramping up in 2027
Microsoft reframes AI ROI calculations, keeps in-house ASICs for internal use
ASRock Industrial's game-streaming win signals longer revenue tail, but supply risks remain
LSTC links with Rapidus to revive Japan's advanced chipmaking
AMD pushes ROCm for agentic workloads while Intel holds on to OpenVINO
Sep
23
2026
US, China diverge on AI guardrails ahead of Trump-Xi summit
SKC raises Absolics stake to 82% as glass substrates remain in testing
Engineering over panic: Jensen Huang's pragmatic vision for the future of AI
Vivo launches camera monitor accessory, stoking panel demand
Foxtron maps overseas expansion as customers seek full EV line-up
With Xi's Washington visit incoming, trade data show how the tariff war has reshaped US-China tech flows
YMTC wins German injunctions against Micron in latest round of NAND patent battle
Automotive display growth shifts to HUDs, passenger screens
LG Electronics, Microsoft enter partnership on AI data centers, physical AI
Samsung Display explores halftone black PDL tech to cut OLED production costs
Samsung LPDDR6 validated by Qualcomm for next-gen Snapdragon platform
Qualcomm and Google eye Agentic AI, expand partnership to GoogleBook, automotives
Biwin Storage commits US$672M to double down on 2.5D packaging, compute-memory integration
China's BeiDou eyes US$150 billion industry scale with AI, services at the core
ZDT prices US$800M ECB to expand AI server PCB push
Hotai expands MaaS push with FunNow stake
Taiwan's Master Bus scales 450 kW direct-drive motor for the intercity EV market
Taiwan tire maker Cheng Shin turns 'virtual tires' into an EV development weapon
Hermes-Epitek eyes CPO test revenue in 2027
LG Energy enters Nvidia's ecosystem as it pivots batteries to data centers
DeepSeek, Moonshot, the hidden cost of routing China's AI through Claude
Hygon takes China's CPU ambitions beyond servers, into physical AI
Gigabyte's Giga Computing sets up AI factory in Taiwan to accelerate rack validation
Nvidia's 800V power shift hands Taiwan's capacitor makers a new AI segment
GLT pivots into life sciences with US-patented precast gels
Acer defends Europe's biggest PC market with top-two gaming rank in Germany
China, Japan dominate over 90% of OLEDoS market, threatening South Korea's panel leadership in the AI era
China Steel expands recycled steel into EV motor market amid growing low-carbon demand
Qualcomm launches dual Snapdragon flagship platforms for Xiaomi, Honor
Nexperia China turns 12-inch wafers into the backbone of its chip supply-chain reset
Sharp reportedly to develop universal satellite antenna for multi-network connectivity
Meta's Muse gains users as human support raises privacy questions
CME Group's GPU futures debut stalls as CFTC flags concerns
Episil says AI demand marks structural shift in semiconductor epitaxy
SK hynix's venture arm moves beyond memory into optical interconnect and system software
Li Auto opens Mach chips, SiC modules to external customers
Qualcomm's agentic AI era begins with smartphones and new HBC architecture
India's Dixon looks beyond smartphones to crack global EMS top 10
Commentary: Zhengfei Ren rumors expose a deeper chill across China's tech sector
Einride builds its next autonomous truck on Nvidia Hyperion as the gap between fleet, driverless fleet stays wide
MediaTek, Qualcomm target Googlebook with Arm push
US energy storage faces a costly China battery exit
Trump rejects global AI controls, urges US to press ahead with "superintelligence"
US-based Swarmer bets up to US$224M on Ukrainian combat robot maker Ratel
Taiwan's August export orders top US$100 billion as overseas production edges up
Apple delays 20th-anniversary iPhone display upgrades
Acbel targets Europe's fast-charging market with new high-power DC modules
Malaysia reviews data centre benefits after 40-plus 2026 applications
Taiwan courts Indian IIT chief in bid to boost chip talent ties
CMC expects record 4Q revenue amid expanding model lineup
Anthropic and OpenAI both cut frontier model prices, ten days after calling for a slowdown
Analysis: Foxconn's EV push moves beyond demo and toward scale
Europe industrial controls rebound lifts Higgstec's 1H26 growth
ASRock's center of gravity moves from motherboards to AI servers
Taiwan uses AI to close drone thermal imaging gap
Taiwan finds way to turn waste LCD glass and road debris into high-value materials
Win Semiconductors expands optical communications capacity with DUV tools
LG Display starts 720Hz gaming OLED mass production
Seven Chinese AI companies hit US$10.7 billion ARR, but the harder race is paying for scale
Ascend 950 clears higher security bar in China's latest chip assessment: who else qualified?
Lightmatter launches an optical module that cuts AI cluster fiber in half
SK moves three veteran execs to SK Hynix amid US-China tensions
Sep
22
2026
SiPearl delivers first homegrown server chips for Europe's exascale supercomputer
Anthropic, OpenAI expected to start buying memory directly in 2027
Vivo unveils X500 strategy to bolster premium phone push
Tmytek lists on Taiwan Innovation Board, pushes 5G/6G, satellite, defense
Changs Ascending eyes AI data center backup power, storage growth
Meta's AI agent Muse tops app charts, driving AMD's market cap past US$1 trillion
Hermes Testing sees growth opportunity in AI-driven chip demand as OTC debut expands reach
Taiwan's automakers gear up for year-end sales, as exports emerge as new growth engine
Unitree targets humanoid robots' next bottleneck with 22-DoF Dex5-S hand
Acer debuts first Googlebook with 360-degree hinge
Microsoft opens fourth India cloud region, casting Hyderabad as an AI hub for Asia and the Global South
Hanmi Semiconductor ships first FC Bonder 75 for 2.5D packaging
Alibaba speeds V900 rollout, targeting 20GW of data centers
NASA adds three SpaceX crew missions as Boeing's Starliner lags
Taiwan virtual asset law to help lower supply chain transaction costs
DeepSeek bets on Huawei chips for model training as Nvidia's China sales slip
DEEPX targets smart glasses with low-power NPU, eyes 6G AI RAN
Chinese automakers step up battery in-house push to reclaim cost control
Micron Taiwan union heads for strike vote as board, earnings calendar stall profit-sharing talks
Xiaomi open-sources MiMo-V2.6, publishes the bill for scaling reinforcement learning
Alibaba expands full-stack AI push as cloud data centers target 20 GW by 2032
BOE looks beyond displays with glass substrates for AI packaging
Samsung weighs 4nm expansion as HBM4 demand strains capacity
TSMC, ASE break ground on Taiwan's first advanced packaging cluster in Kaohsiung
Escalating risks, evolving safeguards: a chronological look at OpenAI's safety strategy
Chinese AMOLED material suppliers set for revenue gains as Gen 8 fabs boost localization
Googlebook opens preorders at US$899 for AI laptops
India's fifth chip plant goes live, capping Suchi Semicon's three-year buildout
Exclusive: China SiC capacity tightens, spilling orders over to Taiwanese foundries
MediaTek unveils Dimensity CX C10 Max for premium Googlebook devices
Meta's rumored Luna smart glasses may go camera-free for lighter design
Taiwan advances major science park expansion to support AI, semiconductor growth
Apple's reported AI server push could reshape its role in enterprise infrastructure
Brussels will put a public efficiency grade on Europe's data centers before it decides what to require of them
Huaqin challenges Quanta for Steam Deck ODM order
Taiwanese auto industry eyes 2027 for zero-tariff US cars
Microsoft Taiwan to double data centers as AI computing demand exceeds supply
ASML opens India operations but ties any scale-up to Tata's Dholera fab
Taiwan's Hai Kun submarine in final testing stages, eyes October delivery
China puts AI computing into orbit with first integrated satellite launch
Nscale seeks New York listing as AI infrastructure demand tests investor appetite
YMTC's capital arm enters FD-SOI — China's 12-inch SOI build-out gathers pace
China's memory race turns inward — CXMT, YMTC head toward patent showdown
Xpeng plans to license tech to more foreign automakers
MediaTek launches Dimensity CX brand for laptops, starting with a 3nm chip for Googlebook
Tesla speeds up Optimus mass production with China supply chain visits
Acer founder urges talent, trust, and innovation in AI era
Daeduck nears long-term supply deals as Doosan expands capacity amid tight T-glass supply
Analysis: Will AI glasses replace the iPhone? —Cook and Ternus see it differently
AirTAC sees pneumatic demand cycle extending through 2027 on China automation growth
Nvidia Rubin architecture drives high-end MLCC demand, solidifying Murata, SEMCO leadership
EZconn eyes 2027 high-core fiber ramp as shortages persist
AI inference demand surges as training slowdown talk fades
China carmakers lean on exports as domestic sales stall
DIGITIMES Insight: Full-color Micro LED set to exceed 30% of AR glasses shipments in 2027
US iPhone 18 Pro Max teardown reveals Qualcomm modem, suggesting prior supply-chain commitments
Loyalty Founder Enterprise sees AI server expansion lifting growth outlook
Trade, AI, rare earths, and Iran shape Xi-Trump 2.0 talks
Sep
21
2026
Microsoft CEO expected at Trump-Xi dinner amid rising AI debate
California orders AI safety audits and emergency shutdown planning
Taiwan firms keen on investing in US manufacturing
South Korea-US investment talks stall over commercial viability
Taiwan drone makers pursue dual-track growth on domestic defense orders, US market expansion
Kaohsiung's new industrial park targets advanced packaging suppliers for the post-Moore era
Samsung builds fab robot team, targets chip equipment maintenance
US auto groups press Trump to block Chinese automakers from the market
SDC president declares foldable leadership, urges Korea to defend OLED advantage
Lattice Mach-N2 transitions to 16nm FinFET, integrating post-quantum encryption to strengthen control security
China's smart glasses boom: AI evolution, market shakeout, macro trends
Qisda leverages ICT foundation to build one-stop AI healthcare platform
Europe's hydrogen trucks chase commercialization
Leading Interconnect Semiconductor starts Shenzhen advanced packaging substrate plant
Microsoft AI chief says regulation is not a bad thing
Rebellions chips process over 4 billion tokens a day for SK Telecom
Physical AI opens a new growth window for FD-SOI as China builds domestic supply chain
Tower Semiconductor to make Japan its largest optical chip base
Trump announces 'AI Force' as safety concerns and China rivalry mount
Apple, Xiaomi, Qualcomm each eye edge AI ecosystem gains
First Solar withdraws 337 case, shifts TOPCon patent fight
Z.ai's ZCode crisis exposes AI coding's enterprise trust gap
TSMC builds Kaohsiung hub to speed advanced packaging tests
Chinese image sensor maker GalaxyCore raises the stakes in high-end CIS
SK Hynix pushes deeper into logic for next-generation 3D DRAM
Tesla AI server order puts Pegatron back alongside Asus, 18 years after split
Musk's Memphis move puts xAI at the center of his empire
Samsung reportedly plans to double HBM4 output in 2027 as memory supply stays tight
EV battery demand is going global, yet material supply remains overwhelmingly Chinese
Wiwynn chair says AI hardware is being reshaped by power, cooling, interconnect demands
China sets first national perovskite solar testing standard
ByteDance's China AI chip push hits substrate shortage
Acer taps local health data to build sovereign healthcare AI
Intel reportedly in talks with AUO on advanced packaging
Shell oil shortage puts Volkswagen contract under review as Europe's aftermarket feels the strain
iPhone Duo takes the baton from 18 Pro to extend Apple's upgrade wave
Faraday Future says robotics, not EVs, must carry it to profitability
Largan makes seventh land, factory purchase of 2026 in co-packaged optics push
Acer founder says slowing AI development will be hard, amid call for AI slowdown
DB HiTek gains pricing power as 8-inch supply tightens
China monitor market splits as commercial demand holds up, premium displays gain ground
Foxconn takes EV ambitions deeper with Quantron commercial vehicle deal
CXMT closes in on DRAM leaders with G5 process breakthrough
IBM unit secures US$1 billion CHIPS Act award to expand quantum wafer manufacturing
Weekly news roundup: AI boom strains chips; Google's TPUs pay off, China eyes 3nm without EUV
Anthropic reportedly weighs a new model, outside safety auditors as its IPO clock runs down
Column: AI usage patterns may be shifting the case for self-hosted servers
AMAX expands liquid-cooled data center in push beyond hardware
US-Mexico trade talks put AI servers in focus as Taiwan ODMs seek common ground
DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment
Dassault Systèmes: AI-native transformation emerges as Taiwan's next industrial frontier
HEC Compucase AI server products drive 2026 revenue growth
ACES targets AI compute, power with cable ramp-up
Tyntek optical communications MPD ramps quarterly, 2027 capacity triples
Samsung reportedly cuts QD TV output 80% as Neo QLED phaseout looms
Ampoc AI PCB orders surge as it expands into CPO
AI safety debate heats up: Pegatron chairman urges risk controls, not an innovation halt
Podcast highlights: Apple could take the lead in foldable share
CHT completes 4th Taiwan-Matsu subsea cable, boosting offshore resilience
ACM Research's Shanghai unit leans on overseas installs, panel-level plating for its next leg of growth
India roundup: Semicon India 2026 puts commercial production and supplier investment in focus
Analysis: The race to superintelligence meets a demand for restraint — and the industry is split
Sep
20
2026
Charts: Two-thirds of Taiwan's chip equipment growth comes from testing AI chips
OpenAI, Microsoft filings intensify copyright fight over AI training
BYD plans four Europe factories as EU tariff pressure rises
AI capacity crunch drives up consumer tech costs, deepening China's deflation
Wiwynn brings cobots to L10 server assembly as AI rack testing drives factory redesign
Foxconn joins Quantron, Hongjing Drive in zero-emission commercial vehicle partnership
Chinese memory supply is disruptive to pricing, Acer's Jason Chen says, as shortages ease
Sep
19
2026
Amazon Leo clears Taiwan's NCC review, with commercial launch pointed at 2027
Power grids can't keep pace with AI data center boom in EU, US
Memory recovery, price hikes lift Niching IC substrate outlook, order visibility through 2H27
MediaTek, Vivo bring 30B MoE models on-device in next AI phone race
Interview: Advanced packaging shifts toward system-level co-design for AI
Thailand plans to swap EV subsidies for import taxes to defend its production base
Beyond Volkswagen, XPeng seeks to turn automotive R&D into a global tech enterprise
Charts: Taiwan's memory makers are outgrowing TSMC by a factor of eight
Ams OSRAM takes an automotive-qualified force sensor into robotic hands
CXL adds memory capacity, but HBM retains its bandwidth edge
Ventec invests NT$1.5 billion in Kunshan expansion for AI, HDI orders
Compal takes Compal Broadband Networks private to fold networking into its edge AI stack
Sep
18
2026
Solidigm weighs first US NAND fab, explores upstate New York
Analysis: China's 15th five-year plan spotlights diamond for AI chip thermal management
Winbond cements server NOR lead with Infineon deal
Corning to raise display glass substrate prices 15% from 4Q26
CXMT eyes NAND amid global shortage, taking aim at YMTC
Doosan commits KRW968 billion to CCL expansion as demand strains capacity
China's AI data center token costs hinge on access to advanced GPUs
China's memory push gains ground across LPDDR6, advanced NAND, with HBM still the test
CoreWeave launches US$3 billion bond sale amid growing revenue, debt
High-end GPUs may be slowing China's AI compute expansion
LGES, Samsung SDI reportedly booked out for two years as US restrictions and China slowdown reshape ESS market
Chip equipment makers face waits of up to 40 months for critical parts
Samsung deepens Euclyd ties as startup reportedly reaches test-chip stage
King Charles tests AI's safety consensus as Nvidia keeps its foot on the accelerator
CPO raises PCB downgrade concerns but switches stick with M8 CCL
iPhone 18 Pro sellouts across Taiwan as foldable Duo looms
ByteDance's second AI-agent phone drops forced automation for permission — yet app wall still up
Mobile SoC battle for 2026 centers on NPUs
Micron: AI memory crunch rewrites the market with long-term deals and custom designs
ByteDance builds strong supply chain force to master emerging hardware ecosystems beyond core demand
GlobalFoundries, Marvell expand SiGe capacity deal for AI optical connectivity
NCSIST showcases military tech at Taiwan Innotech Expo 2026
Foldable smartphone panel shipments fall 13% in 1H26 as market shifts to in-fold designs
Rumored Japan-US chip plant talks test whether two former chipmaking giants can rebuild at home
Resonac grows 300mm SiC crystal, marking a substrate milestone
Taiwan central bank keeps rates unchanged as inflation stays contained
Taiwan central bank warns market stability hinges on AI monetization
Global chipmakers answer India's pitch with equipment, materials, and R&D — not fabs
Tata Electronics put 16 MoUs on the record at Semicon India, join hands with Nexperia
Modi says India's chip mission has reached commercial production as Semicon 2.0 lifts the purse to US$13.5 billion
Housing slump and plant builds diverge as Tung Ho Steel sees AI demand support
China sees a second chance in VLEO as AI shifts the satellite race from chips to networks
Samsung taps Japan for 3.xD chiplet push as packaging race heats up
GaN is winning the AI power argument, not yet the cost battle
Huawei Connect 2026: Huawei scales supernodes into million-card AI systems
Samsung Display reportedly taps Sunic for KRW300 billion RGB OLEDoS push
Z.ai's next growth engine starts where compute scarcity ends
CATL looks beyond China's passenger-car squeeze as electric trucks become the next growth front
Micron's Taiwan investment passes US$47 billion as it rallies fab construction suppliers
Nvidia roadmap shifts to rack-scale AI with Rubin Ultra
Apple and MediaTek's latest SoCs address overkill performance by reserving space for agentic AI
FCS Group eyes North America layout, as plastics industry turns to material innovation
AI's next infrastructure squeeze is storage: Seagate sees demand accelerating
Taoyuan to sign high-end IC substrate MOU with Unimicron, Kinsus as Aerotropolis zone takes shape
Taiwan prepares 150-qubit quantum computer RFP, seeks 'win-win' partnerships with global suppliers
FIT hedges its AI optics bets with Corning EBO, TSMC co-packaging talks
Nan Ya accelerates AI materials shift with major capacity expansion
Taiwan's small businesses race into AI, raising the stakes for execution
DeepSeek engineer's warning suggests AI may reshape, not simply eliminate, technical work
Winbond's Infineon buyout puts GigaDevice under pressure
Sep
17
2026
AMD pivots to China developer ecosystems as Nvidia retreats
SK Hynix looks beyond HBM as inference workloads diversify
Asia's healthcare AI moves from trials to real-world deployment
Deloitte Taiwan seminar highlights system integration as Physical AI moves into industrial applications
Trumpf eyes glass as AI demand drives packaging innovation
Samsung bets on zHBM as 2.5D memory nears its limits
Topview sees supply-chain shifts supporting orders as AI investment reshapes its outlook
CXMT cashes in on the DRAM shortage — and takes aim at HBM
TSMC reconsiders 12-inch equipment donation as Taiwan overhauls scope of research partnership
Memory LTAs lock up 50-70% of capacity
The Trump-Jensen speakerphone diplomacy: how Nvidia turned political pressure into a seat at the table
VLEO emerges as next orbital frontier as China warns of critical 2026–2030 window
Humanoid robots could reshape MEMS demand as physical AI advances
Ardentec, Sigurd race into silicon photonics TIA testing as US client books capacity
Tier IV open-sources self-driving AI chip design to challenge Nvidia
Huawei Connect 2026: OceanStor M900 turns PB-scale KV cache into Huawei's next AI infrastructure layer
Wiwynn sees strong AI demand offsetting US data center pushback
Samsung Galaxy S27 series rumored to feature 4 models, reshaping flagship lineup with display and camera upgrades
China optical suppliers power smart glasses supply chain
Samsung expands SRAM, IP to speed chip development
AI's memory appetite is squeezing the electronics industry from the bottom up, Intel warns
Why Taiwan's tech needs better storytelling to win global capital
Foxconn Interconnect Technology targets the scaling challenge in AI optical interconnects
Taiwan readies ETS pilot as overseas expansion drives demand
Taiwan to pilot ETS by end-2026, experts urge three safeguards
Huawei Connect 2026: Ascend 960 puts industry-first NPO supernode at heart of Huawei's AI scale-up bet
20 of China's OSATs push into advanced packaging amid EUV curbs
iPhone 18 Pro preorders rise up to 20% in Taiwan as foldable Duo debuts
China's LCD trio flexes newfound pricing power as Taiwan panel makers retreat
FIT ramps up optical interconnect push as AI race shifts to connectivity
SK Hynix weighs US memory options as buyers lock in 2027 supply
Samsung reportedly starts Tesla chip trial production at Taylor fab
TOK completes KRW101 billion facility in South Korea to bolster semiconductor supply chain
AI risk split among tech leaders set to play out at Trump-Xi White House dinner
General-purpose home robots face sensing test
Circular economy tests material mastery and consumers' willingness to pay
South Korea's medical device city opens physical AI institute, aiming to train 1,400 workers in five years
Apple's AI ambitions are outgrowing the Mac — Nvidia may hold the key
Huawei sees AI agents driving 90% of token traffic by 2035
Foxconn links FII and FIT to tackle AI infrastructure beyond the chip
Dassault Systemes shifts to AI-native platforms, stakes its next phase on Taiwan
ByteDance's Anew Labs reportedly raises US$290M as AI drug discovery gains momentum
Taiwan machine tool makers target aerospace, semiconductor boom at major trade shows
Google reportedly weighs CoWoS backup for 2027 TPU as EMIB-T substrate yields lag
Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV
China's FAW may become GAC's second-largest shareholder, possibly restructuring the Toyota China model
Chip equipment, materials suppliers lead India investment pledges ahead of SEMICON India 2026
Onsemi puts power density at the center of its next-decade strategy
Fujifilm to invest US$83 million in semiconductor materials plant in India
Applied Materials announces 10-year investment plan ahead of SEMICON India
Lam Research plans US$1 billion India manufacturing expansion
Meta's next smart glasses reportedly drop the camera as privacy concerns mount
Musk hints at Tesla-SpaceX merger, but the companies are already converging underneath
SK Hynix reportedly eyes Intel Ohio plant for US memory production
Elon Musk urges rival testing to expose AI safety flaws
Column: China tightens rare earth controls, exposing hidden vulnerabilities in Taiwan's supply chain
Physical AI targets factory assembly pain points
Arcadyan expects third-quarter strength as Wi-Fi 7 upgrade cycle builds
BizLink's expansion strategy signals a wider shift toward localized, risk-aware global supply chains
Kinpo's push into higher-margin products, quantum control signals a wider industrial pivot
SK Hynix shifts supply chain planning for AI capex boom
South Korea's chip boom lifts 2027 corporate tax above KRW200 trillion
OpenAI details AI jailbreak as Nvidia's CEO calls for engineering controllability
Intel CEO warns of 2027 memory crunch and tighter CPU supply
Charts: Taiwan's chip packaging growth runs deeper than ASE
Samsung looks to outside suppliers as HBM boom shifts priorities
Apple's foldable phone puts thinness, weight in focus
DIGITIMES Insight: SiC substrate capacity expansion continued; 6-inch substrate prices expected to rebound in 2027
Huawei's 3D data center redesign targets the next AI compute density wall
TSMC's C.C. Wei says to solve problems, put customers first
Jensen Huang's Galaxy Z Fold8 spotlights Nvidia-Samsung ties
Charts: Memory chip designers carry Taiwan's IC design rebound
Huawei aims to become 'China's Nvidia,' rules out building satellites or spacecraft
Sep
16
2026
Analysis: Jensen Huang is in Trump's ear; what it means for Taiwan's chip supply chain
Infineon exits NOR Flash with US$1.12 billion sale to Winbond, reviving Spansion name
Samsung advances jump 70% amid shift to long-term memory deals
Taiwan, South Korea should stop comparing, says DIGITIMES chairman
India's Eastern state clears SiCSem's SiC unit in SEZ
DIGITIMES Insight: Google outlines AI compute expansion, speeds TPU cycle to 6 months
LEOTEK completes real-world test of AI traffic system at US smart city lab
Nvidia's Jensen Huang expected to attend Trump-Xi Summit as tech and trade take center stage
Why Wiwynn chose El Paso for its first US plant
Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
BizLink's CPO breakthrough hits the hard part: scaling
AI slowdown calls expose the financial strain of the frontier race
EV batteries cannot simply power humanoid robots, with energy density and costs posing key hurdles
Soaring memory costs threaten Netronix's e-reader growth, even as new display markets stay on track
SK Hynix union approves revised pay deal after 25-vote rejection
TSMC's overseas expansion faces talent management gap, says co-COO Y.J. Mii
SK Hynix, Intel in talks on US production to ease memory crunch
Taiwan CCL makers ride Nvidia's M9 shift as AI servers move to 52-layer PCBs
CPO ramp pushes silicon photonics testing upstream to catch defects early
Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges
Samsung Exynos regains share as Galaxy phones test 2nm
Geopolitical shocks add business pressure as CBAM free carbon quotas extend to 2038
Meta globally rolls out Meta One subscription, tops 15 million sign-ups
Physical AI could reshape industrial computing as Ennoconn sees a long growth cycle
Samsung reportedly weighs Micron's newest memory for Galaxy S27
Apple reportedly accepts Samsung's 1Q27 memory hike, raising the 2027 smartphone cost floor
Micron unveils 512GB DDR5 RDIMM for next-gen servers
Samsung backs Dutch AI chip startup Euclyd in US$230M funding round
Samsung reportedly pushes conventional memory modules to partners in Vietnam and India as HBM crowds its back end
Glass substrates, TGV set to reshape 2027 advanced packaging race
Hanmi Semiconductor reportedly lands first back-end foothold at Terafab
Exclusive: Wiwynn expands US, Mexico plants, aiming to double capacity by 2027
Aleees locks in Tainan plant for 20-year North America order
Kepler bets HBM can scale without EUV — chip giants are buying in
Astera says customers are rethinking HBM needs for AI accelerators
AI efficiency fuels Jevons Paradox debate over HBM demand
Altera confidentially files for US IPO as AI chip demand fuels listing boom
MediaTek keeps Dimensity 9600 Pro on HBPoP as cost drives decisions
Sharp opens orders for Foxconn-built Nvidia AI servers, targeting JPY250 billion by fiscal 2030
Huawei reportedly scales back AITO role as Seres takes greater control
Apple, Intel links sharpen focus on Lens Technology's next glass growth markets
US-based Teradyne opens Bengaluru office to support India's semiconductor push
Advanced processes have no ready-made answers, says TSMC's COO
Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec
Novel 2D materials offer quantum breakthroughs as research ecosystem targets sub-1nm era
Commentary: China's US$4.5 trillion electronics target confronts the limits of manufacturing scale
Beyond 2nm: Dimensity 9600 Pro gives MediaTek a bigger role in mobile AI
Samsung reportedly taps TSMC for custom HBM base dies as new foundry dynamics emerge
FSC teams with South Korean maker on TGV equipment for glass substrates
A Taiwan machinery maker bets on AI to challenge Japan's grip on advanced capacitors
DIGITIMES Insight: Taiwan can power its AI chip boom — but not with green energy
South Korean NPU startups face validation hurdle in push for global sales
Apple's foldable phone faces durability test as suppliers eye crease risks
Star Shining launches IPO plan as renewable energy assets reach 676MW
ITRI showcases AI robots, drones to push commercialization in southern Taiwan
China's humanoid robot race, Part 2: Upstream profits gather around dexterous hands
AI server tracker: BMC, cable, case suppliers post August 2026 gains
DeepSeek to hire its first CFO as it aims for public listing, expands workforce
Apple exits Musk's AI lawsuit, but the fight over iPhone AI access is only getting bigger
As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics
DIGITIMES Insight: NVHBM is not a memory revolution; Nvidia seeks to platformize cHBM, dominate custom AI architectures
DIGITIMES Insight: Taiwan's small IC design firms face a weaker second half after rebound
AR glasses target 2 billion myopia users as China supply chain eyes doubling shipments
Chip revenue heads to US$2.4 trillion on price, not volume, Yole says
AI data centers give idle EV battery capacity a second life
DIGITIMES Insight: Google scales TPU systems to 1 million chips as power becomes the bottleneck
Amodei's AI slowdown call is unlikely to dent chip demand, industry sources say
iPhone Duo's identity shapes Apple's foldable strategy
Charts: Memory has held six of the ten fastest-growing spots in Taiwan's chip sector for seven straight months
DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies
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