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    Resonac develops 12-inch SiC substrate to target AI and EV demand
    Sep 17, 18:14
    High-end GPUs may be slowing China’s AI compute expansion
    Sep 17, 18:14
    2026 smartphone SoC battle centers on NPU as vendors boost cores and memory for agentic AI
    Sep 17, 18:14
    LGES and Samsung SDI ESS orders reportedly fill two years of North America capacity
    Sep 17, 18:14
    Analysis: China's 15th five-year plan spotlights diamond materials for AI cooling
    Sep 17, 18:14
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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
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