Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the introduction of a new high-speed OctalNAND Flash which makes high-density serial NAND Flash a viable low-cost alternative to today's Octal NOR Flash.The world's first x8 Octal interface for NAND Flash, Winbond's OctalNAND Flash enables automotive and industrial manufacturers to provide code storage in high density without having to pay a premium and any special hardware change for NOR Flash, a fast memory technology which scales poorly at densities above 512Mbits.The first Winbond product to include the new interface, the 1Gbit W35N01JW, offers a maximum continuous Read throughput of 240Mbytes/s, three times faster than the earlier high-performance W25N-JW QspiNAND Flash family. The single-die W35N01JW is also 50% faster than Winbond's W72N-JW family of Dual QspiNAND devices, which have dual dies in a single package, and a more complex x2/x4/x8 I/O architecture.Manufactured in Winbond's proven 46nm Single Level Cell (SLC) NAND fabrication process, the W35N-JW OctalNAND Flash offers excellent data integrity and more than ten years' data retention. It is specified to perform more than 100,000 Program/Erase cycles, providing the high level of endurance and reliability required in mission-critical automotive and industrial applications.Fast execution of boot codeWinbond developed OctalNAND Flash because automotive and industrial OEMs are reaching the limits of NOR Flash technology's ability to scale cost effectively while being assembled in industry standard packages. In applications such as automotive graphics displays and Advanced Driver Assistance Systems (ADAS), boot code size is often larger than 512Mbits. Customers have traditionally used NOR Flash for code storage, because it is highly reliable, and its fast Read throughput supports fast boot performance. At densities above 512Mbits, however, NOR Flash scales poorly, and die size and cost become excessive.Because NAND Flash technology scales well, its cost is more attractive at densities of 1Gbit and higher, but conventional NAND Flash has been too slow for functions such as shadowing boot code to DRAM.Takehiro Kaminaga, Deputy General Manager of Winbond, says that the new OctalNAND Flash squares the circle. He says: 'Customers in the automotive and industrial markets can now benefit from 240Mbytes/s Read performance in devices with 1Gbit-4Gbit density at a fraction of the cost-per-bit that they pay today for similar performance from an Octal SPI Flash device.'The new OctalNAND Flash from Winbond offers partial compatibility with Octal NOR Flash, easing replacement of NOR Flash devices in existing designs. The industry-standard 8mm x 6mm BGA package of the W35N-JW device is footprint-compatible with serial NOR flash products, and is fully pin-compatible with that of Xccela Flash and OctaFlash NOR products on the market today. Lead automotive customers are using the 1Gbit W35N01JW OctalNAND Flash to replace Octal NOR Flash memory products in new designs, benefiting from a shorter boot time and lower bill-of-materials cost.The W35N-JW parts include a Reset pin, a hardware feature which supports customers' approach to compliance with automotive safety requirements. This Reset pin is compatible with the pin-out of equivalent NOR Flash devices, enabling customers to retain existing serial NAND software for triggering a system re-boot.Excellent performance characteristicsThe W35N-JW family operates at up to 166MHz in single data-rate mode, and up to 120MHz in double data-rate mode. It operates from a supply voltage of 1.7V-1.95V. Data integrity is maintained by the on-chip 1-bit Error Correction Code (ECC). Data from ECC operations help optimize the chip's bad block management.Fast program and erase performance - the W35N-JW achieves a maximum Write speed of 16.9Mbytes/s - supports over-the-air firmware updating in vehicles and also improved manufacturing throughput.More information about the Winbond OctalNAND Flash and the W35N-JW family may be found at website.Winbond OctalNAND

The rise of the Internet of Things (IoT) creates the use cases from mobile devices to autonomous drones and from surveillance equipment to Advanced Driver-Assistance Systems (ADAS). The intelligent image processing technologies combined with artificial intelligence (AI) are fundamental challenges for today's system designers. Meeting the advanced image processing requirements of new and emerging camera devices typically require advanced and scalable micro controllers and memory chips. These strong demands are even accelerated by the coming Tokyo 2020 Olympics games including the roll-out of 8K TVs, 5G mobile phones and smart edge devices, which has gradually entered the lives of everyone.Furthermore, the enormous market opportunity of cellular 5G base stations and IoT devices continuously boost large memory densities and increase DRAM product value. During the coming 5G hype cycle, the growth of the 5G infrastructure market in North America and China is likely to be propelled by increasing capital spending and strong investment from telecommunications operators. This will increase the demands on wireless communication modules with customized DRAM products, which will equip high-speed, low-power and the fast data-transfer rates memory, for improving user experience.High speed and low power features maintaining competitive edge of Winbond DRAM memoryWinbond's DRAM product portfolio is consisting of Specialty DRAM and Mobile RAM. Specialty DRAM, focusing on low and middle density, features characteristics of high performance and high speed and is widely used by leaders in the consumer, communication, computer peripheral, industrial, and automobile markets. Completed solution can be provided to variety customers. Both Specialty DRAM and Mobile DRAM support for Industrial and automotive application with AEC-Q100, TS16949, ISO9001/14001, OHSAS18001 certificates. The latest DRAM products not only provide high-speed, it also meet the industrial standard and can remain operating under extreme environment temperature ranged from -40 degree C to 105 degree C.Specialty DRAMNowadays, IoT devices are evolving towards the trend of thinner, lighter and less power consumption. In order to remain high performance, the memories used in these devices are required to have features such as high-speed, low-power consumption and downsizing. With its strong experiences and knowledge accumulated over the past few decades, Winbond designed this new product with high compatible ability and stability. It can provide strong performance in various kinds of applications. What's more critical, the most compatible memory must be defined. Winbond has very complete product lines including Specialty DRAM, Mobile DRAM and Flash memory with different densities, speed and operating voltage that can adapt to different applications. With the support of professional engineering team and a self-owned 12 inch FAB, Winbond's products are guaranteed with high quality, production capacity, and can provide all-around high competitive solutions to customers.Mobile DRAM MemoryMobile DRAM Memory is mainly a semiconductor solution to the consumer, computer, communications, and electronics products. Winbond developed the mobile DRAM devices with a low current value, which helps Winbond to extend Mobile DRAM memory applications beyond the mobile phone and tablet market to areas of mobile consumer electronics and mobile communication. Winbond Mobile DRAM devices support x8, x16 and x32 data widths. Major features for the families of products shown in the table below include the following: Sequential or Interleave burst, High Clock rate, Standard Self Refresh, Partial-Array Self Refresh (PASR), Automatic Temperature Compensated Self Refresh Rate(ATCSR), Deep Power-Down (DPD) and Programmable output buffer driver strength. Please refer to the datasheets for specific features. They are ideal for portable multimedia players, wearable devices, automotive applications, consumer electronics, gaming devices, and mobile devices.Low power LPDDR4X and LPDDR4 productsBesides high speed features of the niche memory product demands, Winbond pays great attention to their customers' needs and the development trend of Ultra-Low Power technologies, and has successfully developed a new generation of Mobile DDR products LPDDR4X to fulfill the needs of the emerging applications. LPDDR4X is the first wave of Mobile DDR products that adopts Winbond's self-developed 25nm memory processing technology, which is equipped with full professional features. It includes two series: the JEDEC defined LPDDR4X (VDDQ voltage 0.6V) and LPDDR4 (VDDQ voltage 1.1V), with 2Gb and 4Gb capabilities available. As for data transmission rate, the product series covers 3200MT/s, 3733MT/s, or even reaches 4266MT/s. In addition, KGD (Known Good Die) and 200-ball BGA package are available. Winbond Electronics will push the density of LPDDR4X/ LPDDR4 products to 8Gb in the near future, and add other new features to offer customers the choice of a more complete solution.HyperRAM productsWith the rapid rise of new IoT devices will require new functionality in terms of size, power consumption, and performance. In view of this, many MCU suppliers are developing new-generation MCUs with higher performance and lower power consumption to meet the market demand. HyperRAM is a new technical solution to address this demand. As the technology has been developed for many years and has a clear market position, Winbond Electronics has decided to join the HyperRAM camp and launches 32Mb/64Mb/128Mb density products. This move will help Winbond further expand its product portfolio to respond to the diverse application needs, as well as make the ecosystem more complete through active participation. The current status of Winbond's HyperRAM product line is: 32Mb/ 64Mb are already under mass production; 128Mb is expected to enter mass production in 1Q20 respectively. Products of 24BGA (automotive grade), 49BGA and KGD are available. Among them, size of 24BGA is 6x8 mm2, while that of 49BGA is only 4x4 mm2, which targets the consumer wearable market.KGD product offerings and expertise servicesSeveral customers utilize Winbond's expertise in using memory products in Known Good Die (KGD) for SIP (System In Package) solutions. Winbond has been providing Flash and DRAM KGD for several years since they provide cost and space efficient alternatives to packaged products. Additionally, Winbond also provides KGD services, all technical requests from customers when applying KGD to SiP process are already take under concern in the very beginning. As a result, the new product uses the "one side edge pad" design in order to make it easier to use for the customers, and also reduced the cost.For providing on-line shopping service to audiences in order to purchase series products in time, Winbond builds On-Line Direct Store and e-commerce platform to handle On-Line orders. Free Shipping for each On-Line order amounts reached US$ 150. If you are the first time to place orders via On-Line Direct Store, the extra 12% OFF discount will be applied to have further saving before the end of 2019. The Winbod's on-line shopping site is, https://www.techdesign.com/market/winbond

Both 5G cellular network technology and Internet of Things (IoT) provide advancements in performance to enhance and optimize smart applications. The modern computing resources have created and continued to explore new use-cases and scenarios to gain very popular and powerful with the values leveraging by artificial intelligence (AI) and edge computing technologies.These vast momentums encompass a large market and business opportunities. Therefore use cases are well-suited for things like Augmented Reality (AR), Ultra Low Latency Mission Critical services, Fixed Wired Access networks, Autonomous vehicles and massive IoT applications. All these innovative and smart applications are mainly driven by semiconductor products.In response to demand from security-conscious OEMs, the manufacturers of modern microcontrollers and systems-on-chip (SoCs) commonly equip their products with a broad range of security capabilities: standard, off-the-shelf 32-bit MCUs for mainstream, non-financial applications will today often feature a hardware cryptographic accelerator, a random number generator (RNG) and secure memory locations.But serial Flash memory-the location in which much of an OEM's precious intellectual property (IP) is stored-has traditionally been more vulnerable than the SoC or microcontroller. Security weaknesses in the companion Flash memory to an MCU or SoC expose OEMs to the commercially damaging risk of product theft due to the cloning of reverse engineered PCB designs.For this reason, OEMs today commonly "protect" their code storage hardware with a unique identifier (UID) stored in partitioned memory space in the Flash IC. In truth, however, a UID offers only a trivial barrier to attack. The weakness in this Flash security system is that the UID itself is not secure. It is a permanent, unchanging code number: once read out of memory, it can be used again by a non-authorized host.The solution: secure, dynamic authenticationThe remedy for this problem is easy to design in theory: The UID needs to be different every time the memory is challenged by the host. But the advantage of the fixed UID used today is its ease of implementation: It just needs to be programmed once into the Flash memory, and once into the host controller; then the two values may be simply compared to authenticate the Flash device.So how can the response to a challenge from the host be different every time, yet still recognized by the host? This is the problem that Winbond has set out to solve with its W74M family of Authentication Flash ICs.The basic method by which Winbond secures a memory's identity is through symmetric encryption: both host and memory know the same secret, a "root key". The root key is, however, never directly transmitted between host and memory (the "challenger" and "responder"). Instead, an encrypted message (a Hash-based Message Authentication Code, or HMAC) is generated by a combination of the root key and a dynamic element such as a random number.It shows two other interesting features of the W74M. First, the non-volatile monotonic counter provides a supplementary verification of the memory's authenticity. The counter starts at zero when the root key is established, and a single increment is added in response to a command issued by the host controller, meaning that the counter has a unique value known only to the memory and the host. If the counter value provided by the memory when challenged by the host does not match the host's counter value, the value of the memory's HMAC will not be the same as that computed by the host: This signal to the host processor that the W74M authentication device has been tampered with.The processor can use this knowledge to protect the host system, for instance by preventing the device which has been tampered with from gaining access to the host system's resources.This protection capability is relevant to the second feature: there are four instances of the combination of root key/HMAC/monotonic counter in each W74M device. One instance will be used for authentication of the host device's controller. The other three authentication "channels" are intended for use for example in IoT devices which have to verify their identity in order to gain access to networked services. As shown here, a different root key can be securely stored for each authentication channel, and shared with the relevant host device. This means that the root keys of the host device, of the internet gateway and of the cloud service remain secret: one device has no knowledge of another's root key.The W74M family of authentication Flash devices is available in various densities from 32Mb to 1Gb, in standard packages. This means that secure device designs which today incorporate a NOR/NAND Flash IC for code storage and an external authentication IC can replace these two chips with a single W74M package that fits in a standard Flash socket, offering a bill-of-materials cost and component count reduction while providing the most secure level of authentication.For providing on-line shopping service to audiences in order to purchase series products in time, Winbond builds On-Line Direct Store and e-commerce platform to handle On-Line orders. Free Shipping for each On-Line order amounts reached US$ 150. If you are the first time to place orders via On-Line Direct Store, the extra 12% OFF discount will be applied to have further saving before the end of 2019. The Winbod's on-line shopping site is, https://www.techdesign.com/market/winbond

With the rapid rise of automotive electronics, industrial 4.0, and smart home applications, new IoT edge devices and human-machine interface devices will require new functionality in terms of size, power consumption, and performance. In view of this, many MCU suppliers are developing new-generation MCUs with higher performance and lower power consumption to meet the market demand. In addition, from the overall system design perspective, the RAM that works with the MCU also requires new options to provide better advantages than those of the existing SDRAM and pSRAM.HyperRAM, which supports the HyperBus interface, is a new technical solution to address this demand. HyperBus technology was first unveiled by Cypress in 2014, and the company launched its first HyperRAM product in 2015. As the technology has been developed for many years and has a clear market position, Winbond Electronics has decided to join the HyperRAM camp and launches 32Mb/64Mb/128Mb density products. This move will help Winbond further expand its product portfolio to respond to the diverse application needs, as well as make the ecosystem more complete through active participation.Benefits of using HyperRAMHans Liao, Technology Manager of DRAM Market at Winbond, said, "Low pin count, low power consumption, and easy control are the three key features of HyperRAM that make it can significantly improve the performance of end devices."He explained that the computing power, data processing and image display functions of traditional MCUs are limited. However, the new IoT devices for automotive, industrial, smart home, and wearable often adopt touch panel as image control interface, or require stronger edge computing functions for image processing and speech recognition. Therefore, the new-generation higher performance, lower power MCU market is emerging.For IoT applications, various design considerations such as low cost, low power consumption, and computing efficiency must be met in order to gain widespread adoption in the market. Especially, for battery-powered devices such as smart speakers and smart meters, battery life has become the key to the success of the product, in addition to the rich IoT function and easy-to-use human interface. This makes low power consumption increasingly important. To achieve long battery life, in addition to using power consumption MCU, the other low-power peripheral components should also be considered, and HyperRAM is designed for this.Take Winbond's 64Mb HyperRAM as an example, the power consumption of Standby is 90uW@1.8V, while that of the same capacity SDRAM is about 2000uW@3.3V. More importantly, power consumption of HyperRAM has only 45uW@1.8V in Hybrid Sleep Mode, which is a significant different from the Standby mode of SDRAM. On the other hand, if Low Power SDRAM is adopted, the form factor is still bigger than HyperRAM. That makes it not an ideal solution as Low Power SDRAM requires larger PCB area.In addition, HyperRAM has only 13 signal pins, which can greatly simplify the PCB layout design. It also means that when designing end products, allowing MCU to have more pin out for other purposes or using MCU with fewer pins for better cost-effectiveness is made possible.Simplifying control interface is another feature of HyperRAM. Based on pSRAM architecture, HyperRAM is a self-refresh RAM. Moreover, it can automatically return to standby mode. Therefore, system memory is easier to use, and the development of firmware and drivers is also simplified.New force of HyerRAM ecosystemSierra Lai, Director of DRAM Marketing Division at Winbond, added that the process nodes of MCU are moving from 55nm, 40nm to 28nm, or even 16nm. Although its size can meet the IoT miniaturization trend, it still needs to use new generation external memory as a data buffer to address the higher computing capabilities required by IoT applications.However, the development of traditional SDRAM and pSRAM have matured and cannot be optimized for emerging IoT applications. Also, the DRAM process migration is based on the new generation JEDEC DDRx/LPDDRx products. Winbond's HyperRAM, which adopts 38nm process node, will continue to move toward 25nm. Considering the long-term supply requirements for automotive and industrial applications, the advanced process nodes of Winbond's HyperRAM can meet customers' longevity product lifecycle.Therefore, from the perspective of overall system design and product life, HyperRAM has become an ideal choice for emerging IoT devices. "We saw the market demand, so we decided to develop HyperRAM products to provide customers with another choice," Sierra Lai stressed. "The maturity of its ecosystems is of course an important factor for us to move into."At present, in addition to Cypress, leading MCU companies such as NXP, Renesas, ST, and TI have already provided MCUs that support HyperBus interface, and their new products will continue to support in the future. Meanwhile, its development platform of control interface is ready. Cadence, Synopsys and Mobiveil have also begun to provide HyperBus memory control IP, which can accelerate IC vendors' design cycle. As a result, compared to other Octal RAMs, HyperRAM has the most mature application environment. HyperRAM will also be incorporated into JEDEC standard in the future, becoming a JEDEC compatible technology.After Winbond joined the HyperRAM camp, it will become the third supplier in the market in addition to Cypress and ISSI, which can provide customers with more choices.Sierra Lai believed that the low pin count and low power characteristics of HyperRAM will bring significant advantages to IoT devices. As the market gradually heats up, more customers will begin to adopt this new generation memory.The current status of Winbond's HyperRAM product line is: 32Mb has entered mass production; 64Mb and 128Mb are expected to enter mass production in 4Q19 and 1Q20 respectively. Products of 24BGA (automotive grade), 49BGA and KGD are available. Among them, size of 24BGA is 6x8 mm2, while that of 49BGA is only 4x4 mm2, which targets the consumer wearable market.HyperRAM, which supports the HyperBus interface, is a new technical solution to address this demand

Karamba Security, a world-leading provider of embedded cybersecurity for connected machines, today announced a collaboration with Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions and a pioneer in certified secure memories, to enhance embedded software security in automotive and other connected industries. OEMs and tier ones use Karamba's embedded cybersecurity solutions for connected systems to protect their software and reduce vulnerability exposures. Under the new partnership, Karamba will offer enhanced hardware security with the use of Winbond's secure memories.The Karamba and Winbond collaboration will provide cybersecurity offerings that leverage Winbond's TrustME secure flash memories with Karamba's embedded security policy. Winbond's family of secure memories combines its world class NOR flash manufacturing process and state-of-the-art hardware security technology. The company's offerings range from the world's first and most secured EAL5+ Common Criteria certified flash memory device to cost effective EAL2 and Arm PSA certified memory devices.Winbond's secure memory with tamper resistance allows Karamba's Runtime Integrity security to focus on performance excellence, automatically hardening the full image of the connected system and preventing modification of the factory settings."Teaming with a pioneer in certified secure memories enables us to improve security while maintaining the high-performance characteristics required in automotive and industrial systems," said Ami Dotan, Karamba Security's co-founder and CEO. "More than ever, autonomous vehicles, industry 4.0 controllers, and enterprise IoT edge devices need security technology that is embedded in them and which does not impact performance. Partnering with Winbond, with its certified secure memories, strengthens our commitment to offer state-of-the-art cybersecurity solutions and increases customer trust in our solutions."Karamba's Control Flow Integrity (CFI) is becoming an industry requirement in automotive embedded systems and is expanding to other industries, making this collaboration a natural one," said Hung-Wei Chen, Director of Winbond Secure Flash Memory Marketing."Security is everyone's business, and every layer must take part in securing the overall system, so memory with built-in security is becoming indispensable. Winbond's Common Criteria certified production site guarantees secured production, software programing, and key provisioning for connected systems. Partnering with Karamba complements our security offerings and allows us to provide comprehensive solutions to our customers."Learn more by visiting Karamba Security at AutoISAC Summit on October 23-24th in Plano, Texas.About Karamba SecurityKaramba Security provides industry-leading embedded cybersecurity solutions for connected systems. Product manufacturers in automotive, Industry 4.0, IoT, and enterprise edge rely on Karamba's automated runtime integrity software to self-protect their products against Remote Code Execution (RCE) cyberattacks with negligible performance impact. After 32 successful engagements with 17 automotive OEMs and tier 1s, product providers trust Karamba's award-winning solutions for compliance and increasing their brand competitiveness when protecting their customers against cyberthreats.More information is available at www.karambasecurity.com and follow us on Twitter @KarambaSecurity.About WinbondWinbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM and Code Storage Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.Winbond's headquarters is in Central Taiwan Science Park (CTSP) and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong. Based in Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.Winbond's TrustME secure flash memories with Karamba's embedded security policy

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that its innovative SpiStack dual-die NOR+NAND code storage product has been included on NXP Semiconductors FRWY-LS1012A board for use with its Layerscape LS1012A communications processor.NXP chose Winbond's W25M161AW SpiStack product for its new FRWY-LS1012A development board for the LS1012A processor. The W25M161AW provides 16Mbits of serial NOR Flash memory for the board's boot code, and 1Gbit of serial NAND for its Linux operating system.Winbond is demonstrating its SpiStack product running on the FRWY-LS1012A board at its booth 721 during the 2019 Flash Memory Summit (Santa Clara Convention Center, California, 6-8 August).The stacked-die construction of the SpiStack products and the software Chip Select capability developed by Winbond enable a serial NOR Flash die for fast boot and a serial NAND die for high memory density to be accommodated in an 8-terminal WSON package with a standard 8mm x 6mm footprint and pin-out."The W25M161AW SpiStack device provides the perfect pairing with our Layerscape LS1012A SoC," commented Jeff Steinheider, director, product marketing, NXP Industrial Applications Processors. "The W25M161AW saves board real-estate for compact designs with the LS1012A, while still providing 1Gbit of storage for a full featured Linux OS."Visitors to Winbond's booth at the Flash Memory Summit can also view demonstration systems exhibiting the industry-best Read performance of its W25N01JW High Performance Serial NAND product. The W25N01JW offers a new high data-transfer rate of 83MB/s via a Quad Serial Peripheral Interface (QSPI).Winbond's new High-Performance Serial NAND technology also supports a two-chip dual-quad interface which gives a maximum data transfer rate of 166MB/s.This high-speed Read operation, some four times faster than existing serial NAND memory devices offer, means that the new W25N01JW chip can replace SPI NOR Flash memory in automotive applications such as data storage for instrument clusters or the Center Information Display (CID).This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of 7" and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher. At these capacities, serial NAND Flash has a markedly lower unit cost than SPI NOR Flash, and occupies a smaller board area per Mbit of storage capacity.Syed S. Hussain, Director Segment Marketing at Winbond, said: 'Winbond's TECHNOLOGY at the Flash Memory Summit is proof of our continued commitment to product development in the low- to medium-density specialty memory sector. The SpiStack and High Performance Serial NAND products are great examples of the way that Winbond invents creative solutions to enable our customers to get the storage capacity and performance that they need in small packages at a competitive cost.'Both the W25M161AW and W25N01JW are available now in production volumes. More information may be found at www.winbond.com.About WinbondWinbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM and Code Storage Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.Winbond's headquarters is in Central Taiwan Science Park (CTSP) and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong. Based in Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.About Flash Memory SummitFlash Memory Summit, produced by Conference ConCepts, showcases the mainstream applications, key technologies, and leading vendors that are driving the multi-billion dollar non-volatile memory and SSD markets. FMS is now the world's largest event featuring the trends, innovations, and influencers driving the adoption of flash memory in demanding enterprise storage applications, as well as in high-performance computing, automotive, mobile, and embedded systems.SpiFlash and SpiStack are registered trademarks of Winbond Electronics Corporation. All other product names that appear in this material are for identification purposes only and are acknowledged trademarks or registered trademarks of their respective companies.Winbond's W25M161AW SpiStack product in an 8mm x 6mm package provides 16Mbits of NOR Flash for boot code and 1Gbit of NAND for a Linux or other full-featured operating system

The booming IoT market, such as automotive and industrial applications, has brought new opportunities to Winbond Electronics, a leading provider in the low- and medium-capacity memory market. In order to showcase its achievements of enabling system innovation through technology enhancement in recent years, Winbond will showcase a range of new products, including ultra-low-power DRAM, 1.2V NOR Flash, serial code storage Flash, secure Flash and so on, at Electronica 2018, which will be held on November 13th.With its unique high quality, high performance and special-designed memory portfolio, Winbond will demonstrate the innovative solutions that it has built for the emerging IoT and automotive electronics market, as well as the significant benefits that it can bring to system companies.Demonstrating innovative DRAM and Flash products"At Electronica, we will demonstrate the innovative products that we developed from a system perspective to our existing and potential customers," said Tung-Yi Chan, president of Winbond Electronics. In order to showcase its new products, the company not only increases its exhibition space but also develops several SoC design-in demo boards, allowing customers to experience the superior performance of Winbond products. Moreover, activities such as Webinar and forum speech are held, in a bid to make the industry know better about its product portfolios.He stressed that Winbond has transformed from relying on the commodity DRAM market to a key supplier of the specialty DRAM market. In addition, from last year, DRAM and Flash businesses have accounted for half of its revenue respectively. Winbond has now established a unique growth model of two business drivers, with own process technology and brand. It is hoped that by expanding participation in this important event, Winbond can emphasize its new market positioning and strive for greater visibility in the global market.Although Winbond has a market share of only 1% in DRAM market, it holds an important position in the specialty DRAM market. With its high performance, high quality, stable and long-term supply capabilities, Winbond has become a trusted strategic partner of many world-class companies and is able to meet the special requirements of customers.Besides its special market positioning, company image, and superior product development capabilities, Winbond has established its own DRAM process technology after years of efforts. Its first-generation DRAM process technology (38nm) has moved into mass production in third-quarter 2017 and the second-generation DRAM process technology (25nm) also entered mass production in fourth-quarter 2018. The company is now developing the third-generation DRAM process technology, which is scheduled to ramp up at the new fab in Kaohsiung. At Electronica, Winbond will showcase the specialty DRAM developed by itself, with capacities up to 4Gb, to expand product line and competitiveness, as well as the ultra-low power DRAM, which is specially designed to meet the low power requirement of IoT applications.As for Flash products, Winbond will exhibit a full range of NOR Flash, SLC NAND Flash, and Secure Flash products, highlighting its complete product portfolio.First, when talking about NOR Flash, Tung-Yi Chan pointed out that, as a leader in NOR Flash market, Winbond has successfully driven the evolution of parallel NOR Flash to the serial interface, and now has become the world's number one serial NOR Flash provider. In addition to a full line of serial NOR Flash products, Winbond will also exhibit the innovative NOR+NAND SpiStack Flash product, which is the best system solution to meet the code and data storage requirements.Another highlight is the newly launched 1.2V serial NOR Flash and it will be demonstrated with a SoC design-in board. By reducing the operating voltage of NOR Flash from 1.8V to 1.2V, it can meet the low power requirements of emerging IoT applications.As for NAND, Winbond is trying to repeat the history that it created in the NOR market, upgrading the current parallel NAND Flash to the serial interface. Therefore, existing NOR customers can easily upgrade to higher capacity serial NAND, which is more cost-effective, to meet the code storage requirement of the increasingly complicated systems.Winbond's SLC NAND Flash is different from traditional products. Through its own special process technology and design, it not only meets the high-quality standard of automotive-grade products but also has comparable speed and performance to NOR Flash."Our vision is to provide a full range of code storage Flash products from Mb to Gb, with low-pin-count, high-speed, and high-quality features, so customers no longer need to distinguish which architecture they use," Tung-Yi Chan said. "Moreover, compared to high-density NOR, NAND is very cost-effective. System customers will benefit from a reduction in footprint and cost. This will open up a new market and change the entire ecosystem."On the other hand, in order to solve the security issue for IoT applications, with Winbond's comprehensive strength in code storage Flash, it has developed a series of "Secure Flash" products to meet the various requirements of system security, by adopting an innovative "secure interface" architecture and the "secure logic" functions. The products can be used for a wide range of applications, from low-end door locks to high-end ePayment and have passed the Common Criteria EAL certification. At Electronica, Winbond will demonstrate multiple end devices that are jointly developed with system customers, including IP camera & Ethernet with authentication, robot arm with security, MCU with external secure Flash, smartphone with eSIM, and so on.A new fab is set to build for future growthWith the rise of IoT and the automotive electronics market, the demand for memory will be ubiquitous. Tung-Yi Chan said that Winbond will target at the top-notch companies in each market segment to holistically expand its business. "By providing total memory solutions, working closely with customers to help them improve their system performance is critical to us. These leading customers demand high quality, high-performance components, and we must be able to provide innovative products from the perspective of system design, in a bid to enhance our value and create business opportunities.""From the range of products we exhibit, we can see that our solutions are well prepared to address the various requirements of security, low power, cost-effectiveness and high performance for IoT applications. This fully demonstrates our innovation capabilities of differentiating our products through customized technologies," he said. "The launch of Secure Flash products also shows that our products have been expanded to the system level, in a bid to pursue the "Smart Memory" vision."With the emergence of new market demands, Winbond recently announced that it will establish a new 12-inch fab in Kaohsiung to expand capacity. With its strong foundation in diverse product lines, own process technology, and strategic partnerships with customers, it will strive to fulfill the rapidly increasing demands for a wide range of application. By deepening DRAM and Flash technologies to build the unique product mix and technology capabilities, it is believed that Winbond will be able to drive the innovation of next-generation IoT and automotive electronic devices, creating broader business opportunities in the future.Winbond Electronics at Electronica 2018 B5-520

Demand for automotive memory is showing explosive growth in recent years as a result of maturing ADAS technology, increasing demand for in-vehicle infotainment systems and automotive display as well as instrument cluster display gradually upgrading from conventional 4.5-inch panels to 12.3-inch smart panels.Take automotive display for example. In-vehicle displays are growing in bulk and dimensions to meet a range of demands arising from infotainment, safety and telematics. According to IHS, worldwide shipments of components for automotive displays will enjoy a CAGR of 6% through year-end 2021, totaling 176 million units. It is estimated the number of 7-inch and larger automotive displays will top 33.5 million units, representing a CAGR of nearly 10% through 2021.The changes in these in-vehicle systems will spur considerable growth of automotive data, and the required memory capacity, data transfer rate, reliability level and safety features must make advances as well. IC Insights reported that consumer demand for safer driving systems and government mandates are expected to raise the automotive IC market by 22% to a market value of US$28 billion in 2018. Rising DRAM and memory prices will further boost growth of the automotive IC market, with product costs expected to increase 22.4% in 2018.Reliability is a top concern for automotive electronics componentsReliability remains a top concern when manufacturers select the automotive components they use. As an integral part of the automotive industry chain, the design and manufacture of automotive electronics has to take a wide range of possible use scenarios into consideration to ensure safety. Although automotive memory does not directly enforce safety protection, its performance may have an influence on road safety. Aside from safety features, data retention is also among automakers' considerations when choosing automotive memory. SPI NOR flash has long dominated the automotive memory market mainly because of its superior data retention characteristics, which is also the reason for its widespread use by the automotive industry.However, the automotive memory market has started to show some changes since 2017. In the present automotive market, ADAS and instrument cluster applications have been driving fast growth in demand for automotive memory, and new requirements have also been constantly emerging. There are particularly immense needs for features such as high density and instant boot.For example, automakers generally require electronics systems be able to load the operating system, transmit data and boot up into normal operation within one second. If some of the tasks, such as data transmission, can be optimized, the system will be able to boot up faster.In view of this, William Chen, deputy director, flash product marketing center, Winbond, thinks NOR flash is suitable for applications with a small memory footprint. However, for use scenarios where a large amount of data needs to be sent to DRAM instantly, such as automotive applications, and where error-correcting code (ECC) is required, automotive grade NAND flash solutions are a new trend.High performance, optimal reliability and low cost: Winbond's new Serial NAND is gaining traction in the automotive marketAutomotive applications such as instrument cluster and center information display (CID) will growingly require memory solutions with high density, large capacity and instant data transfer in line with booming developments in the automotive market. Automotive memory needs have grown from NOR flash with densities ranging from 64Mb to 512Mb that were able to support most cars in the past, to 1-2Gbit today and the costs will increase accordingly as well, commented William.In response, automakers can use embedded multimedia card (eMMC) as an alternative but it is more suitable for high-end instrument clusters. To meet the memory needs by entry-level and mid-range automotive applications, Winbond has introduced a High Performance Serial NAND product family ranging in density from 1Gb to 2Gb with a 4Gb product on the roadmap.Serial NAND in 8-pin packages offers cost advantages compared to the previous generation parallel flash products with the smallest package offered in 48-pin packages. It also offers higher performance than Parallel NAND as it uses Winbond's proprietary Continuous Read technology to achieve a data read and transfer rate surpassing earlier-generation products.As a matter of fact, 70% of Serial NAND used to be integrated in network communication equipment (ADSL, XDSL and G-PON) and 30% was used in industrial (safety and protection) applications. With respect to memory use in automotive platforms, manufacturers placed more emphasis on NOR flash in the past but have begun to make some changes. Starting from 2017, many tier-1 automotive system vendors have been evaluating the adoption of Serial NAND, according to Winbond."This is because the new High Performance Serial NAND enables a data transfer rate four times faster than Parallel NAND and other Serial NAND currently on the market," said Wilson Huang, manager, electronics product marketing division I, Winbond. In terms of hardware specifications, the company's solution is housed in the same package as conventional NOR flash on the market, so compatibility will not be an issue.Transferring data at 80MB/s, which far exceeds competing NAND flash on the market, Winbond's new solution accelerates instrument cluster boot-up time. It also supports dual-quad I/O interface to accommodate higher storage density or data transfer rate up to 160 MB/s. The selection allowing for single, dual and quad I/O means customers can enjoy more flexibility compared to what competitors can offer.In the past when the industry could provide memory mostly with single I/O, Winbond was already capable of offering quad I/O solutions. Now, staying committed to bringing new innovations, Winbond further boosts data transfer rate through architecture design ingenuities to meet customers' applications requirements.According to William, SoCs are streaming data on the data bus of the next-generation ADAS and instrument cluster at a maximum of about 200 MB/s. Winbond's solution through dual-quad I/O interface can support 80% of the data flow.Winbond's High Performance Serial NAND is an SLC NAND and is more reliable and cost-effective than automotive eMMC solutions on the market. Compared to NOR flash, Winbond's High Performance Serial NAND has a superior cost-performance ratio.Furthermore, Winbond's High Performance Serial NAND is an AEC-Q100 compliant NAND flash with an operating temperature range between -40 degree C and 105 degree C. In terms of data retention characteristics, Winbond's High Performance Serial NAND can support 10 years of data retention at 85 degree C after 1,000 cycles, whereas eMMC can only support data retention for a fraction of that time under the same conditions even when used in pSLC mode."Winbond looks to replace high density NOR flash with high quality automotive grade NAND flash," said William. The current automotive display, ADAS and other automotive applications still largely use high density NOR flash, ranging from 256 Mbit to 1Gbit. Winbond's High Performance Serial NAND offers both cost and performance advantages and stands a chance of taking over a share of the high density NOR flash market. In addition, Winbond, with its in-house fabrication capacity, has full control over the manufacturing process and therefore can guarantee long-term steady supply to customers.As more cars become connected, the demand for data storage is expected to reach 1TB by 2020. Many world-leading memory suppliers have been expanding into the automotive industry. Winbond's High Performance Serial NAND, leveraging its Continuous Read technology and lower packaging cost, will be able to meet the automotive industry's stringent requirements for high performance, high reliability and low cost components.Winbond's serial NAND

SpringSoft on August 24 announced Winbond Electronics has adopted its Laker layout tools and design flows for its mobile memory devices such as SDR, low power DDR and cellular RAM.The Laker system provides easy-to-use, automated tools including routing solutions that enable Winbond design teams to achieve significant time savings at both the block and chip level, schematic-driven layout (SDL) flow to increase user productivity, and built-in scriptable cells that dramatically reduce cell library development time, SpringSoft said in a statement."Using Laker, our design teams have been able to drastically cut routing and verification cycles for 65nm designs compared to other layout tools, while also continuously modifying designs to ensure the optimum power and highest quality implementation," said Mu-Tsai Lo, deputy director of the DRAM Design Department III at Winbond.SpringSoft claimed that more than 300 companies have adopted its Laker layout system for designs down to 28 nanometers.

Elpida Memory on August 6 announced that it has reached an agreement with Qimonda, which is now in insolvency proceedings, to acquire the Germany-based chipmaker's technology licenses and a portion of the design assets related to graphics DDR (GDDR) chips.Elpida also disclosed it is scheduled to volume ship 1Gb GDDR3 and 1Gb GDDR5 in the first half of 2010. The new graphics DRAM chips will be outsourced to Winbond Electronics, said the Japan-based memory maker, adding that the mass production of 2Gb GDDR5 is expected to take place at its Hiroshima Plant starting in the second half of the year.Elpida's GDDR technology development will be mainly operated at its recently-built Munich Design Center, where nearly 50 engineers and other former Qimonda employees involved in the development work will take up new posts.Elpida said it is looking to quickly ramp up a full-fledged GDDR business, while acknowledging the increased demand for applications such as game consoles."Graphics systems now need graphics buffer memory with a data transfer rate of more than 5Gb/sec given the rapidly growing popularity of high-definition format graphics data, 3D graphics and various display formats," said Elpida CTO Takao Adachi. "In response to this need we will shortly begin commercial production of GDDR5, for which an even faster data transfer rate of 8Gb/sec may be feasible in the near future.