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Tuesday 25 May 2021
Murata, Cooler Master announce ultra-thin vapor chamber
Murata Manufacturing and Cooler Master have jointly developed a vapor chamber with thickness of only 200um for electronics devices.
Monday 24 May 2021
GUC announces GLink-3D die-on-die interface IP using TSMC N5 and N6 process for 3DFabric advanced packaging technology
Global Unichip Corp (GUC), the advanced ASIC leader, announces GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes and 3DFabric advanced packaging technology for AI, HPC, and networking applications.
Thursday 20 May 2021
Sintrones welcomes growth opportunities for electric vehicles with in-vehicle computer solutions
Sintrones' in-vehicle computers offer a complete solution for in-vehicle applications, including driver behavior monitoring and self-driving capability. They have high flexibility, support a wide range of peripherals and connectors, and can be adapted to various vehicle management systems...
Tuesday 18 May 2021
ADLINK's die bond solution helps realize fast, high-precision advanced packaging for semiconducting industry
Semiconductor chips have been the hottest trending topic recently due to their indispensability in all types of applications, including automobiles, mobile phones, military weapons, and space technology, etc...
Wednesday 12 May 2021
FSP releases battery chargers for AGV and AMR
The pandemic has changed people's way of life. Changes in the consumption habits of the general public have led to rapid e-commerce and shipping market growth. Logistic processing efficiency has become one of the key capabilities of competing business owners...
Tuesday 11 May 2021
Bureau Veritas provides complete Wi-Fi 6E certification services to help clients reduce time to market
As the world gets shrouded in COVID-19, low contact has become an essential element in daily lives and work modes in order to prevent the spread of the virus. Under such circumstances, equipment connectivity has gradually become common; the demand for stable and high-speed wireless communication technology has greatly increased; and the role of Wi-Fi 6 will become increasingly important...
Tuesday 11 May 2021
ADLINK launches high-speed, high-precision probe solutions, enhancing semiconductor inspection efficiency
The recent global shortage of automotive chips has brought Taiwan's semiconductor industry into the focus of worldwide attention. The real cause of why Taiwan's semiconductor chips are in such great demand is due to their trusted, unwavering quality that's supported and assured by a series of rigorous verification procedures...
Monday 10 May 2021
APD will present a new series of medical power supplies and lithium-ion UPS at CMEF 2021
The CMEF (China International Medical Equipment Fair) is one of the biggest exhibitions of its kind in the world and always shows the latest professional medical equipment available on the global market. The 2021 exhibition will be held between May 13 and 16 at the National Exhibition and Convention Center (Shanghai)...
Thursday 6 May 2021
DataVan International Corporation acquires Maincon Corporation to enhance strengths in retail smartization
Changes in consumption habits are urging retailers to accelerate the pace of smartization. Under this trend, the weight carried by POS systems and kiosks, which play important roles in the operation of physical stores, will gradually increase...
Tuesday 27 April 2021
T-Global integrates supply chain through thermal module designing services
In this 5G era, diverse environments have led communications systems and equipment suppliers to find different development opportunities...