Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, has revealed that its low-power, high-performance LPDDR4X DRAM technology is supporting the latest breakthrough in edge computing from Flex Logix for demanding artificial intelligence (AI) applications such as object recognition.The Winbond LPDDR4X chip is being paired with Flex Logix's InferX X1 edge inference accelerator chip, which is based on an innovative architecture that features arrays of reconfigurable Tensor Processors. This provides higher throughput and lower latency at lower cost than existing AI edge computing solution when processing complex neural networking algorithms such as YOLOv3 or Full Accuracy Winograd."We chose the Flex Logix InferX X1 edge accelerator because it delivered the highest throughput per dollar, which is critical to drive volume mainstream applications," said Robert Chang, Technology Executive of DRAM Product Marketing Center at Winbond. "The price/performance advantage of using InferX with our LPDDR4X chip has the potential to significantly expand AI applications by finally bringing inference capabilities to the mass market."To support the InferX X1's ultra-high speed operation while keeping power consumption to a minimum, and Max 7.5TOPS, Flex Logix has paired the accelerator with the W66CQ2NQUAHJ from Winbond, a 4Gb LPDDR4X DRAM which offers a maximum data rate of 4267Mbps at a maximum clock rate of 2133MHz. To enable use in battery-powered systems and other power-constrained applications, the W66 series device operates in active mode from 1.8V/1.1V power rails, and from a 0.6V supply in quiescent mode. It offers power-saving features including partial array self-refresh.The Winbond LPDDR4X chip operates alongside the InferX X1 processor in Flex Logix's half-height/half-length PCIe embedded processor board for edge servers and gateways. The system takes advantage of Flex Logix's architectural innovations, such as reconfigurable optimized data paths which reduce the traffic between the processor and DRAM, to increase throughput and reduce latency.Dana McCarty, VP of Sales & Marketing for Flex Logix's AI Inference Products said, "The combination of the unique InferX X1 processor and Winbond's high-bandwidth LPDDR4X chip sets a new benchmark in edge AI performance. Now for the first time, affordable edge computing systems can implement complex neural networking algorithms to achieve high accuracy in object detection and image recognition even when processing data-intensive high-definition video streams."The 4Gb W66CQ2NQUAHJ is comprised of two 2Gb dies in a two-channel configuration. Each die is organized into eight internal banks which support concurrent operation. The chip is housed in a 200-ball WFBGA package which measures 10mm x 14.5mm.For more information about 1Gb SDP (CS in H1'22), 2Gb SDP, 4Gb LPDDR4/LPDDR4X products, go to www.winbond.com.For more information about the InferX X1 edge inference accelerator, go to flex-logix.com/inference.Winbond's low-power, high-performance LPDDR4X DRAM

Digital transformation of the manufacturing sector driven by Industrial Internet of Things (IIoT) and autonomous driving enabled by Internet of Vehicles (IoV) are key focus areas of today's industrial development and they offer tremendous business opportunities. In particular, with 5G commercialization kicking off, vendors have high hopes for the explosive market potential to be ignited by 5G, featuring low latency and high-speed data transmission.However, flourishing market developments also introduce rising cybersecurity risks to the diversity of connected devices. There have been frequent reports about manufacturers under cyberattacks. It is foreseeable that cybersecurity risks will only multiply when the Internet of Everything (IoE) era is here. Accordingly, both suppliers that look to capture preemptive IoT opportunities and manufacturers that want to undertake digital transformation cannot afford to overlook the importance of how to meet the latest cybersecurity requirements.During a recent interview, TUV NORD management gave an in-depth look into IEC 62443, a series of standards aimed to address the security of industrial automation and control systems (IACS), Automotive Software Performance Improvement and Capability Etermination (ASPICE), which provides the framework for software development and capability test in the automotive industry, and ISO/SAE 21434, which provides standardized cybersecurity engineering elements for vehicles. TUV NORD hopes to keep vendors abreast of the latest standards and enable them to begin early preparation and to foster a cybersecurity culture so that they can capture rising opportunities and ensure sustainable success.Becoming the target of cyberattacks, manufacturers must deal with IACS cybersecurity threatsAccording to David Lin, Senior Technical Manager, Industrial Service, TUV NORD, manufacturers have always focused on safety, making efforts to prevent equipment failure from causing harm to human safety. However, when factory machines now become connected to networks, manufacturers have to start taking into consideration how security will affect safety. IEC 62443 was established with an aim to address this issue. It provides a set of standards for IoT applications that complement what was missing from operational technology (OT) security frameworks in the past. The IEC 62443 standard is different from the Common Criteria for Information Technology Security Evaluation (referred to as Common Criteria or CC), which the IT industry has long been practicing.Jack Liao, Senior Manager, Product Certification, Industrial Service, TUV NORD, added IEC 62443 makes it clear that it is aimed to ensure the availability of critical infrastructure such as harbors, power plants, docks and airports and prevent cybersecurity breaches from disrupting services. It is not the same as ISO 27001, which is a specification for an information security management system that highlights data confidentiality.This is also why the EU is strongly promoting IEC 62443 as IACS standards. When cyberattacks are launched against a country, it is imperative that infrastructure services maintain continuous operation without interruption. The same is true in the case of Taiwan, nicknamed Silicon Island. Should the semiconductor supply chain that Taiwan takes great pride in fall under cyberattacks, the global market will feel the impact.This sheds light on the importance of IEC 62443 and the challenges it is intended to address. Within the vast scope of IACS cybersecurity, IEC 62443 highlights "defense in depth," a multi-layered defense mechanism with several levels of security requirements distributed throughout the system from the outer layer management to the core product technology. More specifically, taking network devices for example, IEC 62443 specifies requirements for each of the seven layers of the Open Systems Interconnection (OSI) model, enabling all-round protection against any potential cybersecurity threat.IEC 62443 includes four parts - General, Policy and Procedure, system and Component. Taiwan-based manufacturers have to pay attention to establishing a management system that guarantees the security of the connected devices and minimizes the risks of cyberattacks. With global IACS manufacturers taking the lead in obtaining IEC 62443 compliance certification, Taiwan-based IACS manufacturers have to follow suit so as to be able to enter the global market and capture the next wave of opportunities. In the meantime, they also need to build up IEC 62443 compliant development processes and create IEC 62443 compliant products.David Lin noted that although parts of the IEC 62443 standard are still under development, the quantity of certificates issued worldwide has increased from three in 2019 to more than 50 in 2020, indicating the new standard is growingly accepted. With EU mandating IEC 62443 compliance for all infrastructure equipment by year-end 2023, IEC 62443 will become widespread and vendors should take early action and get a closer look at IACS cybersecurity.Three main automotive electronics standards ensure information security and functional safetyAmong automotive network security standards, the Cyber Security Management System (CSMS) and ISO/SAE 21434 are two new sets of standards. According to Jack Liao, CSMS and ISO/SAE 21434 can be considered as extensions of IEC 62443. CSMS focuses on the management system while ISO/SAE 21434 addresses the technology and development process.In line with the spirit of IEC 62443, CSMS and ISO/SAE 21434 also highlight availability and defense in depth with an aim to ensure cybersecurity for automotive networks. CSMS is set to go into effect in January 2021. EU will mandate a certified CSMS for approval of new vehicle types from 2022 and for first registrations of all existing vehicle types by 2024.As to ISO/SAE 21434, which looks at cybersecurity engineering and the entire development process, there is currently only a draft version as IEC 62443 is still under development. The finished version is not expected until the first half of 2021. Nevertheless, with automakers strongly promoting ISO/SAE 21434, all automotive electronics component suppliers will have to get ready to meet their customers' requirements.Apart from automotive network security, automotive electronics suppliers also need to take functional safety standard ISO 26262 and ASPICE into consideration.David Lin thinks ISO/SAE 21434, ISO 26262 and ASPICE are the three indispensable elements to Taiwan-based suppliers looking to foray into the automotive electronics market.In practice, ISO/SAE 21434 and ISO 26262 focus more on the methodology while ASPICE provides a framework that connects the development process. As such, suppliers are advised to first incorporate the ASPICE process and then based on that, introduce the ISO/SAE 21434 and ISO 26262 frameworks to reap the biggest benefit.Jack Liao added that ISO/SAE 21434 and ISO 26262 are similar in that they are both based on a V-model as a reference process model for the different phases of product development. The difference is that the former targets information security and the latter functional safety. As software will play a critical role in autonomous driving in the future, if suppliers develop software using the ASPICE process, they will be able to ensure robust security for the entire automotive electronics system. Taiwan-based automotive electronics suppliers including developers of IC chips, software, modules and subsystems all need to follow ISO/SAE 21434, ISO 26262 and ASPICE to build their products in accordance with their product's characteristics.In conclusion, Jack Liao emphasized that IEC 62443, ISO/SAE 21434 and ISO 26262 are all established with an aim to drive security policy formation and foster security culture. This has to be a full-scale effort by every level of the corporation from top to bottom. Only by doing so can a corporation internalize cybersecurity awareness instead of just using the security certification to penetrate into the market.As a wide variety of IoT applications reach maturity over the next few years, cybersecurity incidents will skyrocket. It should be noted that all these cybersecurity standards will go into effect by 2024. It is essential that suppliers take early action and actively build up a cybersecurity culture to enable themselves to overcome future security challenges and capture rising opportunities.Jack Liao (right), senior manager of Product Certification and David Lin (left), senior technical manager, Industrial Service, TUV NORD

Fibocom, a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules, releases its latest 5G LGA module FG360 during the CES 2021 event. The module is based on the MediaTek chipset platform and will be available in two versions. FG360-EAU will be launched for EMEA/APAC markets, and FG360-NA will be launched for the North American market.FG360 is a 5G module with high integration, high data rate and great cost performance. It is designed based on MediaTek's T750 chipset platform which adopts a 7nm compact design with a 5G NR FR1 modem, a quad-core Arm Cortex-A55 processor and rich essential peripherals all integrated on a single chipset. Through a high degree of integration, the FG360 module enables customers to design their products with the best performance and the most optimal cost.FG360 supports 5G Sub-6GHz 2CC Carrier Aggregation 200MHz frequency to improve the utilization of spectrum resources and ensure an extended 5G coverage. FG360 can support SA peak rate downlink up to 4.67Gbps and uplink up to 1.25Gbps, enhancing the 5G wireless experience of customers. FG360 can also support multiple WIFI connections such as 5G 4×4, 2.4G 4×4, and 5G 2×2+2.4G 2×2 dual-band Wi-Fi 6, allowing smart end devices to enjoy the full benefits of high-speed 5G + WIFI 6 connectivity.FG360 has faster transmission speed, better carrying capacity, and lower network latency. It supports both 5G SA and NSA network architectures and compatible with 5G NR, LTE and WCDMA standards, eliminating customers' investment concerns at the initial stage of 5G construction and responding to the commercial demand for rapid landing. FG360 comes with a rich set of interfaces including USB3.1, PCIe3.0, SPI, SDIO, GPIO, UART, etc., and two 2.5Gbps SGMII interfaces to allow for a variety of LAN configurations.The highly integrated 5G module FG360 aims to empower the next generation of 5G connectivity. It offers a perfect solution for operators to achieve wide service coverage in a short time frame and offer fiber-like fixed wireless access (FWA) services through 5G CPE, gateways and routers. Empowered by the FG360 module, 5G FWA services will be able to bring a more affordable broadband alternative to areas with limited DSL, cable or fiber services and help consumers and businesses in less developed areas to access the high-speed wireless networks.Engineering samples of FG360 will be available in January 2021 and massive production of the product is expected in Q3 2021. Fibocom will be the first in the industry to provide engineering samples of 5G modules based on the MediaTek chipset platform.About FibocomFounded in 1999, Fibocom is a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules. We are committed to bringing reliable, accessible, secure, and intelligent wireless solutions to every IoT application scenario for the increasingly digitalized industries and enriched smart life of the whole society. In 2017, Fibocom become the first stock-listed wireless module provider in China.Fibocom provides technically advanced and high-performance 5G, 4G, NB-IoT/eMTC, 3G, and 2G, smart, auto-grade, GNSS, Wi-Fi/BT wireless modules. By technically embedding Fibocom's wireless solutions into IoT devices that will become smart and remotely manageable with stable data transmission between devices and operation center, we empower the intelligent future of all industries that mainly include smart retail, ACPC (Always Connected PC), industry 4.0, smart grid, smart homes, smart agriculture, smart cities, telemedicine, metering, smart security surveillance, and the intelligently connected cars, etc. We have many long-term industry customers including Fortune Global 500 enterprises, which is an important driven power of our fast development.Fibocom is headquartered in Shenzhen, China, and has R&D centers in both Shenzhen and Xi'an. We are globally located with more than 30 subsidiaries and regional operation centers in China, Americas, EMEA, and Asia Pacific Regions. Currently, we have more than 1000 global employees, and provide products and services in more than 100 countries and regions.Fibocom FG360

LitePoint, a US-based wireless test solution provider, offers turnkey over-the-air test solutions from development to production, combined with software automation that makes testing of FR2 devices easy in both characterization as well as volume manufacturing.In a recent interview, Lite-Point president Brad Robbins, talks about the development of the 5G market, and what it means for the wireless test solutions sector.Q: As more 5G phone models become available in the market, what do you see the development of 5G market today?A: Despite COVID-19's unprecedented disruption on a global scale, in 2020 we saw 5G adoption rates grow dramatically. While the total number of mobile shipments decreased in 2020, 5G mobile shipments grew from just over 10 million units in 2019 to 180-200 million units in 2020. We are very early in the global deployment, but 5G is living up to its promise of better mobile access. In existing sub-6GHz (FR1) spectrum, 5G operates more efficiently, providing more capacity for operators in their existing spectrum. This results in a better user-experience for the end-user, particularly in densely-populated urban areas where LTE capacity is strained. As mobile operators enable more "mid-band" spectrum and MIMO, 5G devices really start to deliver on the promise of faster connectivity.The most dramatic demonstration of the power of 5G is in the mmWave (FR2) 5G spectrum, where >1 Gbps data connections are being achieved. Apple's recent product introduction shows that mmWave is practical to add to a handset, though the deployment of mmWave networks is currently contained to somewhat narrow areas of urban centers. As the build out of mmWave networks continues, this will provide the next major leap in available data capacity, allowing carriers to move beyond the mobile phone and broadly deploy fixed-wireless to offices and residences. We are still early in the roll out of 5G, but the adoption rate is growing faster than what we saw with 4G.Q: There are several testing solution companies with general purpose test and measurement solutions. What makes LitePoint testing solutions so unique compared to others?A: Achieving optimized production economics requires a test system that is optimized for production. 5G device production requires both an optimized solution for the sub-6GHz (FR1) band, where the calibration and testing is primarily performed in a conducted (cabled) environment, as well as the mmWave (FR2) band, where testing is performed over-the-air (OTA). For FR1 devices, LitePoint's production solutions provide industry-leading performance in power accuracy, signal quality, and spectrum bandwidth.LitePoint's offerings additionally cover the upcoming 5G NR-U and Wi-Fi 6E frequencies up to 7.3GHz, with a future proof 200 MHz of bandwidth to cover mid-band carrier aggregation scenarios. For FR2 mmWave devices, LitePoint provides the simplest solution for manufacturing compared to other offerings, with the entire solution integrated into a single box with a calibrated interface. This greatly simplifies the setup, maintenance, and reliability on the production floor, enabling device manufacturers to ensure that they deliver high yield with high up-time in manufacturing. Additionally, LitePoint offers turnkey over-the-air test solutions from development to production, including test chambers, antennas, and switching accessories, combined with software automation that makes testing of FR2 devices easy in both characterization as well as volume manufacturing.Q: As mid-price or lower cost sub-6 GHz 5G phones get more popular in the market, manufacturers are facing the challenges of testing time increasing and slow down the big volume production, what do you think how to help them to resolve the impacts?A: In addition to ensuring shipment qualify, test time is, of course, one of the next biggest focuses for production testing. One technique that we have been pioneering at LitePoint is providing solutions that test multiple devices at the same time with a single tester. This effectively enables the per-device test time to reduce, providing a lower cost per unit. Additionally, as a leader in production testing, we work very closely with the chipset providers to help develop or deploy new techniques to optimize test times. An example of this is the trend towards Sequence Based Test, which dramatically reduces the number of required communication transactions between the device under test (DUT) and the test solution. Instead of having one setup command per test, which occurs hundreds of times, a pre-defined list of setups can be loaded and setup before performing hundreds of measurements. Reducing this communication time provides an impressive reduction in the test time, potentially delivering up to 70% improvement over traditional test methodologies.Q: On the other hand, the OTA test for 5G phone in the mass production lines, will the testing chambers require the new arrangement of production lines? What do you see the OTA test challenges in big volume production?A: The concept of performing OTA testing on the production line is not new. In 4G LTE devices, it is common to perform some simple OTA testing of the phone at the end of the line. This test ensures that the final assembly of the phone, including the antenna and embedded software, have been correctly installed. This testing is performed in the near field and typically has relatively loose PASS/FAIL limits. For 5G, the addition of mmWave technology requires phone makers to provide a higher-quality OTA test with tighter PASS/FAIL limits. One advantage to mmWave technology is that the far field distances are significantly shorter than for sub-6GHz frequencies, making the size of production test chambers practical for the manufacturing floor. For example, the far field measuring distance for a typical mmWave antenna array for a phone can be <10 cm, which enables the placement of an appropriately designed measurement antenna very close to the DUT. It is common for the DUT to have multiple mmWave antenna arrays, so the production test chamber must be designed to support flexible placement of multiple measurement antennas.There are technical challenges that must be addressed to efficiently perform high-quality OTA testing in the manufacturing environment. First, the setup and calibration of the OTA chamber must be accurate and repeatable. mmWave antennas are highly directional, requiring the mechanical alignment to be very precise. For the measurement antenna setup, this can involve the use of a laser alignment tool to ensure that the antenna is focused on the center of the DUT antenna array. To ensure repeatable placement of the DUT antenna array, custom milled DUT holders are required which enable subsequent placements of devices to reliably return to the expected location in the test chamber. Another challenge in 5G OTA testing is overcoming the significant path loss - the decrease in the signal power between the DUT antenna and the tester connection. It is very common to see >50 dB of path loss in a 5G OTA setup - compare this to <10 dB in a conducted (cabled) test setup. This large amount of path loss needs to be accurately calibrated in the setup so that it can be corrected in the measurement of the DUT.Q: Both Qualcomm and MediaTek launched silicon chips for Millimeter Wave (mmWave) 5G devices. And both are investing more resources in ramping up mmWave development as they plan to roll out their respective next-generation 5G chips. What do you see the further challenges for mmWave testing solution?A: Though mmWave is new to consumer products, the technology is well-understood from its military and aerospace roots. The main challenge is scaling from "boutique" low volume to mass-market high volume. To enable this, an area of focus for LitePoint has been simplicity. Multi-component test setups in the lab can be powerful and flexible, but they are complicated and time consuming to setup, require specialized knowledge, and are very problematic to repeatably deploy on a large number of test stations on a manufacturing floor. The LitePoint approach was to develop an optimized tool for the production environment: fully-integrated, simple to setup, and delivers repeatable results without the need for highly-skilled technicians. For mmWave technology to become widely deployed in consumer products, the manufacture and test of these products needs to be as simple as the sub-6GHz wireless technologies. Our DNA is simple, robust, and repeatable equipment for manufacturing.Brad Robbins, president of LitePoint

MSI, a world leader in gaming hardware and computing solutions, unveils an innovative lineup of gaming, creator and business products at its virtual launch event, "MSI Premiere 2021: Tech For the Future"."We are honored to present our new lineup of products designed to take gaming, creation and business computing to the next level. MSI has consistently devoted countless hours and research into bringing new technology products to the world, and in today's premiere event you will discover our latest, premium offerings that will be launched in 2021," said Sam Chern, Vice President of Marketing at MSI, as the virtual launch event kicked off. "It's showtime, and we hope you enjoy it."A powerful MSI Dragon G opened the 'MSI Premiere 2021: Tech for the Future" show, followed by a helicopter that flew over the sea and revealed MSI RTX 30 SEA HAWK.MSI SEA HAWK is the product of a revolutionary design with proven technology - which just got faster with an upgrade to the GeForce RTX 30 Series. The combined advantages of both air and liquid cooling come together with dedicated fan cooling and an all-in-one closed-loop liquid cooling solution that is efficient, silent and requires absolutely no maintenance.As the helicopter flew over snow-covered mountains, MSI's GeForce RTX 30 SUPRIM Series appeared on a peak.SUPRIM, a new graphics card design, turns a prestigious concept into reality. This card is amped up with robust power stages for durability, efficiently cooled with TRI FROZR 2S and delivers a modern aesthetic that reflects a high-performance lifestyle. This masterpiece continues MSI's legacy of powering immersive gaming adventures and demanding content creation.The stage then turned into a diamond textured theme to bring out MSI CLUTCH GM41 LIGHTWEIGHT.MSI CLUTCH GM41 LIGHTWEIGHT is constructed as lightweight as possible, allowing gamers to move effortlessly. The high-end optical sensor offers precise high-speed tracking and pinpoint accuracy up to 16000 DPI. Equipped with MSI FriXionFree Cable, this in-house developed cable is designed to ensure every movement glides with minimal drag on a mousepad or desk."And here's a surprise for some," said Bryant Lin, MSI Product Marketing, as he presented MSI's very first SSDs. MSI sets to redefine the GAMING SSD. These upcoming SSDs have been designed to deliver storage up to 4TB, read speeds up to 7000 MB/s, and write speeds up to 6900 MB/s. Protect your important data with Mean Time Between Failure of up to 1.6 million hours and end to end path protection.Shortly after, the Goddess ARTYMIS arrived and sent her moon-shaped arrow through the dark, lighting up the MPG ARTYMIS Series. Artemis in greek mythology, she is also known as the goddess of the moon, Luna, and the goddess of the hunt. When hunting, she wore a silver bow and rode a silver cart pulled by a female deer with golden antlers - an image as majestic as the waning and waxing moon.The MPG ARTYMIS Series presents 1000R, the most suitable screen curvature for the human eyes. It perfectly fits the curvature of the human eye so that you can see the entire screen without any fatigue. The curved surface design also heightens the sense of coverage and immersion, so that you will not be disturbed by the outside environment, greatly enhancing the gaming experience. In addition to 1000R, the series includes new exclusive AI features.Soon after, the stage floor transformed into a motherboard with an electric stream flowing through, uncovering the latest Intel Z590 MEG series. To set the benchmark, the flagship model MEG Z590 GODLIKE is designed to create the definition of the extreme gaming motherboard. The spirit of GODLIKE is all about innovation and breaking the rules. For example, the first generation of GODLIKE launched the first RGB motherboard and leads the RGB trend in the gaming industry. Today, the latest MEG Z590 GODLIKE adopts flagship SPEC, innovative features and an enhanced user experience. MEG Z590 GODLIKE stands out among current gaming motherboards and seeks to transcend beyond your imagination.Then, a glowing RGB wave slid over the screen and presented the MPG CORELIQUID K360. The MPG CORELIQUID K360 is a liquid cooler made to perform and look stunning at the same time. MSI's exclusive TORX FAN 4.0 generates supreme airflow to the radiator for rapid cooling. Additionally, a 60mm TORX FAN 3.0 is placed within the water blockhead, providing concentrated cooling to power solutions. The MPG CORELIQUID K360's water blockhead also has a 2.4" LCD, capable of displaying crucial information and customizable graphics such as hardware system performance information, photos and a system clock.In the spirit of creation and business innovation, the MSI Creator P50 made its debut with a kaleidoscope of butterflies vividly fluttering their wings. The MSI Creator P50 is a content creation desktop with a professional and stylish aesthetic. Although it is only 5 liters in volume, this creative center packs a big punch. It supports Intel Core i9 processors and the latest graphics card. It also has Thunderbolt 4, which delivers the fastest speed ever and makes 10 GbE LAN possible with the smoothest, fastest creating experience.Expanding to the business market, MSI launched the MODERN MD SERIES. The Modern MD271 and MD241 Series come with MSI's Anti-Flicker and Less Blue-Light technology, both TUV certified and designed to protect your eyes. The series' ergonomic design also allows for personalization and customization for a comfortable viewing experience. The built-in Type-C and tool-free design allow users to effortlessly connect and charge, and assemble or disassemble for a VESA mounting environment.MSI also presented an exceptional All-in-One PC designed for professionals - the Summit 241S. It is not only the first All-in-One PC with a switchable monitor design, but it also has a pre-built smart sensor that detects everything in your environment, ranging from distance and human movement to environment lighting. The smart sensor automatically adjusts the brightness and other screen settings for the most comfortable and optimal viewing experience.Lastly, MSI announced the new MSI Center, merging the Dragon Center and the Creator Center. The new MSI Center is fully customizable, supports all MSI devices in both the gaming and creator product lines. The new MSI Center comes with plenty of intelligent features powered by the MSI AI Engine such as: Sound Tune with noise cancellation to purify audio, Duet display to give a cross platform experience with iOS devices, Smart Image Finder to organize image files and automatically add tags to help locate images, Voice Command to create your own commands to open apps or short cuts, and Ambient Link to perfectly synchronize MSI Mystic Light products with Ubisoft's latest AAA game title, Watch Dogs: Legion and Assassin's Creed Valhalla and compatible lighting accessories."As a globally recognized, leading brand in gaming, creation, and business, we will continue to give you the best lineup of products while enhancing the user experience in all aspects," said Sam Chern, MSI Marketing Vice President. "We will be releasing exciting news in the upcoming days. Stay tuned, take care and see you soon."MSI Premiere 2021: Tech For the Future

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that FPGA manufacturer Gowin Semiconductor has embedded a Winbond 64Mb HyperRAM fast memory device in its new GoAI 2.0 machine learning platform.GoAI 2.0 is a complete, new hardware and software solution for machine learning applications. Compatible with the TensorFlow machine learning development environment, GoAI 2.0 is aimed at edge computing applications such as smart door locks, smart speakers, voice-activated devices and smart toys.The hardware component of the GoAI 2.0 platform, the GW1NSR4, is a system-in-package (SiP) featuring a FPGA and ARM Cortex M3 microcontroller for the machine learning application supported by Winbond's 64Mb HyperRAM supplied in known good die (KGD) format.The Winbond DRAM based on HyperRAM technology is ideal for Gowin's target applications, in which the electronics circuit needs to be made as small as possible, while providing sufficient storage and data bandwidth to support compute-intensive workloads such as keyword detection or image recognition. Winbond's 64Mb HyperRAM product has just connected 11 signal pins, so its connections to the host FPGA is minimal - the entire GW1NSR4 SiP has a footprint of just 4.2mm x 4.2mm in a BGA package. The 64Mb memory capacity provided by the Winbond device is sufficient to run both an operating system and to concurrently operate as buffer memory for a TinyML model, or as a frame buffer.The performance specifications of the Winbond's 64Mb HyperRAM include maximum data bandwidth of 500MB/s. It also offers ultra-low power consumption in operating and hybrid sleep modes.Jason Zhu, CEO of Gowin, said "The problem which Gowin Semiconductor has solved with the GW1NSR4 is to pack a high-performance and low-power edge computing engine in a tiny package. The Winbond KGD format and HyperRAM memory technology are ideal for this, because the die can be embedded in the same package as the FPGA, eliminating the need for DRAM as an external component"."Gowin is very happy that we had Winbond as our partner in the development of the GW1NSR4 because its expertise in the KGD package format and its help in integrating the die into the SiP helped us realize a very effective and reliable design in a short time."Winbond's HyperRAM products are available for high-volume production in densities of 512Mb, 256Mb, 128Mb, 64Mb and 32Mb. For more information, go to www.winbond.com.Gowin semiconductor embeds 64Mb HyperRAM DRAM from Winbond

Looking back through the year, smart production can be regarded as a global development trend. Covid-19 outbreak has hit the global manufacturing supply chain. Although the labor shortage has led to the serious decline in production across the industry, the epidemic has driven the demand for "smart manufacturing" and is expected to transform the production model with a vision of the "Smart Factory" of the future.A Smart Factory concept is centred around the confluence of digital transformation and intelligent manufacturing trends. It implements the key value of Industry 4.0 with automation, real-time data, connectivity, embedded sensors and machine learning which will transform the traditional production model into a highly customized and intelligent way. The notable component driving these trends is the AI of Things (AIoT).AIoT is the potential synergy lies in this intersection of IoT (or IIoT; Industrial IoT) with AI. At its core, the crucial characteristic defining the AIoT promise (and therefore the Smart Factory) is the massive proliferation of intelligent, automated decision making capabilities across the IIoT network. Decisions begin with the analysis of data, so enabling data analytics with an AIoT approach can be a logical and attractive starting point with relatively low initial investment.Current data analytics capabilities already possess good ROI in their inherent ability to help improve the productivity, quality, yield, or optimise the cost of producing products. An AIoT-enabled data analytics set-up augments these benefits by generating useful data-driven insights that can be used to help the manufacturing system learn from, be optimized, and generate higher performance, or to help users make better decisions. AIoT represents a fundamental paradigm shift for the industry and a massive step towards the vision of achieving the Holy Grail of zero DPPM manufacturing while boosting quality, yield and cost standards across the entire electronics manufacturing value chain.Let's look at one example. Wire Bonding is one of the critical processes in semiconductor assembly that can generate defects, and quality assurance via sampling to spot defects at the factory gate is a typical step. However, sampling has its risks, as defective components can escape detection, with serious liability issues when lives are put at risk. Root cause analysis is also very onerous when defects are detected, massive data points are typically involved making traditional analysis very difficult. The cost of product recalls can also be very costly.The relentless chase towards zero DPPM is thus understandable but a hard vision to achieve using traditional means. An AIoT-enhanced data analytics approach for the Wire Bonding Process flips this scenario on its head, with quality data points analysed in real time. It provides on time, high integrity data points which are crucial for accurate and timely analysis. Out-of-control process anomalies, and defect generation predicted and automatically corrected before output quality is affected. Predictive, automated decision making such as this - 100% quality assurance without Human Intervention - would totally revolutionize and transform current industrial approaches toward Quality Control.Realizing the vision of zero DPPM, ASMPT's newly developed IIoT platform software- SkyEye is ready to drive the "Smart Factory." SkyEye manages and brings insights and intelligence across your macro and micro automation, process equipment, autonomous inspection and metrology. It revolutionized operation management through its remote functionality equipped with AR and VR capability; for off-site assistance, troubleshooting, recovery and process development.Connectivity to ASMPT AIoT Cloud Services provide End to End Data Analytics Life Cycle & Knowledge Management for your AI enabled manufacturing. With an AIoT approach properly put in place, the entire manufacturing value chain can be increasingly equipped with new ways to develop, innovate, and manufacture. The ultimate goal is to produce faster, better and more cost- effective and flexible, without compromising increasingly stringent standards of safety and quality. Please visit ASMPT official website for full text.ASMPT's newly developed IIoT platform software- SkyEye is ready to drive the Smart FactoryAn AIoT-enabled data analytics set-up augments these benefits by generating useful data-driven

In 2021, there's opportunity for growth in many markets, especially automotive, 5G and IoT, and new component releases hitting the market. However, challenges lie ahead.The 2020 government shutdowns due to COVID-19 hindered global supply chains by either halting or limiting production. Despite most manufacturers finally up and running, another issue looms on the horizon - worsening shortages.Growing markets in 2021 and beyondThere are numerous market segments that will experience growth in the upcoming year, including the rollout of 5G, the rebound of the automotive sector, an increased need for datacenters and increasing reliance on AI and IoT by companies.The automotive industry, specifically, will have a big turnaround in 2021. Though automotive demand took a big hit in early 2020 due to the COVID-19 pandemic, it is now recovering and is forecasted to have strong growth in the second half of the coming year.The main driver of this growth is electric vehicles. Other key drivers of growth will be increasing consumer demand for vehicle comfort, the rising consumption of plastics in automotive production and increasing vehicle customization.The automotive interior materials market alone is expected to experience over 5% CAGR from now until 2026, while the aftermarket segment is predicted to see more than 6.5% CAGR in the same time span.The rollout of 5G is also anticipated to have a huge impact on the semiconductor industry as companies prioritize capacity allocation to 5G production. With the 5G network set as the catalyst to multiple technological revolutions, new devices containing higher performing components will be essential requirements.Initially, the 5G rollout may only lead to an increase in demand for chips with a higher baseline memory requirement, but in the coming years the massive number of new applications will go beyond just smartphones. The industrial application segment alone is predicted to experience 221% CAGR between 2021 and 2023, resulting in $497 million in semiconductor revenue.Other markets expected to continue growing in 2021 include the data mining industry and gaming industry. Ongoing demand in these industries will likely lead to increased demand for graphics cards, though this growth may be impeded by yield issues for Nvidia chips. The numerous recent product launches in the gaming industry has already put a strain on GDDR5 and GDDR6 supply, which is likely to worsen as both industries continue to grow.A hindered semiconductor industry in 2021Though there is rising demand from growing industries, various raw material shortages are leading to tight supply, extended lead times and increased pricing for many manufacturers and on a variety of components. This doesn't appear to have an end date in sight and is only thought to get worse in 2021.The ABF substrate shortage is an example of how one shortage can have a widespread impact on components. As a result of demand growth outpacing capacity expansion by 20% in 2020, rising prices have left customers scrambling to fulfill their production needs, especially for CPUs, GPUs, high-end ICs and peripheral products.These shortfalls are likely to widen as demand for 5G infrastructure, networking and high-end GPU and CPU applications outgrows capacity further. GPUs, for example, are expected to experience a 15-20% price increase in 2021 due to this worsening shortage.Another supply constraint expected to further disrupt the semiconductor market next year is the 8-inch wafer shortage, which originated in 2019. With production capacity currently operating at 99% from increased end-product demand, further pressure will be added in 2021 from the growing 5G industry, automotive industry and IC market.Because of the 8-inch wafer shortage, lead times have been worsening and pricing is on the rise. Richtek, for instance, has reportedly had lead times stretch from 4-6 weeks to 26+ weeks on a wide range of ICs, which are commonly used in computers and consumer end-products.Other manufacturers, such as LG, AUO and Innolux are also beginning to feel the effects of raw material shortages, particularly for glass substrates. With demand for LCD panels remaining strong, the glass substrate shortage has caused pricing increases of up to 70% above original price levels.Many manufacturers are competing for a variety of raw materials, including CPU and GPU makers in addition to logic IC and power management IC manufacturers. Because distributor inventories are under allocation, end-customer supply is very tight for a variety of components, which is likely to continue throughout 2021.The takeawayThere are many opportunities for growth in global supply chains going into 2021 created by the rollout of 5G and IoT, the return of the automotive industry and growing demand in data mining and gaming industries. Though rising demand should result in booming industries, numerous shortages could stunt growth and leave manufacturers fighting over resources.

Orbotech, a KLA company, has announced two new roll-to-roll (R2R) manufacturing solutions for flexible printed circuit (FPCs), enabling the design and mass production of new generations of electronic devices, including 5G smartphones, advanced automotive and medical devices.Orbotech's roll-to-roll solutions for direct imaging (DI) and UV laser drilling overcome many of the yield, throughput and quality challenges inherent in flex material manufacturing. Leveraging newly developed and field-proven technologies, the solutions facilitate high quality, cost-effective mass production of ultra-thin flexible printed circuits that are critical in advanced electronics.The two new series of solutions are the drum-based Orbotech Infinitum for R2R direct imaging, and the Orbotech Apeiron for flex R2R and sheet-by-sheet panel UV laser drilling."Based on the insights gained from nearly 40 years of working with leading manufacturers around the world, Orbotech has created breakthrough technologies and solutions that turn designers' dreams into reality," said Yair Alcobi, president of the PCB division at Orbotech. "Orbotech Infinitum and Orbotech Apeiron build on our existing solutions for flex PCB manufacturing to solve the most pressing challenges faced by advanced flex PCB manufacturers today."New and future advanced electronics with their light weight, smaller form factor and higher functionality increasingly employ delicate flex materials. Both of Orbotech's new solutions optimize the handling of the most delicate flex materials during direct imaging or UV laser drilling. and provide more flexibility to increase production with options for roll widths of 260mm and up to 520mm.Additionally, PCB manufacturers gain significant efficiencies with the smaller footprint of both solutions: smaller clean rooms are required, production capacity per square meter is increased, and power consumption is reduced. These advances create the opportunity for greener flex PCB manufacturing.Orbotech Infinitum

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced that a high-performance, low-power Winbond 1Gb LPDDR3 DRAM product has achieved another great success in high bandwidth memory with Tsing Micro latest artificial intelligence (AI) system-on-chip (SoC).Beijing, China-based Tsing Micro's TX510 SoC is a highly advanced AI edge computing engine optimized for functions such as 3D sensing, face recognition, object recognition and gesture recognition. Paired with Winbond's LPDDR3 DRAM, which offers maximum bandwidth of 1866Mb/s and operates from a dual 1.2V/1.8V supply with power-saving features such as Deep Power-Down mode and a Clock Stop capability, the TX510 offers outstanding speed and accuracy in AI imaging applications.Tsing Micro (www.tsingmicro.com) has implemented an innovative architecture in the TX510 SoC: it includes a 32-bit RISC processor, a reconfigurable neural network engine, a reconfigurable general computing engine, an image signal processor and a 3D sensing engine. For shipping to customers, the TX510 is combined with Winbond's 1Gb LPDDR3 DRAM die in a single 14mm x 14mm TFBGA System-in-Package (SiP).Achieving computing throughput of up to 1.2 TOPS (tera operations per second), this SiP can perform accurate face recognition (false acceptance ratio of 1 in 10 million) in less than 100ms, and compare features with a library of 100,000 faces in less than 50ms. Peak operating power consumption is just 450mW, and the chip uses just 0.01mW in quiescent mode.The TX510 is intended for use in applications which require high-speed image detection and recognition, including biometric sensing, video surveillance, smart retail operations, smart home automation and advanced industrial automation.Wang Bo, CEO of Tsing Micro, said, "Evaluation of the Winbond LPDDR3 DRAM shows that it is highly competitive both in terms of speed and power consumption. But equally important to us when developing the TX510 was the support and expertise that Winbond provided to us in integrating the DRAM die into a SiP in such a way that it maintained high performance and high signal integrity while taking care of thermal management.""Winbond is fast gaining a reputation for providing excellent support to chip and SoC manufacturers which are developing leading-edge AI products. With Winbond low-power DRAM inside, AI products such as the TX510 can set new benchmarks for high performance and throughput while operating from a limited battery power supply," said Winbond.Winbond's LPDDR3 DRAM is in mass production. More information can be found at www.winbond.com.Tsing Micro ships its TX510 AI processor with a Winbond 1Gb LPDDR3 die integrated into a single SiPTsing Micro TX510