With over 35 years of dedicated experience in the ICT industry, MSI is a global leader in gaming, content creation, business & productivity, and AIoT solutions. Backed by our solid R&D and manufacturing capabilities, we provide clients with efficient DMS (Design, Manufacturing & Service) solutions for various AIoT applications, such as cloud servers, network appliances, vehicle infotainment, telematics systems, smart robotic appliances, digital signage, medical electronics, ATM, POS, Kiosk, industrial automation, gaming etc. Recognized by clients as a trustworthy partner of reliable solutions and services, we are poised to help you unlock your business value from industrial data.MSI's flow of knowledge floods into Taiwan's water management with astonishing resultsIn 2018, the Taiwan authorities initiated a series of advanced projects of water resources management. The scope of the projects was to build a complete forecasting model of water all the way from dams to the detailed level of irrigation channels in fields. The data included evaporation, penetration, and usage for the entire crop plants. The project combined weather forecasting from satellite observation and real-time water level/flow volume measurement in open channels.MSI WL-10a gateway joined this advanced project with peer-to-peer NB-IoT connection, all the field level sensors and flow volume data in fields. Those fusion signals transferred with heterogeneous network LORA and MODBUS interoperation was also integrated. The results are astonishing. The data for 12 months field test using only 3W solar power, transferred 100% data uploaded to a water Authority cloud platform via the record re-entry technique.As one of the foremost wireless communication companies in Asia, MSI systems are perfect for this demanding project. The MSI WL-10a provides CAT-M1/NB-IoT band selection that is ideal for water resources management. It ensures the proper industrial protection standards and can provide a stand-alone operation utilizing solar powered or battery powered. The ARM Cortex A7 SoC, is an easy-to-use solution for customers to develop intelligent cutting- edge computing.MSI WL series, your best choice in AIOT solution.https://eps.msi.com/MSI FUNTORO Telematics Solution for Electric City BusInitiate New Era of Smart and Green TransportationIn response to the global trend of environmental protection and carbon reduction, governments of all countries have been making efforts on the development of electric bus industry, expecting to reach the goal of zero emission in the future. In view of this, MSI FUNTORO partners with the largest bus manufacturer in Taiwan - Master Bus, and launched its Telematics Solution to be standard equipment of Master Electric Bus in this early year, which was the first bus manufacturer to be qualified for a pilot project by Ministry of Transportation and Communications (MOTC).With more than 15 years of experience and expertise in telematics and infotainment solutions for commercial vehicle sector, MSI FUNTORO provides a smart and complete solution with a cloud management platform for Master Electric Bus.By integration of CANBUS and various sensors, the vehicle and driving data are collected and transmitted to backend platform to allow real-time fleet management and remote monitoring. Besides, it enables predictive maintenance, on-board system diagnostics, driving behavior analysis and battery efficiency monitoring through big data analysis, to enhance fleet safety and operation efficiency.Safer and Antibacterial Solution for Public TransportationOffer Maximum Safety to Passengers While TravelingIn 2020, people changed the living habit to fight against the pandemic of COVID-19. Wearing face mask, taking body temperature, keeping social distancing or avoiding taking public transportation, which result in a new living style to everyone. And after one year, we are still suffering from the pandemic and unable to turn back to the usual life.In order to enhance passengers' confidence and safety on traveling after the pandemic, MSI FUNTORO provides a safe and antibacterial solution for public transportation. The solution includes a temperature and mask detection system at the entrance of the bus, and UVC LED purifiers to sterilize the cabin environment.While passengers are getting on the bus, the system will automatically detect the body temperature of the passenger and alarm when the temperature is too high or abnormal, as well as to detect whether the passenger is wearing a mask or not. This helps to prevent high-risk passengers from getting on the bus to stop the spread of bacteria and virus. Moreover, with MSI UVC LED purifier installed on the roof of bus, the air in the cabin will be filtered and sanitized continuously during bus operation, to provide clean and fresh air for the passengers. We believe it will help public transport operators recover the business faster by our solution after the pandemic.https://www.funtoro.com/global/page/solutionsMSI Industrial Computer Provides Reliable & Expandable Products with Longevity Support (5 to 7 Years)We design & manufacture high-quality embedded boards and systems for various applications, such as digital signage, medical electronics, ATM, POS, Kiosk, industrial automation, gaming, utility, and transportation. With solid R&D and manufacturing capability, we serve the client with efficient DMS (Design, Manufacturing & Service) solution, and are poised to become the best partner in global Embedded and Industrial market.MSI Launched the Proven AMR Medical AI-UVGI Robot to COVID-19AMR AI UVGI ROBOT can act as air disinfectant even when people are present, automatically open the canister to use the light to disinfects the frequently touchable areas when people are not around. Delivery of medicine and transportation of daily amenities, etc. It could run for several hours without stop after activation, and go back to recharge by itself then continue working after fully charged. Several sets of UVGI 253.7 nm UVC lights were built-in and could perform up to 160,000μWs/cm2 in capacity to achieve the task of providing lethal dose enough to kill germs through dynamic flow field for the required time and distance, or significantly weaken the resistance of germs to radiation, so that this device can perform bacteriostatic functions in public places of high density or poor ventilation such as hospitals and clinics, etc.With MSI AMR platform it can transform to meet your needs, such as AMR AI DELIVERY ROBOT, AMR AI BASE ROBOT, AMR AI GUIDE ROBOT and more.A special thanks for a great collaboration with FineTek and Santec.MSI AIoT solution

As COVID-19 continues to hamper international interactions, two startups from the US and France collaborating with BE Health in Taiwan have closed venture capital funding rounds recently with more than US$14 million in total successfully. BE Health leverages the unique strengths of its thriving ecosystem to position the accelerator as the gateway to Asia under Taiwan Tech Arena (TTA)'s support for both local and international startups.Applaud Medical is a clinical-stage company based in San Francisco; the company's device addresses the painful condition of kidney stones, with an innovative, non-invasive treatment, allowing urologists to effectively treat 5-15-millimeter stones with a simple outpatient procedure. Applaud Medical just completed US$11 million fund raising, the recent investment will aid in expanding the company, as well as broaden and accelerate product development. As an investor and strategic partner, BE will work with Applaud Medical consistently for their future expansion to Asia, and to conduct clinical trials in Taiwan and Asia to increase product's market traction.RDS, a developer of a wearable health tracking device which continuously measures vital sign parameters, announced that it has closed their Seeding Round of EUR3 million (US$3.67 million) in the first quarter of 2021. The fund raised in the Seed Round will be used to accelerate the industrialization and CE/FDA approval phases. Being the only two shareholders from the east, BE and Taipei Medical University are both thrilled to be its partners. To enable RDS to validate the concept faster and high-quality prototype-making, BE Health will take advantage of Taiwan's powerful ICT resources to assist RDS to finish the prototype.Taiwan can help, and Taiwan is helping. Taking an important role in global healthcare ecosystem, Taiwan is aware of its obligations to help the world create a better environment. With Taiwan's extraordinary manufacturing, hospital resources and strong ecosystem, BE Health assures to serve as the gateway to Asia that will help entrepreneurs to drive growth in Asia on a global focused scale.Applaud Medical and RDS collaborate with BE Health, closing venture capital funding rounds recently with over US$14 million in total.Photo: BE Health, June 2021

MSI, a world leading brand for gaming and creation, holds an online new product launch today. Apart from the constant insistence on ultimate performance for all products, MSI also takes "TECH MEETS AESTHETIC" as belief. From the era of the Renaissance, the Scientific Revolution, and the Enlightenment, the great evolutions are all built upon craftsmanship of humanistic aesthetics and science. MSI combines rounded and fluid form with sleek edges, merging postmodernism design with modern technology, and aims to inspire users across all fields."Although the COVID-19 pandemic changes our working lives and daily lifestyles, MSI never stops developing and designing new products. In addition to proud performance, our products are also integrated with 'Golden Ratio' aesthetic. MSI combines rounded and fluid form with sleek edges, merging both postmodernism design with modern technology to meet different user's demands of pursuing perfect details in various fields," said Sam Chern, MSI Vice President of Marketing.Creator & Gaming Series Laptops with the latest 11th gen Intel CPUMSI, a leading gaming brand, has introduced a new lineup of creator and gaming laptops offering a 30% performance upgrade over previous models. The latest MSI gaming laptops are powered by the latest 11th Gen Intel H series processors and up to NVIDIA GeForce RTX 3080 LAPTOP GPUs. MSI has greatly advanced in creators' field in recent years, and perked up to materialize the concept "Tech Meets Aesthetic" this year. The new Creator series laptops continue MSI's artistic vision of producing stable and powerful working machines with aesthetic touches that enhance user experience and unleash the inner gamer and creator spirits.Tech Meets Aesthetic: Creator Series LaptopsThe new Creator Z16 boasts a 16:10 display with thin bezels inspired by the Golden Ratio for wider viewing angles and better productivity. Creator Z16 designs with a slim CNC-milled aluminum chassis in Lunar Grey adds to the delicate style with the latest 11th gen Intel Processor and up to NVIDIA GeForce RTX 3060 LAPTOP GPUs. True Pixel display up to QHD+ resolution with 100% DCI-P3 color gamut supports the needs of designers and content creators alike. In addition, Creator M16 and Creator 17 come with 16:10 QHD+ display and 4K Mini LED displays respectively.The latest 11th gen Intel Gaming Series LaptopsMSI premium gaming laptops-GE76/66 Raider, GS76/66 Stealth, and GP76/66 Leopard series come along with the high-speed combo of PCIe Gen4, Thunderbolt 4, and Wi-Fi 6E enhance data transfer speed and wireless experience. MSI-exclusive feature of "Discrete Graphics Mode" further elevates graphics performance and overclock option with adjustable GPU core clock and VRAM frequency via MSI Center. Displays options up to 360Hz or QHD 240Hz to break high-resolution game fps ceiling ever. Moreover, GE76 and GE66 Raider series retain the sci-fi mystic light bar, but benefit from NVIDIA GeForce RTX 3080 graphics with full TGP up to 165W for extreme gaming performance. Pulse GL76/66, Katana GF76/66, Sword 17/15 series are compact and discreet design, and aim to extra powerful hardware at entry gaming laptop range. Powered up to NVIDIA GeForce RTX™ 3060 graphics and along with a redesigned 6 heat pipes and integrated MSI exclusive thermal grease, which generates more airflow to ensure smooth gaming experience.Comprehensive Solutions for Your Gaming ExperienceMSI had achieved the milestone of selling 3 million monitors worldwide, but MSI doesn't just stop there. This year, MSI launched the Optix MEG381CQR Plus, which won the 2020 CES award. This monitor is equipped with 2300R IPS curved panel and MSI monitors' exclusive Steelseries GameSense function. The Optix MEG381CQR Plus is also MSI's first G-Sync Ultimate Monitor. Through optimization of the chip and the tuning of the hardware, G-Sync Ultimate function provides players with a perfect screen display with tearing. The HMI operation interface, which is first developed by MSI, helps users choose settings more conveniently and intuitively with the cooperation of the Gaming Dial and a second monitor. Users can simply rotate the button at the lower left to switch between modes. Additionally, MSI will launch its new flat gaming monitor series, including the Optix MPG341QR, the Optix MPG321UR-QD, and the Optix MPG321QRF-QD. Besides Gaming Intelligence and Sound Tune, these new flat gaming monitors have new functions as well. The Optix MPG321UR-QD has the latest HDMI 2.1 transmission interface which supports a 4K 144Hz screen display. These outstanding features are the reason why MSI's monitors are the best choice for gamers. As for the gaming desktop, MSI presents the MAG Infinite S3. It has a front panel that features an asymmetrical design with MSI mystic light. To dissipate heat effectively, there are huge air vents on the front panel, and the thermal design promises sufficient airflow that ensures long-term operational performance and stability. Moreover, the MAG Infinite S3 has the latest components inside. It runs 11th Gen Intel Core Processors and NVIDIA GeForce RTX 30 Series graphics cards, and it supports NVIDIA Resizable BAR technology, which provides a 10% performance improvement in games, allowing you to play games smoothly.Customize Your Maverick PCThis year, MSI breaks new ground with product customization. The MPG GAMING MAVERIK, the latest bundle kit, is a premium experience offered for MSI fans. It consists of Core i7-11700K CPU, the MPG CORELIQUID K360 SP, the MPG Z590 GAMING EDGE WIFI SP, the MPG VELOX 100P AIRFLOW SP, and Trident Z Maverik memory. The lighting effects are perfectly synchronized with exclusive patterns. The MPG GAMING MAVERIK also boosts all cores' frequency from 3.6GHz to 4.8GHz, which helps you enjoy games intently. In terms of motherboards, MSI had launched X570 Series motherboards in 2019, and this year, the new X570S MAX Series motherboards will come out. Receiving brand-new designs as well as upgraded features, the new X570S MAX motherboards offer a fanless cooling solution to provide gamers silence. With a new motherboard, you may consider picking up a new case as well. The MPG QUIETUDE 100S is a silent gaming PC case. It is the first of MSI products that features MSI's exclusive MEG SILENT GALE P12 fan. The fan blades are capable of providing enough airflow while maintaining low noise levels, and you can click the fan speed control button on its IO port, which helps the user adjust the fan speed to three stages of RPM easily.Be Your Window to the WorldBesides gaming products, MSI also devotes itself to commercial and creative products in recent years. The Creator P50 is the perfect desktop for creators, which won an award for the CES 2021 Innovation Awards. Its sleek and slim dimensions are suitable for rooms and studios, and the refined design can be a part of the room's decorations. Now, it comes in a new white color as an option for creators. If you care about eyecare and color accuracy, the Summit MS321UP may be your first choice. This monitor can ergonomically be adjusted to your most comfortable viewing position, and it has the most accurate color display and a smart sensor as well. Along with 4K resolution, the Summit MS321UP offers users an absolutely clear and great display. To meet business needs, it is supported by the MSI Productivity Intelligence App, which introduces the KVM function. The KVM function lets you toggle between two computers with a keyboard and mouse to control your two devices through the Summit MS321UP. It will not only improve efficiency but also increase productivity.Change The GameTo celebrate years of continued high-performance circuit board development, MSI is announcing the SUPRIM 35th Anniversary Limited Edition graphics card. Engraved in the backplate is sketched outlines of past generations that have contributed to our company's experience and knowledge. This anniversary edition graphics card is built upon the SUPRIM series foundation and retains all the same key features. Optimized circuits power the NVIDIA GeForce RTX™ 30 Series GPU chip at the core, the efficient TRI FROZR 2S thermal design that keeps temperatures in check with minimal fan noise, and a modern aesthetic that reflects the high-performance lifestyle of its user.Low Latency Wireless EarbudsThe IMMERSE GH62 WIRELESS EARBUDS is our first set of wireless earbuds, developed with the same gamers' first DNA that made previous MSI headsets great. GH62 sets itself apart from other wireless earbuds by incorporating all the core features gamers want – accurate audio reproduction, clear voice recording, low-latency responsiveness, and low maintenance.Light Weight, Heavy HitterCLUTCH GM41 LIGHTWEIGHT WIRELESS is our first lightweight wireless mouse for FPS gamers who want a symmetrical ergonomic shape to play with speed. Built with the latest 2.4G radio technology, latency is reduced to just 1ms, resulting in responsiveness that's almost 10 times faster than a typical wireless mouse on the market. Designed for advanced FPS players, the GM41 LIGHTWEIGHT WIRELESS is equipped with soft and durable rubber that has a diamond texture to maintain a steady grip, while weighing only 74g.Charging Ahead with SpeedFinally, MSI's SPATIUM SSD lineup charges ahead with speed, ready to shorten loading times and rapidly move files. The fastest model, the M480, will have transfer speeds up to 7000 MB/s. The heatsink lowers peak load temperatures by up to 20 degrees Celsius and prevents SSD thermal throttling.MSI unveils new innovations at Computex 2021

Artificial Intelligence (AI) and Advanced Assisted Driving System (ADAS) are the two core elements of the Automated Vehicle (AV). A whole battery of sensors comprises the ADAS. These include short and long-range radar, LiDAR & precision cameras, which help to collect information outside the car at real time. With the help of the AI, the ADAS is then able to differentiate sensor data into crucial categories including pedestrians, obstacles, traffic signs, lane line, other vehicles, proximity, speed and direction relative to the AV, process this and quickly instruct the vehicle's actuators that control acceleration, braking, and steering."Since sensors play such a crucial role in enabling AVs, a critical component of delivering the most reliable AVs is to make sure that every sensor produced during manufacturing is free from defects," said Dr. James Song, Vice President and Product General Manager of ASM Pacific Technology (ASMPT). Optical-based sensors such as LiDAR and cameras are no exception. A tiny particle on a LiDAR or camera sensor surface could cause huge issues due to the signal not able to be received or transmitted, which could have huge implications for AV reliability and passenger or pedestrian safety.Dr. James Song emphasized safety is the primary concern in the automotive industry. With more complex camera assemblies, the need to ensure the best quality from the manufacturing process becomes the most critical. It has indicated that there is an increasing market demand for its Automated Optical Inspection (AOI) machines to replace conventional inspection methods that employ human operators. With its automated visual inspection of component manufacture using a camera that autonomously scans the device under test for both catastrophic failure and quality defects, AOI is overall much more reliable and repeatable than manual visual inspection.Recently, ASM Pacific Technology has lunched its brand new AOI model named "CamSpector," which has been designed specifically to meet automotive market needs, and to fulfill important requirements such as CE Mark. It is the first 3rd Optical AOI capable of detecting sub-micron particle as well as 2D + 3D wire bond defects for the CIS market. CamSpector equipped with HD optics, which enables a more robust vision performance to reduce over reject rates to less than 0.1%, and to keep under reject at 0%. The "secret sauce" behind these impressive capabilities are Artificial Intelligence capabilities that have been integrated into CamSpector's AOI vision system to leverage big data from both inspection and manufacturing & enterprise systems.With manufacturers increasingly seeking to modernize their factory lines with more automation and AI features in tandem with "Industry 4.0" trends, AOI inspection data can be shared to such "Smart Factory" systems to augment their data analysis. With real-time feedback systems a Smart Factory hallmark, AOI data could help to improve yield and reduce operational costs, or on a wider level even be used to monitor and provide feedback for upstream processes in the Smart Factory so as to proactive repair of faulty processes or improvement process capability.High quality camera senor is critical to the reliability of AV. Therefore, a production line of the sensor equipped with intelligent and high-precision inspection system is prerequisite for achieving the autonomous driving. "This is where CamSpector comes to play," said Dr. James Song. It is expected that more manufacturers will integrate AOI system in the production line of auto parts in order to improve product quality. These are among the various possibilities as the world becomes more enabled via an increasingly integrated approach blending intelligent software with precision manufacturing systems.Multiple sensorsSource: Yole 3D Imaging & Sensing 2020 ReportASMPT's AIoT

In the era of smart devices, the capabilities of traditional networking equipment are no longer sufficient as more diverse IT system functions become available. Therefore, virtualization has become a focal point when designing corporate IT systems. Apart from large-scale independent software vendors (ISV) and cloud service providers relying on virtualization, small-scale operators have also begun investing in this technology, generating demand for the market as a whole. AEWIN has navigated the networking field for many years, accumulating abundant technological expertise and experience. Recently, AEWIN has built the SCB-1937, a high-performance networking computing platform that supports the latest EPYC 7003 Milan CPU launched by the large processor manufacturer AMD. This platform can help enterprises swiftly introduce network function virtualization.Established in 2000, AEWIN focuses on R&D for network communications and information security technologies to provide customers with excellent solutions. Currently, AEWIN has three major product lines, including network equipment, servers, and network expansion cards. Network equipment includes network security appliances. As for servers, these include general-purpose servers and edge computing servers. In addition, network expansion cards cover a wide range of network interface cards (1G - 100G) and QAT (Intel QuickAssist Technology) accelerator cards with encryption technology. These products can meet all kinds of customer need. In addition to developing hardware products, AEWIN has also expanded its software R&D team. Through pre-validation and performance optimization, AEWIN has shorten the development time of ISV clients and increased customer satisfaction levels.The SCB-1937 computing platform launched by AEWIN can also meet the recent demand for Edge AI. The network's I/O ports and expansion interfaces are at the front of the platform, shortening the time for module installation and maintenance, facilitating the connection of network switches. The depth of the platform is 60 cm, allowing enterprises to install high-performance network equipment within limited spaces. The SCB-1937 platform uses two AMD EPYC 7003 Milan CPUs. This family of processors support the latest bus standard, PCIe Gen4, and up to 128 lanes of PCIe Gen4, which comprehensively increase transmission speed. Moreover, it has eight PCIe Gen4 x8 expansion slots that support networking modules, U.2 NVMe SSD modules or GPU/FPGA accelerators. Regarding networking configuration, the SCB-1937 can support up to eight network expansion modules, with flexible Ethernet port configurations, including 64x 1GbE, 64x 10GbE, 32x 25GbE, or 8x 100GbE ports.AEWIN also makes the most of the memory support of the EPYC 7003 Milan CPU. The platform supports a memory capacity of up to 4TB and eight channels DDR4 RDIMM (up to 3200Mhz), which significantly enhance the computing capabilities of virtualization. In terms of the I/O interface, the SCB-1937 has two management ports for BMC/IPMI management functions, a console port, two USB 3.0 ports, and a 5-key LCM module. In addition, the SCB-1937 supports two hot-swap 2.5" SATA HDD/SSD docks, one mSATA and two M.2 2280 slots.With regard to SCB-1937 applications, AEWIN pointed out that the platform allows ISV clients to create higher values with less equipment because of the SCB-1937's 128 computing cores, high-capacity RAM, high-speed bus PCIe Gen4, and more diverse network interface. In the past, enterprises had to purchase different kinds of IT equipment based on different types of services when responding to their expanding business scope. This approach not only leads to huge costs of IT deployment but also makes it difficult to fully leverage the performance delivered by hardware equipment. By incorporating all functions into a virtualized infrastructure, enterprises can simplify their deployment procedures and swiftly scale out relevant applications. Various virtual network functions can be deployed in a single host or many clusters and achieve the best performance simply by using a website interface to control the functions and deploy software. As a result, virtual frameworks have gradually become the IT mainstream among enterprises and government organizations. The SCB-1937 is the best platform specifically designed for a virtual framework.So far, this product has already achieved many successful applications. Take Edge AI application as an example, the platform is used to identify traffic flows and license plates of traffic offenders and can further connect traffic signals to alleviate traffic congestion by adjusting traffic lights. For the manufacturing sector, the platform can be used for facial recognition to manage access to certain areas. Compared with past embedded hardware, this application is an ideal choice in terms of installation costs or system flexibility.With an increasingly fierce market competition, IT network equipment is playing a more important role in corporate operations. As AMD's long-term partner, AEWIN cooperated with AMD to conduct testing since the development phase of the CPU. This is why AEWIN can offer the best solutions simultaneously while the product is being launched. The SCB-1937 is a multi-functional computing platform that leverages the high-performance and high-frequency features of the AMD EPYC 7003 Milan CPUs.AMD EPYC 7003 Milan CPUSCB-1937

Murata Manufacturing and Cooler Master have jointly developed a vapor chamber with thickness of only 200um for electronics devices.This is the first product developed by the joint partnership between Murata and Cooler Master, with both companies committed to continue strengthening their collaboration as they work to create more new products that solve heat-related problems affecting next-generation devices.Beginning with this new product, Murata and Cooler Master intend to build a partnership to meet new technical challenges and a wide range of product needs by utilizing expertise from both companies to develop heat dissipators for electronic devices.To strengthen cooperation between the companies on product development, Cooler Master plans to install development and testing facilities with the same conditions as Murata's facilities at Cooler Master headquarters scheduled for completion in the second half of 2021.This will allow the two firms to share new product concepts and ideas without delay and realize the development of a system that provides accurate performance evaluation, they said.As electronic devices achieve higher performance and more advanced functionality, the amount of heat generated per device is increasing, making efficient heat dispersion and dissipation, as well as cooling, a key issue.In addition, the constrained space limited by high-density designs of the new-generation electronics devices means that conventional heat dispersion components such as graphite sheets and heat pipes can no longer provide sufficient heat dissipation.This has created a need for vapor chambers, which can disperse heat over a large surface area and dissipate heat effectively in spite of limited space. The space available for heat dissipators is particularly limited in mobile products with advanced functionality, such as 5G smartphones and AR/VR devices, as they utilize high-performance ICs and face constant demand for reduced weight.Using Murata's technology and expertise in electronic components, the ultra-thin form factor vapor chamber can be mounted in very small interior spaces and still provide efficient dispersion and dissipation of heat from components such as ICs, thereby improving the operating stability of compact electronic devices.The vapor chamber will be manufactured at Cooler Master's factory, benefiting from the firm's expertise in producing heat dissipators for a variety of electronic devices. The cooling solution will be available under the Cooler Master brand.Murata and Cooler Master's ultra-thin vapor chamberPhoto: Companies

Global Unichip Corp (GUC), the advanced ASIC leader, announces GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes and 3DFabric advanced packaging technology for AI, HPC, and networking applications.AI/HPC/Networking memory demand is growing quickly and the SRAM to Logic ratio is also increasing. Logic gains higher density and performance when scaled to N5/N3 process nodes but SRAM scaling from N7 to N5/N3 is moderate. SRAM/Logic disintegration allows the implementation of separate SRAM and Logic at the most efficient process nodes. Layers of CPU and SRAM (Last Level Cache, packet buffers) dies can be assembled over and under interconnect/IO dies using TSMC 3DFabric packaging technology. Such expandable SRAM and modular computing applications are enabled by GUC GLink-3D high bandwidth, low latency, low power, and point-to-multipoint interface between 3D stacked dies. CPUs, SRAMs, Interconnects, and I/Os (SerDes, HBM, DDR) can be implemented in the most efficient process nodes. Different die combinations can be assembled to address different market segments. At boot time, assembled SRAM and CPU dies are identified, unique die IDs are distributed, available memory space and computing resources are defined and a point-to-multipoint GLink-3D interface to the stacked dies is enabled.TSMC's 3DFabric SoIC platform technology allows much more efficient connectivity. GLink-3D achieved six times higher bandwidth/area density, six times lower latency and twice lower power consumption than best-in-class 2.5D interface GLink-2.0 (it was taped out in Dec 2020). Several 3D die stacks can be assembled using CoWoS and InFO_oS, interconnected using GLink-2.5D links and combined with HBM memories."GLink-3D is a new addition to a rich portfolio of best-in-class and silicon-proven HBM2E/3 PHY/Controller and GLink-2.5D IPs. CoWoS, InFO_oS, 3DIC expertise, package design, electrical and thermal simulations, DFT and production testing under one GUC roof provide our ASIC customers with quick design cycles, fast bring up and production ramp up." explains Dr. Ken Chen, president of GUC."3D die stacking technology will start a revolution in the way we design HPC, AI and Network Processors. Die-to-die interface is not limited any more to the die boundary, it can be located exactly where processors need to connect to SRAM and additional CPUs. 3DFabric and GLink-3D pave way to the processors of the future, combining huge and scalable processing power with vast, high bandwidth and low latency memory, when every component is implemented using the most efficient process node." said Igor Elkanovich, CTO of GUC.GLink-3D key features:*Supports TSMC-SoIC stacking of combination of N5 and N6 process nodes *Point-to-multipoint interface allows the main die to interface with several stacked dies simultaneously *Robust, full duplex 9Tbps traffic per mm2 *Speed: 5.0 Gbps per lane *Extremely low end-to-end latency (< 2ns) with low power design (< 0.2pJ/bit) *Single supply voltage 0.75V ± 10%To learn more about GUC's HBM, GLink 2.5D/3D IP portfolio and InFO/CoWoS/SoIC total solution, please contact your GUC sales representative directly.

Sintrones' in-vehicle computers offer a complete solution for in-vehicle applications, including driver behavior monitoring and self-driving capability. They have high flexibility, support a wide range of peripherals and connectors, and can be adapted to various vehicle management systems. Common use cases include: fleet management with GPS requirements, vehicle maintenance systems, and computing for autonomous vehicles.The key highlight of Sintrones' in-vehicle computers is their easy-to-use and intuitive interface, which is highly suitable for self-driving cars, public transport, and other applications that require large capacity systems while maintaining functional simplicity. What's more, these systems can manage the capabilities of the inner components of vehicles to accurately assess and track the state of hardware and software, usage status, and operation of all of the fleets.Among industrial PC manufactures in Taiwan whose core business is in-vehicle computers, Sintrones stands out because of its expertise regarding in-vehicle computer hardware design and manufacturing. They have accumulated years of practical experience and business relationships with end users, which have helped them gain valuable first-hand interactions and insights from countless customers. Sintrones have continuously challenged their own design capabilities for creative inspiration, and eventually rolled out products optimize for in-vehicle environments and usage, achieving impressive results. Since its establishment in 2009, it has continued to accelerate its growth. In 2019, it was successfully became a public listed company in Taipei Exchange.Technological progress for communication systems, driving in-vehicle computers' growthSintrones' Account Manager of the Greater China Region, Juergen Ko, explained during an interview that the development of in-vehicle computers began with integrated systems that incorporated GPS and 3G communication technologies. Back then, Europe was a major region, and also where Sintrones began and developed its business, first by setting a firm foothold in the region with Finland's taxi fleet management, followed by applications in various commercial vehicles such as buses, trucks, taxis, and even trains, etc., which began to sprout and grow rapidly.Take 4G for example, in-vehicle applications have high demand for Power over Ethernet (PoE) technology. Thanks to the application of Internet of Vehicles (IoV), IoT devices were all , including IP cameras. PoE played an important role by solving power supply issues while greatly reducing wiring complexity, with that, in-vehicle monitoring, troubleshooting, and Internet services became mainstream. Although the market was fragmented in its early days, and the difference between requirements among different applications was vast, Sintrones still seized the opportunities for growth, offering specialized custom-made in-vehicle computers for these industries.5G applications sparked a new type of competition for in-vehicle computersWith the advent of the 5G era, public transport systems introduced smart applications en masse, realizing various benefits of living in a smart city, such as bus tracking apps, which allow people to catch it right on time, or traffic control for ambulances which reduces the chance of traffic delays and saves precious time. Both of these applications are backed by in-vehicle computers.The requirements of smart applications center around artificial intelligent (AI), and with the brand new lineup of 5G communication modules and GPUs, in-vehicle computers are on the same track with the future development of next-gen electric vehicle applications. Although the high-diversity, low volume nature of product specs continues to challenge our engineering teams' design flexibility and customization capabilities, the gross margin is over 30%, so the profit structure is relatively stable compared to other electronic manufacturing service industries in Taiwan.According to Manager Ko, in order to keep up with the advent of 5G applications, Sintrones EBOX-7000 series has built-in hot swappable SIM card auto activation modules, which offers Dual SIM Dual Standby, allowing end users to easily switch between SIM cards. The EBOX-7000 series also supports different 5G telecom service providers, offering users the best online experience. Thanks to this, Sintrones has set a new benchmark in the highly competitive 5G application market.Wide temperature and voltage range, positioning us as the hidden campionThe competitive edge of in-vehicle computers is closely related to the engineering teams' experience in design, from wiring layout to thermal design, and customers expect every bit of the details to work in unison. Take Sintrones' entry into the snowplow vehicle market for example. One of the global top three snowplow providers separated from the Mercedes-Benz Group, which also happened to be Sintrones' client, and mentioned that in the presence of heavy snow, thickness detection with GPS and real-time readiness of vehicle and personnel information are required for proper plowing; in such cases, resource allocation efficiency and safety monitoring abilities are crucial for a successful operation. Now, when we compare the taxi fleet in the distant desert area of Dubai and this case, it is clear that both rely on the wide range of temperature design capabilities required to adapt to the extreme environments of the polar region and desert.The biggest difference between in-vehicle computers and common industrial computers is their power input design. Since the voltage supplied to other electronic devices when a car starts up is unstable, our engineering team needs to devise a multi-stage delayed booting mechanism, where the computer will react differently based on the distinct characteristics of cars. For example, a design where the computer is formally booted 5 or 10 seconds after the car starts up once the voltage supply is stable. Moreover, the 9-to-36-volt wide voltage plays a key role in adapting to the voltage fluctuations in cars. The rising trend of electric cars has brought a different set of requirements for power management and control, and Sintrones has already actively deployed applications in the electric vehicle market.Aiming at electric vehicle applications in the coming ageTaking a look at Sintrones' clientele, we can see that business in the quantity-oriented taxi fleet management is going strong. As for cases that serve as indicators, aside from the application in German snowplow vehicles, the application in AI smart buses in Singapore is a key milestone for our high-grade model. This case combines AI with unmanned autonomous vehicle systems by integrating ADAS and using GPUs' high-speed computing capabilities to predict road conditions. At the same time, it meets the various needs of vehicle emergency response; it is currently one of the best models in high-end applications.Our AI applications have also entered the Japanese market. Currently, a key example is a case with a client who specializes in the manufacturing of excavators and construction machinery, where are used as integrated applications in machinery safety warnings and GPS linkage. After years of continuous efforts, Sintrones received wide praise from our clients in the Japanese market. This is now our largest market in Asia, and also one of our key growth-driving forces worldwide.With electric vehicles becoming all the rage around the world, we maintain business relationships with all of the major players, whether it's Foxconn's Make It Happen (MIH) Electric Vehicle Alliance in Taiwan, or mainstream electric vehicle manufacturers from Europe, the U.S., and China. Take France's leading autonomous vehicle manufacturer, Navya, as an example; our collaborative product development plan is only the first of many to come. Regarding the business prospects of in-vehicle computers, as the market continues to undergo huge and drastic changes, Sintrones, who specializes in hardware design and manufacturing, will continue to prioritize promoting this technology and maintaining close contact with frontline system integrators and software vendors. Moreover, by sharing resources with leaders from other industries, such as an alliance with AUO, we will offer more comprehensive solutions to our clients. This is Sintrones' best strategy for our future success.Sintrones' Sales Manager of the Greater China Region, Juergen KoPhoto: CompanySintrones produces flexible high-performing industrial computers, satisfying various smart edge computing requirementsPhoto: Company

Semiconductor chips have been the hottest trending topic recently due to their indispensability in all types of applications, including automobiles, mobile phones, military weapons, and space technology, etc. We can't help but wonder, how do semiconductor plants produce chips with such a large variety of functions out of large silicon wafers? The entire procedure involves an extremely important back-end packaging process known as "die bonding," which is to remove the die from the silicon wafer, and then attaching the die to the IC substrate using a conductive medium such as epoxy or gold wire (with epoxy the most common).With the evolution of the semiconductor miniaturization process, an increasing number of die can be cut from a silicon wafer. The LED die, for example, has evolved from an original die size of about 1mm to micro LED dies of just 100μm or even only 30μm. This means the number of pick-and-place motions in the die bonding process have also undergone a sharp increase, posing severe challenges for manufacturers seeking to maintain operating efficiency and positioning accuracy. To address this issue, ADLINK continues to introduce die bond solutions that are faster, more accurate, and offer easier setting of the dispensing trajectory to fulfill the needs of customers in the semiconductor industry.Supports multiple I/O channels to meet various needs for motion controlFeynman Lin, Technical Director of the ADLINK Smart Machine Product Center, stated that ADLINK's die bond solutions feature an extremely convenient development interface which allows users to easily set the dispensing trajectory and fully supports linear, circular, spiral or mixed trajectories of various shapes while also providing extremely efficient error compensation. More importantly, once the trajectory has been set, users can perform "trigger" control using check list mode, which means the computer will confirm that the correct position has been reached based on sensor information such as temperature, position and weight supplemented by the camera's precise positioning comparison. The adhesive dispensing valve will only be triggered after all conditions are met, enabling precise amounts of adhesive to be dispensed according to user settings. In other words, ADLINK's die bond solutions can be used with a great variety of I/O channels to fully meet the check list requirements that users anticipate.Ruey Wang, Product Manager at ADLINK's Smart Machine Product Center, added that with the advancement of semiconductor manufacturing processes, die size has shrunken exponentially, requiring an increasing number of pick-and-place motions. As such, users as a matter of course have come to expect accelerated pick-and-place sequences that offer the same positioning accuracy. To this end, ADLINK's die bond solution supports "high-speed P2P" and uses closed-loop motion control technology to speed up the tuning speed, suppress resonance or jitter effects in the shortest time, and ensure that adhesive can be dispensed as soon as possible once positioning has been completed.As for why it is necessary to use a camera to assist with positioning, Ching-pang Lin explained that even with more advanced general sensors, positioning accuracy can reach only about 2mm while the process takes 10ms to complete, making it difficult to meet user requirements in terms of both accuracy and speed. In contrast, cameras can reach an accuracy of 0.1mm, and the position can be obtained immediately after shooting, offering a more immediate and convenient positioning method. To facilitate camera applications, ADLINK offers PCIe-GIE74 frame grabbers that can be used with all renowned camera brands. In addition to excellent image capture quality that guarantees no frame drop, this product also comes with real-time power control capability that provides outstanding energy saving efficiency. In addition, ADLINK also offers PCI-8258 DSP-based 4-axis advanced motion controllers, which are suitable for mounting on the motion axes that require high accuracy and immediate response.One particular challenge that users often encounter when performing die bonding is the inability to distinguish driving axles from driven axles, which can easily affect the control ability of the machine due to the resonance effect of the mechanism. ADLINK's die bond solution offers master-slave synchronous control, thus effectively avoiding interference between machines and mechanisms through frequency-domain response analysis technology, a feature that is becoming increasingly important. Over the past couple of years, an increasing number of manufacturers have been attaching two different ICs into the same chip. Apart from the need for increased alignment accuracy, this approach must moreover be supplemented with evasion functions or related processing mechanisms to avoid interference between heterogeneous components. As the perfect solution to this issue, ADLINK's high-speed P2P fast tuning technology and master-slave synchronization control capabilities not only help users achieve higher alignment accuracy and speed, but also completely eliminate interference variables.As the packaging process becomes more and more miniaturized and high-precision, ADLINK's die bond solution continues to evolve and advance, ensuring that the correct positioning can be quickly achieved and the precise amount of adhesive can be dispensed so that users no longer have to worry about short circuits and defects due to misaligned contraposition or adhesive dispensing.ADLINK's die bond solutions feature an extremely convenient development interface which allows users to easily set the dispensing trajectory and fully supports linear, circular, spiral or mixed trajectories of various shapes while also providing extremely efficient error compensationPhoto: CompanyADLINK's die bond solution continues to evolve and advance, ensuring that the correct positioning can be quickly achieved and the precise amount of adhesive can be dispensed so that users no longer have to worry about short circuits and defects due to misaligned contraposition or adhesive dispensingPhoto: Company

The pandemic has changed people's way of life. Changes in the consumption habits of the general public have led to rapid e-commerce and shipping market growth. Logistic processing efficiency has become one of the key capabilities of competing business owners. In addition, in the era of Industrial 4.0, smart factories extensively adopt machinery to replace manpower, thereby enhancing production efficiency and accuracy. Therefore, demand for unmanned automatic guide vehicle-unmanned handling (AGV) and autonomous mobile robot (AMR) will significantly increase in line with market expectations.In order to ensure the smooth operation of AGV and AMR, battery and charger stability play an essential role. The FSP has developed a 600W charger (FSP600-1UAC01) acceptable to a full range of input voltages, with an output voltage of 50.4V-58.8V and an output current of 10.0A. The product has a streamlined appearance and a compact size of only 202x132x69mm/2.2Kg.In addition, according to different AGV/AMR designs, the FSP also provides:*On-board chargers: IP65 waterproof and dustproof grade; CAN bus communication interface option.*Off-board chargers: IP54 waterproof and dustproof grade; handheld handle design; CAN bus communication interface option. The CAN bus communication interface facilitates software updates and features battery operation data recording, anomaly reporting, etc.FSP's greatest advantage lies in its more than 400 R&D personnel and nearly 30 years of power development experience. Therefore, we are capable of providing different types of customization services. Unlike charger products with the same wattages available in the market, FSP600-1UAC01 has the added function of charger condition setting. It provides micro-customization services of charging voltages/currents, locking mechanisms/wires, charging curves that cater to customers' AGV or AMR product needs.The FSP offers chargers for e-bikes under 300W and industrial chargers with high wattages above 400W. Our products come with a complete range of wattages. Feel free to write us if you have different wattage terminal application needs. We can provide you with tailored products and services.FSP releases battery chargers for AGV and AMR