Global Unichip Corp (GUC), the advanced ASIC leader, announces GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes and 3DFabric advanced packaging technology for AI, HPC, and networking applications.AI/HPC/Networking memory demand is growing quickly and the SRAM to Logic ratio is also increasing. Logic gains higher density and performance when scaled to N5/N3 process nodes but SRAM scaling from N7 to N5/N3 is moderate. SRAM/Logic disintegration allows the implementation of separate SRAM and Logic at the most efficient process nodes. Layers of CPU and SRAM (Last Level Cache, packet buffers) dies can be assembled over and under interconnect/IO dies using TSMC 3DFabric packaging technology. Such expandable SRAM and modular computing applications are enabled by GUC GLink-3D high bandwidth, low latency, low power, and point-to-multipoint interface between 3D stacked dies. CPUs, SRAMs, Interconnects, and I/Os (SerDes, HBM, DDR) can be implemented in the most efficient process nodes. Different die combinations can be assembled to address different market segments. At boot time, assembled SRAM and CPU dies are identified, unique die IDs are distributed, available memory space and computing resources are defined and a point-to-multipoint GLink-3D interface to the stacked dies is enabled.TSMC's 3DFabric SoIC platform technology allows much more efficient connectivity. GLink-3D achieved six times higher bandwidth/area density, six times lower latency and twice lower power consumption than best-in-class 2.5D interface GLink-2.0 (it was taped out in Dec 2020). Several 3D die stacks can be assembled using CoWoS and InFO_oS, interconnected using GLink-2.5D links and combined with HBM memories."GLink-3D is a new addition to a rich portfolio of best-in-class and silicon-proven HBM2E/3 PHY/Controller and GLink-2.5D IPs. CoWoS, InFO_oS, 3DIC expertise, package design, electrical and thermal simulations, DFT and production testing under one GUC roof provide our ASIC customers with quick design cycles, fast bring up and production ramp up." explains Dr. Ken Chen, president of GUC."3D die stacking technology will start a revolution in the way we design HPC, AI and Network Processors. Die-to-die interface is not limited any more to the die boundary, it can be located exactly where processors need to connect to SRAM and additional CPUs. 3DFabric and GLink-3D pave way to the processors of the future, combining huge and scalable processing power with vast, high bandwidth and low latency memory, when every component is implemented using the most efficient process node." said Igor Elkanovich, CTO of GUC.GLink-3D key features:*Supports TSMC-SoIC stacking of combination of N5 and N6 process nodes *Point-to-multipoint interface allows the main die to interface with several stacked dies simultaneously *Robust, full duplex 9Tbps traffic per mm2 *Speed: 5.0 Gbps per lane *Extremely low end-to-end latency (< 2ns) with low power design (< 0.2pJ/bit) *Single supply voltage 0.75V ± 10%To learn more about GUC's HBM, GLink 2.5D/3D IP portfolio and InFO/CoWoS/SoIC total solution, please contact your GUC sales representative directly.

Sintrones' in-vehicle computers offer a complete solution for in-vehicle applications, including driver behavior monitoring and self-driving capability. They have high flexibility, support a wide range of peripherals and connectors, and can be adapted to various vehicle management systems. Common use cases include: fleet management with GPS requirements, vehicle maintenance systems, and computing for autonomous vehicles.The key highlight of Sintrones' in-vehicle computers is their easy-to-use and intuitive interface, which is highly suitable for self-driving cars, public transport, and other applications that require large capacity systems while maintaining functional simplicity. What's more, these systems can manage the capabilities of the inner components of vehicles to accurately assess and track the state of hardware and software, usage status, and operation of all of the fleets.Among industrial PC manufactures in Taiwan whose core business is in-vehicle computers, Sintrones stands out because of its expertise regarding in-vehicle computer hardware design and manufacturing. They have accumulated years of practical experience and business relationships with end users, which have helped them gain valuable first-hand interactions and insights from countless customers. Sintrones have continuously challenged their own design capabilities for creative inspiration, and eventually rolled out products optimize for in-vehicle environments and usage, achieving impressive results. Since its establishment in 2009, it has continued to accelerate its growth. In 2019, it was successfully became a public listed company in Taipei Exchange.Technological progress for communication systems, driving in-vehicle computers' growthSintrones' Account Manager of the Greater China Region, Juergen Ko, explained during an interview that the development of in-vehicle computers began with integrated systems that incorporated GPS and 3G communication technologies. Back then, Europe was a major region, and also where Sintrones began and developed its business, first by setting a firm foothold in the region with Finland's taxi fleet management, followed by applications in various commercial vehicles such as buses, trucks, taxis, and even trains, etc., which began to sprout and grow rapidly.Take 4G for example, in-vehicle applications have high demand for Power over Ethernet (PoE) technology. Thanks to the application of Internet of Vehicles (IoV), IoT devices were all , including IP cameras. PoE played an important role by solving power supply issues while greatly reducing wiring complexity, with that, in-vehicle monitoring, troubleshooting, and Internet services became mainstream. Although the market was fragmented in its early days, and the difference between requirements among different applications was vast, Sintrones still seized the opportunities for growth, offering specialized custom-made in-vehicle computers for these industries.5G applications sparked a new type of competition for in-vehicle computersWith the advent of the 5G era, public transport systems introduced smart applications en masse, realizing various benefits of living in a smart city, such as bus tracking apps, which allow people to catch it right on time, or traffic control for ambulances which reduces the chance of traffic delays and saves precious time. Both of these applications are backed by in-vehicle computers.The requirements of smart applications center around artificial intelligent (AI), and with the brand new lineup of 5G communication modules and GPUs, in-vehicle computers are on the same track with the future development of next-gen electric vehicle applications. Although the high-diversity, low volume nature of product specs continues to challenge our engineering teams' design flexibility and customization capabilities, the gross margin is over 30%, so the profit structure is relatively stable compared to other electronic manufacturing service industries in Taiwan.According to Manager Ko, in order to keep up with the advent of 5G applications, Sintrones EBOX-7000 series has built-in hot swappable SIM card auto activation modules, which offers Dual SIM Dual Standby, allowing end users to easily switch between SIM cards. The EBOX-7000 series also supports different 5G telecom service providers, offering users the best online experience. Thanks to this, Sintrones has set a new benchmark in the highly competitive 5G application market.Wide temperature and voltage range, positioning us as the hidden campionThe competitive edge of in-vehicle computers is closely related to the engineering teams' experience in design, from wiring layout to thermal design, and customers expect every bit of the details to work in unison. Take Sintrones' entry into the snowplow vehicle market for example. One of the global top three snowplow providers separated from the Mercedes-Benz Group, which also happened to be Sintrones' client, and mentioned that in the presence of heavy snow, thickness detection with GPS and real-time readiness of vehicle and personnel information are required for proper plowing; in such cases, resource allocation efficiency and safety monitoring abilities are crucial for a successful operation. Now, when we compare the taxi fleet in the distant desert area of Dubai and this case, it is clear that both rely on the wide range of temperature design capabilities required to adapt to the extreme environments of the polar region and desert.The biggest difference between in-vehicle computers and common industrial computers is their power input design. Since the voltage supplied to other electronic devices when a car starts up is unstable, our engineering team needs to devise a multi-stage delayed booting mechanism, where the computer will react differently based on the distinct characteristics of cars. For example, a design where the computer is formally booted 5 or 10 seconds after the car starts up once the voltage supply is stable. Moreover, the 9-to-36-volt wide voltage plays a key role in adapting to the voltage fluctuations in cars. The rising trend of electric cars has brought a different set of requirements for power management and control, and Sintrones has already actively deployed applications in the electric vehicle market.Aiming at electric vehicle applications in the coming ageTaking a look at Sintrones' clientele, we can see that business in the quantity-oriented taxi fleet management is going strong. As for cases that serve as indicators, aside from the application in German snowplow vehicles, the application in AI smart buses in Singapore is a key milestone for our high-grade model. This case combines AI with unmanned autonomous vehicle systems by integrating ADAS and using GPUs' high-speed computing capabilities to predict road conditions. At the same time, it meets the various needs of vehicle emergency response; it is currently one of the best models in high-end applications.Our AI applications have also entered the Japanese market. Currently, a key example is a case with a client who specializes in the manufacturing of excavators and construction machinery, where are used as integrated applications in machinery safety warnings and GPS linkage. After years of continuous efforts, Sintrones received wide praise from our clients in the Japanese market. This is now our largest market in Asia, and also one of our key growth-driving forces worldwide.With electric vehicles becoming all the rage around the world, we maintain business relationships with all of the major players, whether it's Foxconn's Make It Happen (MIH) Electric Vehicle Alliance in Taiwan, or mainstream electric vehicle manufacturers from Europe, the U.S., and China. Take France's leading autonomous vehicle manufacturer, Navya, as an example; our collaborative product development plan is only the first of many to come. Regarding the business prospects of in-vehicle computers, as the market continues to undergo huge and drastic changes, Sintrones, who specializes in hardware design and manufacturing, will continue to prioritize promoting this technology and maintaining close contact with frontline system integrators and software vendors. Moreover, by sharing resources with leaders from other industries, such as an alliance with AUO, we will offer more comprehensive solutions to our clients. This is Sintrones' best strategy for our future success.Sintrones' Sales Manager of the Greater China Region, Juergen KoPhoto: CompanySintrones produces flexible high-performing industrial computers, satisfying various smart edge computing requirementsPhoto: Company

Semiconductor chips have been the hottest trending topic recently due to their indispensability in all types of applications, including automobiles, mobile phones, military weapons, and space technology, etc. We can't help but wonder, how do semiconductor plants produce chips with such a large variety of functions out of large silicon wafers? The entire procedure involves an extremely important back-end packaging process known as "die bonding," which is to remove the die from the silicon wafer, and then attaching the die to the IC substrate using a conductive medium such as epoxy or gold wire (with epoxy the most common).With the evolution of the semiconductor miniaturization process, an increasing number of die can be cut from a silicon wafer. The LED die, for example, has evolved from an original die size of about 1mm to micro LED dies of just 100μm or even only 30μm. This means the number of pick-and-place motions in the die bonding process have also undergone a sharp increase, posing severe challenges for manufacturers seeking to maintain operating efficiency and positioning accuracy. To address this issue, ADLINK continues to introduce die bond solutions that are faster, more accurate, and offer easier setting of the dispensing trajectory to fulfill the needs of customers in the semiconductor industry.Supports multiple I/O channels to meet various needs for motion controlFeynman Lin, Technical Director of the ADLINK Smart Machine Product Center, stated that ADLINK's die bond solutions feature an extremely convenient development interface which allows users to easily set the dispensing trajectory and fully supports linear, circular, spiral or mixed trajectories of various shapes while also providing extremely efficient error compensation. More importantly, once the trajectory has been set, users can perform "trigger" control using check list mode, which means the computer will confirm that the correct position has been reached based on sensor information such as temperature, position and weight supplemented by the camera's precise positioning comparison. The adhesive dispensing valve will only be triggered after all conditions are met, enabling precise amounts of adhesive to be dispensed according to user settings. In other words, ADLINK's die bond solutions can be used with a great variety of I/O channels to fully meet the check list requirements that users anticipate.Ruey Wang, Product Manager at ADLINK's Smart Machine Product Center, added that with the advancement of semiconductor manufacturing processes, die size has shrunken exponentially, requiring an increasing number of pick-and-place motions. As such, users as a matter of course have come to expect accelerated pick-and-place sequences that offer the same positioning accuracy. To this end, ADLINK's die bond solution supports "high-speed P2P" and uses closed-loop motion control technology to speed up the tuning speed, suppress resonance or jitter effects in the shortest time, and ensure that adhesive can be dispensed as soon as possible once positioning has been completed.As for why it is necessary to use a camera to assist with positioning, Ching-pang Lin explained that even with more advanced general sensors, positioning accuracy can reach only about 2mm while the process takes 10ms to complete, making it difficult to meet user requirements in terms of both accuracy and speed. In contrast, cameras can reach an accuracy of 0.1mm, and the position can be obtained immediately after shooting, offering a more immediate and convenient positioning method. To facilitate camera applications, ADLINK offers PCIe-GIE74 frame grabbers that can be used with all renowned camera brands. In addition to excellent image capture quality that guarantees no frame drop, this product also comes with real-time power control capability that provides outstanding energy saving efficiency. In addition, ADLINK also offers PCI-8258 DSP-based 4-axis advanced motion controllers, which are suitable for mounting on the motion axes that require high accuracy and immediate response.One particular challenge that users often encounter when performing die bonding is the inability to distinguish driving axles from driven axles, which can easily affect the control ability of the machine due to the resonance effect of the mechanism. ADLINK's die bond solution offers master-slave synchronous control, thus effectively avoiding interference between machines and mechanisms through frequency-domain response analysis technology, a feature that is becoming increasingly important. Over the past couple of years, an increasing number of manufacturers have been attaching two different ICs into the same chip. Apart from the need for increased alignment accuracy, this approach must moreover be supplemented with evasion functions or related processing mechanisms to avoid interference between heterogeneous components. As the perfect solution to this issue, ADLINK's high-speed P2P fast tuning technology and master-slave synchronization control capabilities not only help users achieve higher alignment accuracy and speed, but also completely eliminate interference variables.As the packaging process becomes more and more miniaturized and high-precision, ADLINK's die bond solution continues to evolve and advance, ensuring that the correct positioning can be quickly achieved and the precise amount of adhesive can be dispensed so that users no longer have to worry about short circuits and defects due to misaligned contraposition or adhesive dispensing.ADLINK's die bond solutions feature an extremely convenient development interface which allows users to easily set the dispensing trajectory and fully supports linear, circular, spiral or mixed trajectories of various shapes while also providing extremely efficient error compensationPhoto: CompanyADLINK's die bond solution continues to evolve and advance, ensuring that the correct positioning can be quickly achieved and the precise amount of adhesive can be dispensed so that users no longer have to worry about short circuits and defects due to misaligned contraposition or adhesive dispensingPhoto: Company

The pandemic has changed people's way of life. Changes in the consumption habits of the general public have led to rapid e-commerce and shipping market growth. Logistic processing efficiency has become one of the key capabilities of competing business owners. In addition, in the era of Industrial 4.0, smart factories extensively adopt machinery to replace manpower, thereby enhancing production efficiency and accuracy. Therefore, demand for unmanned automatic guide vehicle-unmanned handling (AGV) and autonomous mobile robot (AMR) will significantly increase in line with market expectations.In order to ensure the smooth operation of AGV and AMR, battery and charger stability play an essential role. The FSP has developed a 600W charger (FSP600-1UAC01) acceptable to a full range of input voltages, with an output voltage of 50.4V-58.8V and an output current of 10.0A. The product has a streamlined appearance and a compact size of only 202x132x69mm/2.2Kg.In addition, according to different AGV/AMR designs, the FSP also provides:*On-board chargers: IP65 waterproof and dustproof grade; CAN bus communication interface option.*Off-board chargers: IP54 waterproof and dustproof grade; handheld handle design; CAN bus communication interface option. The CAN bus communication interface facilitates software updates and features battery operation data recording, anomaly reporting, etc.FSP's greatest advantage lies in its more than 400 R&D personnel and nearly 30 years of power development experience. Therefore, we are capable of providing different types of customization services. Unlike charger products with the same wattages available in the market, FSP600-1UAC01 has the added function of charger condition setting. It provides micro-customization services of charging voltages/currents, locking mechanisms/wires, charging curves that cater to customers' AGV or AMR product needs.The FSP offers chargers for e-bikes under 300W and industrial chargers with high wattages above 400W. Our products come with a complete range of wattages. Feel free to write us if you have different wattage terminal application needs. We can provide you with tailored products and services.FSP releases battery chargers for AGV and AMR

As the world gets shrouded in COVID-19, low contact has become an essential element in daily lives and work modes in order to prevent the spread of the virus. Under such circumstances, equipment connectivity has gradually become common; the demand for stable and high-speed wireless communication technology has greatly increased; and the role of Wi-Fi 6 will become increasingly important. Bureau Veritas, a major global company specialized in testing, inspection, and certification, held a seminar on "New Opportunities for the Communication Industry in the New Era of Wi-Fi 6E" at Dazhi Denwell, Taipei on April 9, 2021. The latest regulatory trends and key points for certifications concerned with related technologies were explained and analyzed by the technology experts from Bureau Veritas.Pascal Le-Ray, the general manager of Bureau Veritas Taiwan, pointed out in his speech that, since COVID-19 has changed the entire world, communication technology has become the most important technology for the communications between people, between people and things, as well as between things. For instance, when different countries imposed lockdowns in 2020, it became necessary for various large companies to rely on online meetings to maintain operation. At the same time, an array of systems with smart functions emerged to meet demands, showing that the quality of communication technologies will become increasingly crucial for the digital transformation of companies and agencies. With industry-leading testing capability for Wi-Fi 6E, Bureau Veritas already has testing laboratories appointed by the Wi-Fi Alliance. The company is able to provide all-round Wi-Fi certification testing to wireless-network product manufacturers. Meanwhile, the company also has extensive experience in testing for compulsory test items required by relevant standards; and it has assisted many clients in successfully obtaining FCC certifications. Businesses that intend to step into this field may take advantage of Bureau Veritas' professional abilities to minimize time spent on bringing products into the market.Continuous developments in regulations of various countriesFor the first agenda of the seminar, Hank Chung from the Technical Services Division of Bureau Veritas gave a brilliant presentation on the topic of "Wi-Fi 6E Product Regulation Development Trends and Verification Unit Preparation". Hank Chung stated that Europe and the US have formulated new regulations for Wi-Fi 6E. The US has opened up 4 frequency bands for this purpose. But since these 4 frequency bands were previously opened for the use of other technologies, the FCC has set restrictions to protect Incumbent System from interference. As for Europe, the European Commission of Communications opened up the frequency band of 5925-6425MHz. Overall, compared to the 2.4 GHz and 5 GHz spectrums currently in use, the bandwidth of the new spectrum is an increase of more than 150%.The FCC's formulation of regulations for Wi-Fi 6E was announced in May 2020, and its corresponding test method did not complete until October 2020. Therefore, despite the faster pace at which the frequency bands were opened in the US, manufacturers did not have products available until December 2020. Basically, the FCC's regulations for Wi-Fi 6E 6GHz is still under the same original UNII chapter as before, and the related technical requirements are further extended based on this. Such regulations are separated into two categories: AP and Client. Equipment belonging to these two major categories are divided into high power and low power classifications based on their features. High-power equipment can be used outdoors and indoors. In addition to the original RF transmitter-related tests, it also needs to comply with the requirements of AFC (Automated Frequency Coordination) or CBP (Contention-Based Protocol). Low-power equipment is mainly used for indoor use. In addition to the original RF transmitter-related tests, there are also related product design restrictions (such as power supplied requirements, antenna requirements, etc.) and the requirements of the CBP (Contention-Based Protocol). The FCC has formulated limitation regulations for these classifications, so Hank Chung specially reminded businesses that they must first clarify the classifications to which their own products belong and take these into consideration at the design stage.In addition to the key points of FCC's regulations, David Liu from the Technical Services Division of Bureau Veritas also gave an in-depth explanation of the UKCA marking requirements for radio equipment. He stated that after leaving the EU, the UK also formulated its own UKCA Marking directives, which include most goods several standards previously subject to CE markingrequired by the CE, including the EMCD, LVD, RED, and RoHS; these were put into effect on January 1, 2021. In relation to these UKCA markingstandards, he made several suggestions for products sold in the UK. 1. If you need to (or choose to) use an authorized representative or responsible person, they will need to be based in the UK for products being placed on the GB marketBusinesses must give the responsibilities of this matter to locally authorized personnel. 2. Check your legal responsibilities, confirm that your own company or and distributors have a clear understanding of the modified legal responsibilities if changed. 3. From 1 January 2023, the UKCA marking must, in most cases, be affixed directly to the product. You should start building this into your design process ready for this date. Goods to be shipped must have UKCA markings when being labeled. 4. In addition to UKCA marking, information including the names and addresses of the manufacturer and importer also need to be displayed on labels. 5. Products to be sold in the GB UK must comply with the UKCA marking, CE DoC; the UK DoC and related technical documentations must be signed and kept for 10 years after the product's entry to market , kept for up to 10 years after the product is placed on the market. 6. The UK standards are currently the same in substance and with the same reference as the standards used in the EU The regulations put into effect on January 1, 2021 was announced simultaneously in the EUOJ content published on the same day. 7. Note that products sold to the UK should follow relevant UK legislation (rather than EU legislation) UK regulations rather than EU regulations. Corresponding information can be found in several regulations. For electromagnetic compatibility, see Electromagnetic Compatibility Regulations 2016 (S.I. 2016/1091); for low voltage products directives, see Electrical Equipment (Safety) Regulations 2016 (S.I. 2016/1101); as for radio frequency equipment, relevant instructions can be found in Radio Equipment Regulations 2017 (S.I. 2017/1206).Information security designs have become essential for Wi-Fi 6EWith regard to high-quality connections supported by large capacity, high efficiency, and high performance, Jimmy Wang from the Wi Fi NFC Testing Section of Bureau Veritas introduced Wi-Fi Alliance's latest certification technologies for Wi-Fi 6E and WPA3. He said the frequency band of Wi-Fi 6E has extended into 6 GHz, and the bandwidth with higher speed greatly reduces the delay of signal transmission. While the fast and trouble-free transmission brought by the various features of Wi-Fi 6E leads to an array of smart services, it will also give rise of risks of user information leakage or security attacks during the information transmission,. Therefore, Wi-Fi Alliance released new version of WPA3 in December 2020. The testing of SAE with Hash-to-Element and Transition Terminated Indicator will be required from December 2021.Moreover, it adds some optional features. The first one is SAE Public Key (SAE-PK) This mechanism uses encrypted public key fingerprints to provide asymmetric authentication in order to prevent external malicious attacks. The next feature, Beacon Protection, ensures signal integrity by only utilizing keys that can be obtained by network equipment. The third feature is Operation Channel Validation. In the process of switching transmission channels, the system provides mutual authentication to both channels. The last feature is Privacy Extension. To achieve this, the system is enabled to support the designs of randomized MAC addresses, which protect the privacy of Wi-Fi users.In addition, Kenny Lee from the Technical Services Division of Bureau Veritas also shared and explained the development trends of information security regulations in recent years. He first pointed out that, in 2020, Bureau Veritas received the "Industry Leader Award" in the Professional Services Category of the Dow Jones Sustainability Indices (DJSI) with honor. Bureau Veritas sets the highest benchmark in the industry as an impartial third-party certification agency. Its information security testing laboratories have assisted many manufacturers in successfully completing certifications.Regarding information security regulations, countries around the world have continuously introduced information security laws in the past few years in response to the emerging era of smart networks. Looking at Europe as an example, in 2019, the EU granted authority to the European Union Agency for Cybersecurity (ENISA), and ENISA officially became a permanent cybersecurity agency of EU. ENISA is responsible for formulating certification plans, guiding the development of technical certification frameworks, and assisting member countries in dealing with large-scale cyber attacks. In addition to the EU, other major industrial nations have also begun to launch related plans one after another. Apart from rolling out relevant strategies, the agencies have also started to formulate related regulations. The IEC 62443, RED ARTICLE 3.3, and ETSI EN 303 645, for example, provide comprehensive directives that give businesses in various industries a clear direction for product design.As a global agency specialized in information security certification, Bureau Veritas provides professional Wi-Fi certification and testing services for industrial control systems and consumers. Kenny Lee expressed that, as market demands rapidly emerge and various countries make regulations more stringent, manufacturers can take advantage of Bureau Veritas' expertise and experiences to quickly create products that comply with market regulations. Doing so can help reduce time spent on entering the market and enhance company competitiveness.

The recent global shortage of automotive chips has brought Taiwan's semiconductor industry into the focus of worldwide attention. The real cause of why Taiwan's semiconductor chips are in such great demand is due to their trusted, unwavering quality that's supported and assured by a series of rigorous verification procedures. The electrical measurement performed before integrated circuit packaging is one of the most important steps of verification. To complete this task, the engineering probe station system must be used in conjunction with a variety of test instruments, automatic test equipment and specially designed engineering verification system.The challenges of electrical measurement lies in the fact that the input of the silicon wafer measurement signals cannot be seen directly by the naked eye, but only through simulation. As such, how does the probe station generate a real-time response based on the analog signal generated from contact between the probe and the silicon wafer, thus directing the probe to continue performing the subsequent motion (such as a slight pause, or horizontal movement, etc.) while also ensuring that the probe head accurately and effectively touches the silicon wafer? Although this indeed constitutes a major challenge, it's something that can be overcome with good motion control.To address this issue, ADLINK has been closely following the evolution of semiconductor manufacturing processes over the years, and has developed a series of probe test solutions that offer the advantages of both high precision and high speed. These solutions can be used to simulate and control at the same time, thus enabling clients such as wafer manufacturing plants or IC packaging plants to directly begin probe test operations without needing to purchase additional servo controllers with related functions.Enhancing the efficiency of error compensation through closed-loop motion controlFeynman Lin, Technical Director at ADLINK's Smart Machine Product Center, states that as ADLINK has been working closely with test equipment factories and semiconductor factories for many years, the company is well versed in the challenges that may arise in the probe test process. Therefore, it has continued to refine the probe test solution and already perfected many key technologies. In addition to the above, the analog input control function has been integrated into the motion control card so that it can fully correspond to the corresponding instantaneous command control, thereby preventing the probe from moving abnormally. Lin further explains that as the silicon wafer is often not a neat, level plane, it is necessary to constantly adjust the position of the probe to avoid damage to the silicon wafer or probe head due to excessive contact.Ruey Wang, Product Manager at ADLINK's Smart Machine Product Center, goes on to add that whether before or after the positioning of the probe, it will need to perform various motion controls, including moving up and down continuously, shifting horizontally, or moving to the next point. Now, through its profound knowledge of motion control technology, ADLINK is able to efficiently meet these diverse and constantly changing needs.Furthermore, each silicon wafer has hundreds or thousands of points to be tested on which testing must be performed. Therefore, in order to achieve optimal timeliness, the probe must be able to continue moving quickly and efficiently. Resonance and jitter however are likely to occur at the moment of positioning, and measurement cannot be performed until after tuning has been completed. To minimize the lag resulting from time spent waiting for tuning to be completed, ADLINK has developed rapid tuning technology which allows the probe to move before the Z axis of the workbench under test (for silicon wafers) is stabilized, thereby increasing tuning speed and achieving the effect of resonance suppression. This is to ensure that the probe will no longer vibrate as soon as it is in place, and is able to immediately execute testing.Feynman Lin additionally indicated that the ADLINK probe test solution supports "closed-loop motion control" by continuously calculating on a rolling basis the average value of the error between the number of commanded steps and the actual number of steps. When the next command is issued, it can directly combine the number of commanded steps with that of error steps (if the original command is to move 5mm and the average error is 0.01mm, then the subsequent command is directly adjusted to 5.01mm). By directly carrying out error compensation within the same motion, error distance can be reduced even if the compensation is not 100% complete, and is thus greatly conducive to improving testing speed.Other technical features of the solution include "mixed use of multi-axis linearity and arc angle compensation" and "process interruption protection mechanism." In the previous usage scenario, the main reason is that the wafer carrier may move in X-axis, Y-axis or Z-axis interchangeably. The path of travel is a mixture of straight lines and curves. In complex situations like this, the ADLINK probe test solution can continue to perform route detection and error compensation step by step, regardless of whether each segment is a straight line or an arc without the need to pause for switching or causing breakpoints in the testing process. Process interruption protection, on the other hand, usually comes into play in scenarios of sudden power glitches or power failure. The state immediately before the interruption will be recorded, and the process will continue to be executed after power is restored without need to waste time by starting the process all over again.Also worthy of mention is the fact that ADLINK has developed an "Automation Product Software Development Kit" (APS SDK) based on the experience and product functions the company has accumulated over the years. The APS SDK can also be used in probe test applications to help semiconductor clients significantly accelerate the development and deployment of motion control programs.In conclusion, ADLINK will continue to closely monitor the evolutionary trends of Mini LED or MicroiLED backlight technology, 2.5D or 3D packaging technology, and even 2nm or 1nm process technology, as it continues to strive for excellence by launching probe test solutions that fulfill customer expectations with faster execution speed while maintaining high-precision performance.ADLINK has been closely following the evolution of semiconductor manufacturing processes over the years, and has developed a series of probe test solutions that offer the advantages of both high precision and high speedPhoto: CompanyHow does the probe station generate a real-time response based on the analog signal generated from contact between the probe and the silicon wafer, thus directing the probe to continue performing the subsequent motion while also ensuring that the probe head accurately and effectively touches the silicon waferPhoto: Company

The CMEF (China International Medical Equipment Fair) is one of the biggest exhibitions of its kind in the world and always shows the latest professional medical equipment available on the global market. The 2021 exhibition will be held between May 13 and 16 at the National Exhibition and Convention Center (Shanghai). Tens of thousands of professional medical products from producers all around the world will be exhibited. More than 4,200 global medical, industrial and commercial medical equipment enterprises and R&D units will be represented.APD is a leading brand of customized power supplies for medical devices and a long-term partner of many major global medical equipment companies. APD has been developing medical power supplies for more than 20 years and will be showing a full range of highly reliable medical power supplies. Among these will be our lithium-ion UPS (uninterruptible power supply) products which are a new trend in customized medical power as well as being useful in practically all other industries. Visit us at booth number: 8.1 D17 to see these special new products."High stability and reliability", power supplies that put the minds of medical clients at easeMark Tang, Vice President of the APD Department of Power System Business says, "What medical industry customers care most about is the quality, stability and reliability of power supplies. APD can satisfy the most rigorous customer requirements for medical power that is how we have earned the long-term trust of major medical equipment manufacturers".This is indeed the case. APD is committed to providing customized medical power solutions and concentrates on innovative R&D in the network communications and medical fields. We have won the approval of our customers many times over with outstanding product quality and R&D capability. APD has received the "Best Product Quality" and "Best Partner" awards from major global network communications and medical equipment manufacturers year after year. The APD production base has passed the ISO 13485 medical device quality management system certification and our full range of highly reliable medical power supplies comply with the IEC60601-1-2 4th Edition global medical safety standards. All our products have a lifespan of more than 10 years and are widely applied for use with CPAP machines, ventilators, oxygen concentrators, humidifiers, medical monitors, syringe pumps, portable ultrasound equipment, hospital electric beds, endoscopes, IVD and many other medical applications.Small and lightweight products appearanceThe "small size and light weight" of the highly reliable APD medical power supply series is their main feature and allows them to be used in a wide range of small portable devices. This series also has integrated LED operating status indicators and they are dust- and water-proofed to class IP22. The device housings are made of UL94V0 fire-proof grade material, which has a higher safety specification than the standard and all casings are given an anti-wear protection treatment. The patented anti-rupture output cable arrangement allows for multiple bends and is used to ensure the greatest convenience and product durability.Multiple safety protection mechanism designsAll APD medical power supplies have multiple safety protection: very low leakage current, high tolerance to electrostatic discharge, as well as protection against over-voltage, over-current and over-temperature. They can be used on any kind of medical instruments and devices without any risk of electric shock for patients or operators. Another thing worth mentioning here are the excellent cooling arrangements and the anti-electromagnetic interference design. These open frame power supply products have better than normal cooling and anti-interference performance, are extremely safe, and can be used with any fan-less medical equipment.Peak current can be more than 300%The peak current of the APD medical power supplies can be more than 300%. This allows a stable response to transient high current requirements generated by medical equipment. This series of power supplies is also very quiet. Operation noise is extremely low and does not interfere with the quiet healing atmosphere needed in the patient environment.Lithium battery applications are becoming a trend, and the global sales of APD lithium-ion UPS ranks among the highestThe rapid development of lithium battery technology and significant improvement in safety has resulted in lithium-ion UPS applications becoming the trend. APD has extensive experience in the R&D of power supply products and is actively developing a range of lithium-ion UPSs. We have earned the trust of many major global first-line manufacturers with our outstanding customized R&D capabilities. The pace of R&D at APD is ongoing and we have become leaders in the global sales of lithium-ion UPS products for medical equipment, industrial automation, security monitoring and transportation.APD will be launching several new lithium-ion UPS products for medical applications at the 2021 CMEF exhibition in Shanghai. These new products are all simple, quiet and white, to match the overall environment of the medical facilities where they are meant to be used. More importantly, these devices are small, lightweight, and have long usage lifespans. They will undoubtedly become the first choice power supplies for medical equipment.Small, lightweight, and a long usage lifespanThe useful life of an APD lithium-ion UPS is up to 3 times that of a traditional lead-acid battery UPS. Furthermore, the volume of a lithium battery is about 1/3 that of a lead-acid battery of the same capacity. This means that the APD lithium-ion UPS can be much more compact and lightweight. These smaller devices can be easily placed in narrow spaces such as nursing stations and on medical equipment pedestals. They are suitable for installation on medical trolleys and other mobile diagnosis and treatment equipment.Safe and quiet, with smart controlThe APD lithium-ion UPS design (T-48V480WL) is fan-less and the devices are practically silent in operation. This ensures that when they are installed near patients, they will cause no disturbance. The low leakage current design also ensures the safety of patients as well as personnel. The smart BMS battery management system can monitor the battery status in real-time, making the battery status very easy to control.An uninterruptible power supply is very important for medical facilities. Medical equipment, diagnostic, clinical, or surgical, all need stable constant power supplies, as do data centers and terminals. According to Peter Hu, the General Manager of APD Uninterruptible Power Supply Systems, APD lithium-ion UPS products are widely used on medical diagnosis and treatment trolleys, in medical electrical rooms, medical records departments, self-service patient registration machines, hospital incubators, hospital isolation wards and others. They provide the best customized lithium-ion UPS solution for all medical applications.During the coronavirus pandemic, the demand for medical UPS systems related to wards, medical equipment and control rooms etc., has remained high. Now, with the global pandemic pressure going down in many places the medical equipment and instrument market is recovering to a degree. APD is optimistic about our future market share in the medical power field and this will be reflected in our new range of products that will be shown at CMEF 2021 in the spring.APD lithium-ion UPSHighly reliable medical power supplies from APDAPD grabbed attention at CMEF 2021

Changes in consumption habits are urging retailers to accelerate the pace of smartization. Under this trend, the weight carried by POS systems and kiosks, which play important roles in the operation of physical stores, will gradually increase. As a major IT system provider for retail and catering industries, DataVan International Corporation recently acquired industrial computer manufacturer Maincon Corporation in order to strengthen product layouts and service capabilities.DataVan International Corporation's Executive Director Mao-cheng Hsu of the Technology Department and Vice General Manager Yi-ching Chen of the General Administration Department both expressed that the two companies will perfectly complement each other in the areas of technology and product marketing, leading to more comprehensive solutions for clients.DataVan International Corporation has many years of experience in the fields of IT systems for catering and retail industries, including POS systems and kiosks. The company's overall business performance has maintained steady growth despite the fact that many clients have been merged into other companies during the wave of mergers and acquisitions that started in the past few years. Yi-ching Chen stated that the company's main target markets are mostly occidental countries, and the x86 architecture is the focal point of its technology. Recently, the company has decided to expand into the Asian market and increase the proportion of its Android products, therefore, the decision to acquire Maincon Corporation was made. DataVan International Corporation has acquired 60% of Maincon Corporation's equity for now. Mao-cheng Hsu also stated that Maincon Corporation not only has all-round marketing networks in several Asian markets including Japan and Southeast Asia, but also has established great collaborative relationships with local major manufacturers. In terms of technology, Maincon Corporation has a strong foundation in the Android field. In recent years, Maincon Corporation has seen positive results of its substantial investment in AI; it already has practical solutions that can be implemented. These strengths will complement DataVan International Corporation.After the acquisition of Maincon Corporation, DataVan International Corporation will use Maincon Corporation's marketing networks in Asia to allow its products, including POS and kiosk systems, to smoothly enter the local markets. In addition, Maincon Corporation's Android and AI technologies will be utilized to create smart retail solutions, which will also be promoted in the existing European markets. Mao-cheng Hsu mentioned that Maincon Corporation has many successful cases of smart solutions under its belt. It previously worked with NESIC, a subsidiary of Japanese IT company NEC, in launching a smart epidemic prevention system. In addition to its success in the retail industry, Maincon Corporation also has substantial achievements in other fields, including industrial control and transportation. In the industrial control domain, the company has worked with AsusTek Computer in building an industrial safety surveillance platform; in the transportation domain, the company has assisted Malaysia in building a smart transportation system.Regarding future plans, Yi-ching Chen believes that smartization is an irreversible trend in the market, so DataVan International Corporation will integrate AI technologies and launch smart POS terminals as well as other retail equipment. In fact, in 2018 the company had already developed a smart solution that builds AI machine vision into POS machines. It allows quick product identification and speeds up checkouts. However, the global market was affected by the pandemic in 2020, forcing product plans to be suspended. Depending on market recovery, the plans will resume in the future. Moreover, DataVan International Corporation will also launch POS machine models with remote monitoring. The function enables mangers to control POS devices located at different places and get hold of the devices' operating statuses via an online platform.In addition to smart POS systems, DataVan International Corporation also plans to extend its technology into other areas of the retail industry, including warehousing and logistics. Mao-cheng Hsu mentioned that, as the retail industry steps into the O2O era, online and offline transactions have begun to be tightly integrated. This trend has made it difficult for a POS system to satisfy the demands of a physical store. Upstream and downstream systems, including logistics and warehousing, must integrate to allow the seamless flow of information. This aids the creation of more diverse services. For example, smart shelves can enable the warehousing system to automatically generate the data of purchases, inventories and sales, which can be utilized by the store and logistics service providers.In another project of DataVan International Corporation, the company worked with an American client in creating an inventory-tracking smart robot system. Robotics and kiosks are the two main technologies integrated in this system. During the opening hours of a store, various product information and services are provided through kiosks; at night, robots automatically go around the store and track the types and numbers of products on the shelves. At present, DataVan International Corporation has shipped the kiosks to the United States, and the integrated inventory-tracking smart robot system is still in progress. In the future, aided by Maincon Corporation's AI technology, DataVan International Corporation will optimize the functions of the robots and market the product to the European market. Mao-cheng Hsu and Yi-ching Chen both stated that this project is the best example of how DataVan International Corporation and Maincon Corporation complement each other with their strengths. Projects similar to this one will emerge quickly as the pace of smartization accelerates in the retail market. DataVan International Corporation will use this investment plan to expand the company's operational arrangements and satisfy market demands with integrated solutions.DataVan International executive director of Technology, Mao-cheng Hsu (right) and vice GM of General Administration, Yi-ching Chen (left) both express that the strengths of their company and Maincon will complement each other; DataVan will let this investment plan be the core of the company's operational arrangement expansionPhoto: Digitimes, April 2021

In this 5G era, diverse environments have led communications systems and equipment suppliers to find different development opportunities. Also, as private business network applications gradually lean towards white-box and intelligent products, networks communications and electronic manufacturing companies in Taiwan are entering the information and communication technology field to compete for opportunities in equipment for 5G terminals, base stations, private business networks, core networks, or cloud datacenters.As high-speed data transmission enhanced the performance of processors, heat dissipator designs also improved greatly and pushed the thermal module market to grow many-fold. Intel and AMD multicore processors, for instance, contain additional units crammed into smaller sizes, so challenges for heat dissipation design have skyrocketed. Ricky Yu, Product Consultant Deputy Manager at T-Global, stated in our interview that with 5G communications initiating large-scale business transformation, the IoT and base station equipment supporting 5G technology will have increased heat sources and generate enormous opportunities for heat dissipation solution providers.Heat dissipation starts with conduction, and TIM is the keyT-Global started as a materials supplier. Thermal interface material (TIM) is mainly used to fill in microvoids between jointed materials and pores on object surfaces in order to reduce contact thermal resistance.Yu explained that heat dissipation begins with heat conduction, so by supplying materials like thermal tape and thermal grease, T-Global quickly became an important link in the electronics ecosystem. The company integrates different heat dissipation technology, combining them into customized solutions or even exclusive features for client products, which are then patented by the client to improve the product's competitiveness.T-Global knows their heat dissipation and conduction technologies. For example, thermal grease contains volatile silicone oil and has limited warranty periods, so for professional industrial computers and systems requiring 3, 5, or up to 10 years lifespan, development and wide application of thermally conductive silicone sheets have become the next trend.Based with metallic oxides such as aluminum oxide, thermal-conductive powders such as boron oxide, and silicone, the product has good heat conductivity, low thermal resistance, and withstands electrical voltage. It performs a variety of functions by reinforcement with different materials, and, being highly customizable, is highly adaptable in a wide range of scenarios according to the client's heat source wattage, target temperature, and thermal dissipation area. Therefore, it is greatly valued in the industry.By continuously building up practice in different areas, T-Global's engineering team participates in design and service to understand client needs and to raise precise proposals. The current main objective is to apply varied technologies with good integration plans, so that as the market grows rapidly, T-Global may transform into a heat dissipation solution provider and take off on enhanced business. With the widespread use of smart devices and the surge of IoT applications in everyday life, lightweight small electronics are in huge demand and their heat dissipator designs need to keep up with the times.Heat pipe and vapor chamber technologies each have their advantagesToday, metal heat pipe and vapor chamber technologies have leapt to front page. Ultra-thin heat pipes and vapor chambers both have nearly hundred-fold the heat dissipation performance of pure aluminum, and heat pipe technology is already mature. In the past year, the cost of raw materials like copper has risen, and to help clients face impacts caused by pandemic-related raw material price fluctuations, T-Global endeavored to respond with innovative developments that balances lacking resources with those plentiful, thus reducing cost burdens for clients and proactively addressing designs like server rooms that rely mainly on fans, cooling fins, and heat pipe technology.Furthermore, Yu points out, with the growth of 5G base stations and subsequent high-speed gateways going strong, business in vapor chambers has increased rapidly in the past 5 years, and future development opportunities are also increasing. Outdoor 5G base stations, for example, require waterproof and dustproof designing for the outdoor infrastructure and devices. As the specialized sealed design permits no ventilation, TIM specifications are the key to success.Heat dissipation performance with 3 or 4 mm vapor chambers is good, but there is still much room for improvement. T-Global uses ultra-thin vapor chambers that are less than 0.4 mm, and developed the first TIM in the market with over 18 W/m.K. Vapor chambers are quickly becoming the new favorite, but they require up to 2.5 times the cost of heat pipes, and its production yield has always been a formidable challenge, so they are the center of attention for market competition.High investments in software and testing equipment help clients avoid failure5G base stations for high-speed data transmission as well as automotive control systems containing sensors and cameras with IoV and numerous devices are becoming increasingly large heat sources, and the number of heat dissipation cases for 250 W and up have surged. To create optimal designs that address performance and cost, diverse heat dissipation combinations including advanced technology such as vapor chambers are in high demand and require comprehensive designing and testing support.From obtaining reliable high-quality ceramic powder and recipes from Japan or Europe, to providing thermal modules and solutions, T-Global has it all down to a T, and it all comes from the practical and designing experience accumulated over a long time. Yu explains using a computer thermal module as an example: the polished metal surfaces of the aluminum base and cooling fin seem to be closely joined against each other, but research reports that the effective thermal conductive area between to two is 10% or less, while up to 90% of heat is accumulated on the metal surfaces. So the design and modeling of each and every heat removal solution are extremely important starting points.Based on equipment differences in heat dissipation requirement and its overall environment, complex system parameters and specifications need to be considered, and a complete design model must be made with professional heat transfer analysis software. Costly software including Flotherm XT was purchased to create key design profiles and architecture to reduce designing time greatly.T-Global runs actual tests simultaneously with lab machines and a testing chamber to verify engineering designs and save clients a great deal of developing time and costs. The company also offers multiple design proposals and helps the supply chain prepare early for the end client's future product designs.T-Global's clients now extend across industrial computer, automotive electronics, NB, display panel, smart LED lighting, networks and communication system, and IoT industries. For the next stage, the 5G application, electrical cell, power storage, and electric vehicle industries are important links that T-Global will actively involve in its supply chain. The company will help clients avoid unsuccessful trials, and create continuous opportunities.MIT engineering team that collects practical experience in different areasDiverse thermal conductive materials and productsVapor chambers have quickly become a favorite in the industry

Zymergen, a biofacturing startup located in the United States, is showcasing its new film at Touch Taiwan 2021, the world's leading exhibition for the display industry supply chains. Hyaline Z2, Zymergen's first product for electronics applications, is a new polyimide film developed by Zymergen - delivering a premier combination of high transparency and mechanical properties that is engineered to enable more design freedom for electronics products.Zymergen is a science and material innovation company founded in 2013. The company partners with nature to design, develop, and commercialize bio-based breakthrough products, fundamentally changing not only how things are made but what they are made of. Zymergen's proprietary biofacturing platform merges advances in automation, machine learning, and molecular biology to design breakthrough products. Its innovative materials are applied to a wide spectrum of categories including electronics materials, agricultural solutions, personal care products, and beyond.With employees currently in Japan, Zymergen recently established an additional presence in Taiwan to engage a broader number of customers, suppliers and product manufacturers. Touch Taiwan is an opportunity to both showcase the first in a new Hyaline family of films and engage companies from across the electronics ecosystem.Zymergen is inspired by nature to develop Hyaline (polyimide films) familyZymergen