A great amount of reconstruction of hardware equipment is required by terminal applications, macro sites, micro Sites, transmission networks, core networks, or cloud data centers in the age of 5G to satisfy the needs for high speed transmission and various IoT applications. In order to achieve high frequency and efficiency in a 5G communication environment, different 5G equipment needs power supplies with high power and small volume (namely having a high power density), and meeting the standard of intelligent power management.To satisfy the requirements of the power supply demand for the 5G market, FSP Group has been devoting a great deal of resources to develop the most complete 5G power supply products on the market. FSP Group aims to bring the clients that participate in 5G-related applications power supply solutions which satisfy every need on just one site.As systems are developed to be open-source and standardized, there is a need for various types of standard power supplies. FSP Group understands what clients need and thus provides standard power supplies and customized power supply services for transmission network BTO equipment (i.e. servers, gateways, routers, storage). Meanwhile, these power supply solutions are compatible with old systems, which avoids problems of the integration of old and new systems for clients.FSP Group has the largest variety of wattages of CRPS products in the industry, ranging from 550W to 3000W. In addition, 550W-2400W products are unified into the same size so that clients don't need to adjust the size of their computer cases when upgrading, enjoying a smooth upgrade when changing to a power supply with a higher wattage. FSP Group CRPS products have the following features that satisfy all of the 5G equipment requirements for manufacturers:High power, low loss. 80 PLUS Titanium certification Highest power density up to 74.2W / inch3 Meet Intel's CRPS 2.0 platform standard Meet the NEBS standard of network communication industry Compliant with tough conditions: applicable to a wide temperature range, surge-protection Three input options available: AC/LVDC/HVDC Providing the most complete data center power supply solutions Having intelligent features that accept host monitoring Support Airflow in or outFSP Group CRPS products apply to various locations such as small or medium cloud servers or large data processing centers. These products not only support the standard PMBus 1.2 protocol, but also provide professional firmware customization that, along with the management software developed by FSP's partner, enables information administrators to timely monitor the operation of power supplies and boost the stability of the operating hardware systems. Different options of CRPS products are available, including single module, 1U, and 2U power supplies. Two kinds of cables are also offered to choose from: non-modular and modular. Clients can flexibly select the most ideal products according to their system deployment requirements. With complete and standard products and great customization service, FSP Group becomes the best power supply product supplier of this 5G, IDC, AI, and IIoT trends.FSP-FC250 Series and FSP-FC210 Series

FSP has long been committed to providing a wide range of reliable power supply solutions to help realize the future of smart living. Comprising hundreds of software and hardware engineers throughout the world, the FSP team is capable of delivering comprehensive technical support and service to partners. Taking market mainstream standardized and smartized power supplies for example, FSP's portfolio of power supply products feature expandability, digital control and communication capability in addition to high power density, high efficiency and resistance to harsh conditions, making FSP the designated partner of leading international firms.Mature image recognition and NB-IoT technologies are parking lots in Taiwan growingly smart. Surveillance systems automatically identify license plates such that car owners no longer need to retrieve and keep the parking token/slip and parking lot operators can save tremendous management costs. In the future, such smart services coupled with 5G mobile communication will allow one control center to simultaneously monitor multiple parking lots and remotely respond to car owners' needs, for example, opening the barrier gate. In view of enormous 5G opportunities, a slew of IT device suppliers are foraying into the 5G white-box telecom equipment market, attempting to grab business from traditional telecom operators. According to CJ Chen, product R&D, director, FSP, 5G network equipment is developing toward open source and standardization while telecom equipment is developing in a way more like IT devices. Apart from traditional telecom equipment providers such as Nokia, a lot of network communication device manufacturers are introducing 5G-compliant white-box equipment developed based on open-source solutions and network function virtualization (NFV) concepts. However, in the intense 5G equipment competition, vendors must speed up time-to-market or else they will fail to capture the rare opportunity.TC Chu, senior manager, product and marketing, FSP, noted that 5G equipment must be able to process a large amount of data within a short period of time and thus imposes rigorous requirements on power supplies. FSP provides a full spectrum of power supply products for 5G equipment. Aside from offering network equipment manufacturers standard power supplies that are compliant with safety regulations, FSP also provides a certain level of customization under the premise of not affecting regulatory compliance certifications. This allows network equipment manufacturers to focus efforts on its own product R&D and accelerate time-to-market to grab preemptive 5G opportunities while reducing subsequent maintenance costs for their equipment.FSP spokesman Wen-Chun Yao commented that FSP's technological strength gives the company an edge over the competition and allow FSP to quickly put together a power supply solution suited to customer needs. FSP is also capable of accommodating manufacturers' needs for customization, shortening the time it takes for them to penetrate into new market segments."For example, a well-known network equipment manufacturer approached FSP for joint development of an outdoor router power supply. Not only must the product comply with AT&T / NEBS safety regulations and be lightning and fire proof but it also has to operate in the temperature range between -40 degrees and 65 degrees C," said Chen. "After understanding the customer's requirements, the FSP team quickly made slight customization to the existing 450W Slim Redundant power supply and provided an ideal solution that's exactly what the customer needs without affecting safety certifications." By enabling minor customization to its standardized products, FSP increases efficiency and reduces costs while demonstrating its robust R&D capability, allowing FSP to perfectly address market needs.To keep up with rapid IoT and smart service advances, for the past two years, edge computing is growingly adopted as an ideal solution to promptly responding to end devices. For example, AI-capable edge servers in a smart factory can detect product defects on the spot. As 5G services become widely available, FSP thinks data centers will develop into large-scale or even super-scale data centers that support cloud computing and small-scale data centers that support edge computing.Large-scale or super-scale data centers need power supplies that are scalable, centralized and automated, not only for the benefit of maintenance cost reduction but also for administrators to easily stay on top of equipment conditions through remote monitoring. Power supplies for small-scale data centers will trend toward miniaturization and smartization while featuring energy efficiency, resistance against harsh conditions, high power density, wide operating temperature range and lightning protection. According to Chen, targeting applications in wide-ranging operating conditions, FSP offers hundreds of standardized products which are all certified for compliance with multiple safety regulations. For a diversity of 5G equipment, FSP has prepared corresponding power supply solutions featuring water and dust resistance as well as modular design. Coupled with minor customization to FSP's complete range of products, FSP is able to satisfy every need of the industry.In consideration of the diverse requirements of 5G equipment, FSP will also engage in strategic alliances with upstream, midstream and downstream partners to jointly provide total 5G solutions and thereby tap into the massive 5G market.FSP engages in strategic partnerships to jointly provide total 5G solutions

ADLINK Technology, a global leader in edge computing, announced that the MECS-6110 edge server has been verified as an Intel Select Solution for Universal Customer Premises Equipment (uCPE) on CentOS, for deployment of a wide range of edge-based communication, networking and hosted services.For service providers, general purpose multi-access edge computing (MEC) edge servers are the platform of choice when deploying virtual network functions, such as SD-WAN. MEC systems process data at the network edge rather than a centralized data center, cutting latency, shortening response times and helping remove range and compute limitations.Paired with virtualization technologies such as network function virtualization (NFV), MEC edge servers such as the MECS-6110 eliminate the need for providers to employ multiple proprietary communication platforms to deliver network services, enabling those functions to be delivered by software. MEC systems can also reduce capital expenditure (CapEx) spending, as they operate on white-box, general-purpose processing platforms, and offer lower operating expense (OpEx) via cloud-based automation and management features."ADLINK has launched its MEC Server MECS-6110 edge server based on the Intel Select Solutions for uCPE reference design, offering network and communication service providers a verified networking platform for network function virtualization," said Julian Ye, director of networking and communications at ADLINK. "ADLINK's verified, open-standards-based MECS-6110 platform enables our customers to speed time-to-market by allowing them to focus their development efforts on unique next-generation applications for the edge of cloud and mobile networks. They also benefit from the work we have done with Intel to integrate the latest technologies into our edge server."Intel Select Solutions are pre-defined, workload-optimized solutions designed to minimize the challenges of infrastructure evaluation and deployment by providing a defined configuration foundation that delivers optimized, predictable results. These reference designs are validated by original design manufacturers (OEMs), certified by independent software vendors (ISVs) and verified by Intel. The MECS-6110 combines a powerful Intel Xeon D processor, an optimized software stack, and a high-performance white-box edge server designed for virtualized networking and other communication applications.MEC edge server systems sit on the extremities of a network, and must be able to operate in unfriendly, often challenging, deployment environments. The MECS-6110 is designed and built to withstand dust, shock, and vibration while also supporting an operating temperature range from -5 degree C to +55 degree C. The MECS-6110 has a 420mm system depth in a small footprint 1U chassis, with all I/O front access and dual FHFL PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA, and QAT adapters.For more information about ADLINK's MECS-6110, visit the product page here. For more information about Intel Select Solutions for uCPE, visit the solutions webpage here.ADLINK MECS-6110 edge server verified as an Intel select solution for uCPE

Sensirion a leading microsensor manufacturer and United Microelectronics Corporation (UMC), a leading global semiconductor foundry, has announced that the two companies have collaborated to produce medical related ICs used for the battle against the COVID-19 pandemic.UMC has allocated capacity for the production of Sensirion's temperature sensor ICs for COVID -19 vaccine transport and flow-sensors for medical ventilators, despite global tightness in foundry semiconductor manufacturing capacity.In the post-pandemic era, the most critical resource is vaccines. However, in addition to adequate supply and different virus variants, a concern facing the global distribution of vaccines is the monitoring of the ambient temperature during the vaccine delivery process. UMC has prioritized Sensirion's products to help ensure that the effectiveness of Covid-19 vaccines is preserved during transport and also to address the high volume need for medical-grade ventilators during the pandemic.Marc von Waldkirch, CEO of Sensirion said, "With its medically certified sensor solutions, Sensirion is an important hub for all manufacturers who need sensor technology to combat the Covid-19 pandemic. To maintain supply, it is essential that a manufacturer has the backing of upstream suppliers when it comes to raw materials such as semiconductor wafers. We would like to thank UMC for their incredible support to fight the pandemic together and are very happy about the excellent cooperation between our two companies.""UMC is a world-class international company with a deep commitment to social responsibility," said Steven Liu, vice president of Europe and Japan sales at UMC. "As a member of the global community, since early 2020 UMC has actively prioritized the production of medical related ICs in the fight against Covid-19. Being a critical part of the healthcare-related IC supply chain, we will continue to dedicate resources within this area in order to maintain consistent delivery of essential medical products. We are pleased to team up with our valuable partner Sensirion to collectively confront this pandemic."Flow-sensors for medical ventilatorsTemperature sensors for Covid-19 vaccine transport

ADLINK Technology, a global leader in edge computing, announced its edge server, MECS-7210, is officially validated as an "NGC-Ready" computing platform. In a configuration with two Nvidia Tesla V100 Tensor Core GPUs, MECS-7210 has been tested for functionality and performance of easy to deploy AI frameworks for machine learning and deep learning."NCG-Ready validation of the MECS-7210 helps our customers across industries accelerate their AI-enabled application deployments at the edge," says Julian Ye, ADLINK's director of networking and communications. "In the case of telecom for instance, customers can bring AI to advance an array of applications - from 5G Open RAN to edge datacenters, private networks, and MEC - they will benefit from continuously refined AI frameworks from Nvidia to address new opportunities and challenges with optimal performance, maximum system utility and a great ROI."The NGC-Ready validation process included extensive testing on the MECS-7210 for a wide range of applications for on-premise, cloud and edge deployments. ADLINK's validated MECS-7210 can help customers leverage the extensive range of GPU-accelerated software available for real-time intelligent decision making. Customers can easily migrate workflow compute environments including both hybrid and multi-cloud implementations, run software on bare metal servers or on virtualized environments, and maximize utilization of GPUs and portability. The validation also gives customers direct access to enterprise-grade support from Nvidia where they can leverage continuously optimized frameworks with the latest featuresADLINK's validated MECS-7210 can also help speed time-to-market of AI-based applications and services across many industries including telecommunications, smart cities, retail, manufacturing, autonomous vehicles, virtual reality and healthcare.Nvidia NGC-Ready-for-Edge servers

The whole world is watching closely 5G network development, expecting it to fuel future economic growth and drive advances in big data analytics and information economy. With 5G services kicking off in major cities, governments around the world are stepping up network infrastructure roll-out. Even in Taiwan, where 5G spectrum auction is lagging behind, multiple telecom operators have been offering 5G services in parts of the country starting second-quarter 2020.According to Chenbro, as a key player in the global mechatronics industry, 5G communication featuring high bandwidth, low latency and massive connectivity will give a boost to the performance of IoV (Internet of Vehicles) and a slew of other smart services while spurring a wave of data center build-up by cloud service operators.Eric Hui, vice president of global sales at Chenbro, commented that smart services that have been on the market for some time fail to deliver the benefits consumers expect as they are hindered by 4G transmission speeds. This is why the market has yet to see explosive demand for smart services.5G communication may be the answer. For instance, after 5G mobile services become available, China is seeing flourishing developments of Internet services, such as new generations of telematics systems and geographic information systems aimed to facilitate driving experiences.The increase in connected end devices will definitely put pressure on data centers that support the operation of smart services. In response, cloud service operators will purchase servers, AI servers, storage, switches and other infrastructure equipment to build next-generation data centers and support AI-based analytics and edge computing needs. To accommodate wide-ranging industry requirements, Chenbro is working with multiple customers on development projects and will be launching new products throughout 2021. The aim is to maintain its competitive edge as it ushers in the 5G era.Most consumers today have grown used to communicating via instant messaging apps such as Line and Facebook with their increasing popularity. This has led to a plunge in traditional phone usage, leaving most telecom operators worldwide unable to recoup their 4G investments. Nonetheless, 5G is poised to become the standard in the future. Telecom operators have no choice but to keep bidding for 5G spectrums and frequency bands to avoid being driven out by the competition.In the process of building 5G infrastructure, telecom operators face the challenges of having to renew their outdated server room equipment as well as deploy miniature base stations that cover small geographical areas. This is when Chenbro comes into play. Capable of providing original equipment manufacturing (OEM), original design manufacturing (ODM) and joint design manufacturing (JDM) services, Chenbro is the top-choice partner that many telecom operators go to.Hui noted, "In Europe, a great number of telecom operators struggle with the challenges in updating their data centers that have been in use for many years while doing so within limited office building space. Chenbro has a wealth of design experience and technological strength. With comprehensive design, sales and technical support teams stationed across Taiwan, the US and Europe, Chenbro is able to precisely grasp customer needs and deliver tailor-made services. A wide range of development projects that are suited to different telecom operators' needs are ongoing to help renew their equipment in their existing space."Furthermore, different from 3G and 4G networks, 5G supports Open Virtualized Radio Access Network (Open vRAN), which allows telecom operators to use white-box telecommunication servers to build 5G infrastructure. In view of this, Chenbro is collaborating with network communication equipment suppliers to develop white-box equipment and help telecom operators capture 5G opportunities.As IoT technologies mature and their costs become reasonable, many governments are making full efforts toward smart transportation projects to address the issue of overcrowding resulting from urbanization. They look to make use of IoV advances to address traffic congestions and improve road safety for both pedestrians and motorists. 5G communication featuring high bandwidth, low latency and massive connectivity can effectively connect network-capable vehicles and traffic signs, allowing traffic authorities to monitor traffic flows via cloud-based platforms and thereby reduce the occurrence of accidents.3GPP, in charge of developing mobile telecommunication protocols, announced 5G Release 16 on July 3, 2020 and plans to establish more complete standards targeting different industries including autonomous driving that is growingly mature. This is expected to expand the application scope of IoV. According to TrendForce, the number of connected cars sold in the new car market is projected to reach about 74 million units in 2025, an 80% penetration rate. The enormous market opportunities should not be taken lightly."As opposed to our earlier products designed for indoor use with no need to consider exposure to wind, sunlight and rain, IoV equipment operates outdoors so the casing must be corrosion proof. This is a challenge to the design team's ability in material selection and usage. We are confident with our ability to address such a challenge and work with partners to come up with solutions in line with market expectation," said Hui.Product demo center at Chenbro headquarters

5G achieves a 20Gbps downlink peak data rate (20 times faster than 4G), a latency as low as 1ms (one tenth of 4G) and a connection density of one million devices per square kilometer (10 times that of 4G) with enhanced mobile broadband (eMBB), ultra-reliable and low latency communications (URLLC) and massive machine type communications (mMTC). On top of that, it supports network slicing, which allows different levels of services to be provided based on user requirements. These advantages make 5G an enabler of cloud computing, IoT, big data analytics, AI, IoV/autonomous driving, AR/VR and a diversity of other innovative technologies or applications.Changes in the radio access network (RAN) are a major item among what make the 4G to 5G transition different from the 3G to 4G transition, which only brought faster data transfer speeds. 5G communication has refined and separated multiple network functions to enable a more flexible network structure so that different levels of services or functions can be provided and network virtualization and slicing can be effectively implemented. Moreover, a baseband unit (BBU) is split into a centralized unit (CU) and a distributed unit (DU), which drives the miniaturization of base stations and allows the use of white-box equipment, helping telecom operators reduce capital expenditure.Multi-access edge computing (MEC) will play an instrumental role maximizing all the above-mentioned 5G benefits. In view of this, ADLINK, with long-standing leadership in edge computing, industrial PC, data acquisition (DAQ), machine vision and motion control technologies and long-term devotion into vertical OT solutions including smart factory equipment, is actively developing MEC platforms while engaging in partnerships with AI, autonomous mobile robots (AMR), autonomous driving, automated optical inspection (AOI) and smart healthcare solution providers to jointly form a complete 5G ecosystem and expedite advances of 5G-enabled smart applications across vertical industries.Qianqian Shao, product marketing manager of ADLINK's networking, communication and public business unit, emphasized that MEC is a critical element of 5G communication. It ensures that latency-sensitive applications such as industrial robots and self-driving vehicles can operate efficiently by performing instant data processing and analysis close to the source to allow decision-making in real time. It is no longer required to upload data to the cloud platform or data center so as to prevent risks resulting from data transmission latency and largely save network bandwidth.Joining forces with 5G ecosystem partners to accelerate private network applications in diverse use scenariosFeaturing small footprint and wide operating temperature range, ADLINK's MEC platform is capable of supporting core computing needs within the 5G network architecture while enabling GPU and FPGA hardware acceleration. It also implements the IEEE 1588 Precision Time Protocol to support high-efficiency AI inferencing and clock synchronization throughout IP networks. System integrators can build applications/services to address all kinds of critical tasks on top of ADLINK's MEC platform.Shao added that ADLINK collaborates with ecosystem partners targeting a variety of application fields by providing hardware equipment and middleware. They have jointly built multiple application-ready platforms to help enterprises bring their private network applications to reality. For example, the Robot Operating System (ROS) running on optimized MEC platforms coupled with edge AI inference and low latency 5G communication accelerates AMR development and deployment and even achieves swarm autonomy. The AMR can carry out smart logistics tasks in factories, warehouses, hospitals, retail stores, restaurants and a slew of other application scenarios.Furthermore, leveraging its strength in edge computing and AI accelerators, ADLINK engages in close collaborations with multiple autonomous driving solution providers including autonomous driving software developer Tier IV and intelligent vehicle platform AutoCore to make use of 5G communication's low latency and massive connectivity features to develop high-performance and high-reliability autonomous driving applications.Making use of 5G communication's high-bandwidth, low latency and massive connectivity features, ADLINK's MEC edge computing platform will also expedite the advent of fully automated and unmanned factories as it helps connect diverse processes and workstations in the factory including AI-enabled AOI, AI-based process monitoring (operator behavior detection and analysis as well as object recognition), production equipment monitoring and diagnostics as well as material transportation by AMR.Apart from being used on 5G private networks, ADLINK's MEC platform can also be connected to public networks as MEC is needed on both types of networks but only with differences in how the platform is set up. For private networks, ADLINK's MEC platform serves as a DU to support communication access while acting as an application-ready platform. ADLINK and partners have worked together to help customers quickly build applications for specific use scenarios. For example, multiple smart factory proof-of-concept (PoC) projects in collaboration with several solution providers have been completed. For public networks, ADLINK's MEC platform also functions as a high-performance DU and provide edge computing capability. More than that, it fully supports data acquisition, transmission and processing under the premise that information security is guaranteed. ADLINK's MEC platform will accelerate the development of smart applications, bringing the futuristic scenes in sci-fi films to real life.More information on ADLINK's MEC platform: https://www.adlinktech.com/en/Edge_ServerQianqian Shao, product marketing manager of ADLINK's networking, communication and public business unit

Production lines running around the clock and operators working hard all the time is what the general public thinks of the manufacturing industry. Different from the general impression, a thermal solution provider based in Taoyuan lets employees take time off to donate blood, volunteer for charity work, buy books, recharge their motivation, run a marathon and all sorts of outdoor or other types of activities that promote their physical and mental wellbeing. This firm making others green with envy is T-Global, which has received Benefit Corporation certification four years in a row.Since its establishment in 2003, T-Global has been attaching importance to employee benefits, corporate social responsibility and sustainable operation while accumulating technological strengthen and sales experience. It has become a thermal engineering expert specializing in heat dissipation, conduction and resolution and serving more than 4,000 customers worldwide that think highly of its refined and complete range of thermal products and services. T-Global led the industry in developing thermal interface materials with thermal conductivity exceeding 17 W/m.K, which, combined with niche products with differentiating features such as ultra-thin vapor chamber (< 0.3mm) and thermal putty, are catching attention in the 5G and electric car markets.Fostering a team of thermal engineers to provide heat dissipation consultation servicesStarting out as a thermal interface material supplier, T-Global then expands its product R&D into vapor chambers, heat pipes and heat sinks in view of technological advances driving increasing heat dissipation needs that can no longer be satisfied by thermal interface materials alone. It therefore combines different products into heat dissipation modules to help customer quickly resolve thermal problems.T-Global specializes in combining thermal interface materials, vapor chambers, heat pipes and heat sinks to build thermal modules perfectly matching every customer needAccording to T-Global chief marketing officer Gang-yuan Fan, aside from exerting efforts to expand its product portfolio, T-Global has also invested in thermal simulation software and built up a thermal engineering taskforce. This enables T-Global to guide customers on an assessment of the thermal conditions when and where their products will be in operation through thermal simulation and analysis as well as the T-Global thermal engineering team's consultation services early in the product development cycle. This saves customers from wasting time and effort and helps them quickly find the ideal solution, then proceed to pilot run and volume production and accelerate time-to-market.Today T-Global has become one of the very few suppliers of total products and services to the global thermal solution industry. With an established market presence, it has many success stories spanning across different sectors, which have drawn new customers to seek T-Global's consultation services to help address their challenges with a suitable product combo they can use. T-Global engineers will take into consideration the customer's product size, operating environment, objective thermal conductivity, withstand voltage and resilience. Then, they will conduct thermal simulation and analysis to find the best solution to the heat dissipation bottleneck and build a thermal module perfectly matching customer needs by combining thermal interface materials, vapor chambers, heat pipes and heat sinks.It's noteworthy that T-Global has made a lot of efforts to lay a solid foundation on which it can build up strong research and manufacturing energy. For years, it has engaged in industry-academia collaborations with Industrial Technology Research Institute, National Taiwan University, National Tsing Hua University and National Taiwan University of Science and Technology to keep refining its thermal technologies while undertaking forward-looking product planning and preemptive R&D work. In the meantime, T-Global initiated a project to build a new central factory in 2017. After going through a reiterative planning and discussion process and investing hundreds of millions of dollars, T-Global completed and opened the new factory building having eight floors above the ground level and a basement in 2019."The new central factory incorporates state-of-the-art process technologies and equipment, which will help enhance T-Global's large-scale manufacturing capabilities," noted Fan. More than that, the new central factory also has many laboratory grade test devices or instruments, which, coupled with thermal simulation software, can help R&D engineers validate prototypes and allow customers to conveniently and quickly verify product reliability without having to spend extra time and money acquiring services from third-party laboratories.Large-scale production and in-house testing capabilities have enabled T-Global to shorten its lead time to 18 - 22 days, a significant improvement over the 30-day lead time commonly seen in the industry.Furthermore, T-Global has obtained ISO9001 Quality Management System, ISO14001 Environmental Management Systems, IECQ QC080000 Hazardous Substances Process Management and IATF 16949 Automotive Quality Management System certifications. Its products also comply with UL, RoHS and REACH regulations so users can rest assured of T-Global products' quality and reliability.T-Global getting ready to usher in major growth opportunities with forward-looking R&D planning generating resultsAs a matter of fact, T-Global foresaw rising 5G and electric car opportunities many years ago and the upcoming immense needs to address thermal issues so it undertook early R&D planning and has prepared corresponding solutions targeting the two areas that are at the center of market attention today.Based on its R&D strength accumulated through years of efforts, T-Global has developed a diversity of ultra-soft thermal pads supporting wide-ranging thermal conductivity to address different application scenariosToday's 5G market presents raging waves of opportunities with base stations being rolled out worldwide and purchases of cloud servers and network communication equipment on the rise. T-Global has maintained long-term close partnerships with server and network communication equipment manufacturers. They had been using T-Global's mid-range and high-end products to address thermal issues in the 4G era. Heat dissipation in 5G equipment becomes ever more challenging and can no longer be satisfied by mid-range and high-end products used in the 4G era. In response, T-Global has developed ultra-thin vapor chambers and thermal interface materials with thermal conductivity exceeding 17 W/m.K (6~10 W/m.K was sufficient for 4G equipment) to enhance heat dissipation efficiency and effectively prevent thermal shutdown of 5G equipment.Electric cars require rigorous thermal solutions for their battery packs, electronic control systems, in-vehicle infotainment and charging stations. T-Global has stepped up efforts to develop products to address individual requirements by the different elements of electric car systems. It first endeavors to satisfy 70% to 80% of the thermal requirements and then deals with the remaining part through customization to suit specific cases.Everyone knows the battery module is the heart of the electric car, said Fan. Heat is generated during the charging and discharging process so proper thermal engineering is critical to battery life and charging/discharging efficiency. T-Global is capable of tailoring the most suitable thermal solution for every battery module based on its size. For example, for a battery brand with a leading share of the electric car market, T-Global applied thermal putty to fill the gaps between the main control board and battery cells and then spread thermal pads on top of the battery cells to create excellent heat conduction efficiency that transfers waste heat from the battery cells to the battery module casing for heat exchange.Thermal issues in electronic devices will become increasingly challenging going forward. They can hardly be addressed with a single heat dissipation product but require a combination of products and services. This presents favorable circumstances to T-Global, which offers thermal simulation services and a complete product mix while specializing in building customized modules.T-Global takes pride in being a thermal engineering partner committed to delivering a complete and comprehensive range of thermal products and services to help customers tackle all thermal issues

The COVID-19 pandemic has severely impacted the global economy. However, thanks to their unique market position and manufacturing capabilities, the Taiwan and China-based cross-strait PCB makers achieved good results in 2020. Increasing demands for 5G infrastructure, cloud data centers and high-performance computing led to stronger growth momentum. These market forces are creating an increase in demand and interest in printed circuit boards (PCB), in particular high-end multi-layer boards (MLB), high density interconnect (HDI) PCBs and flexible PCBs (FPCB).We met up with Pierce Weng, General Manager of Orbotech PCB Taiwan, to talk about the company's new process-enabling solutions for FPCB manufacturing. For 40 years, Orbotech, a KLA company, has been developing advanced yield enhancement solutions for the manufacturing of electronics. Through its long-time partnership with Taiwanese and Chinese PCB makers, Orbotech has enabled the electronics manufacturing service industry to maintain its leading global position.Orbotech Infinitum and Orbotech Apeiron series provide a big boost for FPCB manufacturingFlex circuits are widely used in almost all popular electronic products, especially smartphones, tablets and notebooks. 2020 was a bumper year for flex manufacturing and FPCB makers had to respond quickly in order to meet the strong demand. To help its customers achieve their business objectives, Orbotech has announced two new roll-to-roll (R2R) products for FPCB manufacturing. The solutions are for roll-to-roll direct imaging (DI) and UV laser drilling. Both overcome many of the yield, throughput and quality challenges inherent in flex material manufacturing. Leveraging newly developed and field-proven technologies, the solutions facilitate high quality, cost-effective mass production of the ultra-thin FPCB boards that are critical in new generations of advanced electronics.The first solution is the Orbotech Infinitum series - a roll-to-roll direct imaging solution for mass production of FPCBs. Leveraging Orbotech's new DDI Technology (Drum Direct Imaging ) for optimal material handling and high-speed imaging, the systems deliver high yield and production throughput. The Orbotech Infinitum delivers fine line structure and uniformity enabled by continuous exposure and high depth-of-focus (DoF) with Orbotech's LSO Technology (Large Scan Optics Technology). The systems are compatible with a wide range of resists and processes enabled by simultaneous multi-wave exposure thanks to Orbotech's MultiWave Technology. The two models named Orbotech Infinitum 10 and Orbotech Infinitum 10XT both offer maximum efficiency and cleanliness with options for roll widths of 260mm and up to 520mm.The next solution is the Orbotech Apeiron series. A powerful UV laser drilling system for flex roll-to-roll and sheet-by-sheet drilling, it delivers high drilling throughput, quality and accuracy. Using Multi-Path Technology, its precise laser beam and four large scan area drilling heads can drill in four locations simultaneously, optimizing laser power usage. Its small footprint design leverages its internal roll-to-roll mechanism, enabled by the new Roll-Inside Technology. The third technology driving this innovative solution is Orbotech's CBU Technology (Continuous Beam Uniformity) that provides built-in beam validation tools to ensure beam accuracy and quality for size, roundness and energy distribution. Orbotech Apeiron offers both roll-to-roll and sheet-by-sheet handling of thin flex cores with the ability to simultaneously drill two panel sheets, side by side for maximum drilling capacity.Based on its experience and expertise as well as its close partnerships with PCB makers, Orbotech has developed a wide range of solutions designed specifically to meet the demanding requirements of FPCB and advanced HDI PCBs. Orbotech offers an entire suite of solutions for mass production including DI (Direct Imaging), AOI (Automated Optical Inspection) and AOS (Automated Optical Shaping) - the 3D shaping of opens, shorts and nicks. Orbotech's product offering is in great demand from PCB makers. With its announcement of the Orbotech Infinitum and Orbotech Apeiron series, Orbotech continues to maintain its market leadership as it optimizes the handling of the most delicate flex materials during direct imaging and UV laser drilling processes.Taiwan PCB makers see optimistic outlook in 2021With the year finally coming to an end, Mr. Weng reviewed the business development of 2020 in PCB sectors. 5G smartphones did not meet their forecasts during the early months of 2020, mainly because the global brands' flagship models were postponed. But mid-end and entry level lower price phones took a major step up in volumes and maintained an overall upward trend for the mobile phone market. Meanwhile, some leading investments for 6G technology have been initiated. This will contribute to higher-end process equipment and manufacturing solutions and increase demand for Orbotech's wide range of innovative solutions and product offerings.In addition to mobile phone PCB sectors, HDI boards were one of the fastest growing technologies during 2020. With the widespread adoption of 5G base stations worldwide and major Taiwan PCB makers enjoying robust orders for notebooks, tablets and PC servers, HDI PCB makers are showing strong growth. Successful manufacturing of HDI and multi-layer PCBs have thinner lines, tighter spacing, tighter annular rings and use thinner specialty materials. First tier PCB makers are working in close collaboration with Orbotech's engineering teams developing special equipment including laser drills, laser direct imaging and sequential lamination process solutions. In order to successfully produce this type of board, it requires additional time and a significant CAPEX investment in manufacturing processes and equipment.Pierce Weng, GM of Orbotech PCB Taiwan, gives upbeat sales forecast on high-end PCB process enabling solutions

Fibocom, a leading provider of cellular embedded wireless module solutions for the Internet of Things, is proud to announce that its 5G module FG360 based on MediaTek T750 chipset platform has completed the world's first 5G data call and end-to-end data transmission services under 5G SA network.FG360 is a 5G module with high integration, high data rate and great cost performance. Through a high degree of integration, the FG360 5G module enables customers to design their products with the best performance and the most optimal cost in the application scenarios such as home, enterprises, venues, etc.First, power on FG360 and connect it to the computer. After the module is turned on normally, three debugging ports can be enumerated in the device manager interface of windows, and the network operator information can be viewed through the AT command "AT+COPS?".1. FG360 supports auto-dialing after power-on: After the module is powered on and running, it will automatically activate the PDN dial-up Internet access without manual operation.2. FG360 provides a dual-band wireless connection: The Wi-Fi function can be turned on through a mobile phone or a computer, and the hotspots FG360_5G_NA and FG360_24G_NA can be searched, without mutual interference, dual-band concurrent.3. Connect to Wi-Fi hotspot: FG360_5G_NA via mobile phone or computer, and you can go online directly. In addition, you can enter the WebUI configuration interface by visiting 192.168.1.1, and perform normal Wi-Fi, routing, call and other function settings. Enter the overview interface to see the devices connected to the hotspot.In addition to wireless connection, it can also be connected through the Ethernet interface. When the interface is working normally, the indicator flashes, and the computer will recognize the network, you can access the external network, or you can access 192.168.1.1 to enter the WebUI configuration interface.Fibocom FG360 will be available in two versions, FG360-EAU will be launched for EMEA/APAC markets, and FG360-NA will be launched for the North American market, mainly for smart terminals such as fixed wireless access (FWA), CPE, gateways, routers, industrial monitoring terminals, and telemedicine terminals. The FG360 5G module plans to achieve mass production in Q3 2021.See more about Fibocom 5G Lab (Shenzhen) under 5G SA network environment.Fibocom FG360Fibocom FG360Fibocom FG360