MSI, a world leading brand for gaming and creation, holds an online new product launch today. Apart from the constant insistence on ultimate performance for all products, MSI also takes "TECH MEETS AESTHETIC" as belief. From the era of the Renaissance, the Scientific Revolution, and the Enlightenment, the great evolutions are all built upon craftsmanship of humanistic aesthetics and science. MSI combines rounded and fluid form with sleek edges, merging postmodernism design with modern technology, and aims to inspire users across all fields."Although the COVID-19 pandemic changes our working lives and daily lifestyles, MSI never stops developing and designing new products. In addition to proud performance, our products are also integrated with 'Golden Ratio' aesthetic. MSI combines rounded and fluid form with sleek edges, merging both postmodernism design with modern technology to meet different user's demands of pursuing perfect details in various fields," said Sam Chern, MSI Vice President of Marketing.Creator & Gaming Series Laptops with the latest 11th gen Intel CPUMSI, a leading gaming brand, has introduced a new lineup of creator and gaming laptops offering a 30% performance upgrade over previous models. The latest MSI gaming laptops are powered by the latest 11th Gen Intel H series processors and up to NVIDIA GeForce RTX 3080 LAPTOP GPUs. MSI has greatly advanced in creators' field in recent years, and perked up to materialize the concept "Tech Meets Aesthetic" this year. The new Creator series laptops continue MSI's artistic vision of producing stable and powerful working machines with aesthetic touches that enhance user experience and unleash the inner gamer and creator spirits.Tech Meets Aesthetic: Creator Series LaptopsThe new Creator Z16 boasts a 16:10 display with thin bezels inspired by the Golden Ratio for wider viewing angles and better productivity. Creator Z16 designs with a slim CNC-milled aluminum chassis in Lunar Grey adds to the delicate style with the latest 11th gen Intel Processor and up to NVIDIA GeForce RTX 3060 LAPTOP GPUs. True Pixel display up to QHD+ resolution with 100% DCI-P3 color gamut supports the needs of designers and content creators alike. In addition, Creator M16 and Creator 17 come with 16:10 QHD+ display and 4K Mini LED displays respectively.The latest 11th gen Intel Gaming Series LaptopsMSI premium gaming laptops-GE76/66 Raider, GS76/66 Stealth, and GP76/66 Leopard series come along with the high-speed combo of PCIe Gen4, Thunderbolt 4, and Wi-Fi 6E enhance data transfer speed and wireless experience. MSI-exclusive feature of "Discrete Graphics Mode" further elevates graphics performance and overclock option with adjustable GPU core clock and VRAM frequency via MSI Center. Displays options up to 360Hz or QHD 240Hz to break high-resolution game fps ceiling ever. Moreover, GE76 and GE66 Raider series retain the sci-fi mystic light bar, but benefit from NVIDIA GeForce RTX 3080 graphics with full TGP up to 165W for extreme gaming performance. Pulse GL76/66, Katana GF76/66, Sword 17/15 series are compact and discreet design, and aim to extra powerful hardware at entry gaming laptop range. Powered up to NVIDIA GeForce RTX™ 3060 graphics and along with a redesigned 6 heat pipes and integrated MSI exclusive thermal grease, which generates more airflow to ensure smooth gaming experience.Comprehensive Solutions for Your Gaming ExperienceMSI had achieved the milestone of selling 3 million monitors worldwide, but MSI doesn't just stop there. This year, MSI launched the Optix MEG381CQR Plus, which won the 2020 CES award. This monitor is equipped with 2300R IPS curved panel and MSI monitors' exclusive Steelseries GameSense function. The Optix MEG381CQR Plus is also MSI's first G-Sync Ultimate Monitor. Through optimization of the chip and the tuning of the hardware, G-Sync Ultimate function provides players with a perfect screen display with tearing. The HMI operation interface, which is first developed by MSI, helps users choose settings more conveniently and intuitively with the cooperation of the Gaming Dial and a second monitor. Users can simply rotate the button at the lower left to switch between modes. Additionally, MSI will launch its new flat gaming monitor series, including the Optix MPG341QR, the Optix MPG321UR-QD, and the Optix MPG321QRF-QD. Besides Gaming Intelligence and Sound Tune, these new flat gaming monitors have new functions as well. The Optix MPG321UR-QD has the latest HDMI 2.1 transmission interface which supports a 4K 144Hz screen display. These outstanding features are the reason why MSI's monitors are the best choice for gamers. As for the gaming desktop, MSI presents the MAG Infinite S3. It has a front panel that features an asymmetrical design with MSI mystic light. To dissipate heat effectively, there are huge air vents on the front panel, and the thermal design promises sufficient airflow that ensures long-term operational performance and stability. Moreover, the MAG Infinite S3 has the latest components inside. It runs 11th Gen Intel Core Processors and NVIDIA GeForce RTX 30 Series graphics cards, and it supports NVIDIA Resizable BAR technology, which provides a 10% performance improvement in games, allowing you to play games smoothly.Customize Your Maverick PCThis year, MSI breaks new ground with product customization. The MPG GAMING MAVERIK, the latest bundle kit, is a premium experience offered for MSI fans. It consists of Core i7-11700K CPU, the MPG CORELIQUID K360 SP, the MPG Z590 GAMING EDGE WIFI SP, the MPG VELOX 100P AIRFLOW SP, and Trident Z Maverik memory. The lighting effects are perfectly synchronized with exclusive patterns. The MPG GAMING MAVERIK also boosts all cores' frequency from 3.6GHz to 4.8GHz, which helps you enjoy games intently. In terms of motherboards, MSI had launched X570 Series motherboards in 2019, and this year, the new X570S MAX Series motherboards will come out. Receiving brand-new designs as well as upgraded features, the new X570S MAX motherboards offer a fanless cooling solution to provide gamers silence. With a new motherboard, you may consider picking up a new case as well. The MPG QUIETUDE 100S is a silent gaming PC case. It is the first of MSI products that features MSI's exclusive MEG SILENT GALE P12 fan. The fan blades are capable of providing enough airflow while maintaining low noise levels, and you can click the fan speed control button on its IO port, which helps the user adjust the fan speed to three stages of RPM easily.Be Your Window to the WorldBesides gaming products, MSI also devotes itself to commercial and creative products in recent years. The Creator P50 is the perfect desktop for creators, which won an award for the CES 2021 Innovation Awards. Its sleek and slim dimensions are suitable for rooms and studios, and the refined design can be a part of the room's decorations. Now, it comes in a new white color as an option for creators. If you care about eyecare and color accuracy, the Summit MS321UP may be your first choice. This monitor can ergonomically be adjusted to your most comfortable viewing position, and it has the most accurate color display and a smart sensor as well. Along with 4K resolution, the Summit MS321UP offers users an absolutely clear and great display. To meet business needs, it is supported by the MSI Productivity Intelligence App, which introduces the KVM function. The KVM function lets you toggle between two computers with a keyboard and mouse to control your two devices through the Summit MS321UP. It will not only improve efficiency but also increase productivity.Change The GameTo celebrate years of continued high-performance circuit board development, MSI is announcing the SUPRIM 35th Anniversary Limited Edition graphics card. Engraved in the backplate is sketched outlines of past generations that have contributed to our company's experience and knowledge. This anniversary edition graphics card is built upon the SUPRIM series foundation and retains all the same key features. Optimized circuits power the NVIDIA GeForce RTX™ 30 Series GPU chip at the core, the efficient TRI FROZR 2S thermal design that keeps temperatures in check with minimal fan noise, and a modern aesthetic that reflects the high-performance lifestyle of its user.Low Latency Wireless EarbudsThe IMMERSE GH62 WIRELESS EARBUDS is our first set of wireless earbuds, developed with the same gamers' first DNA that made previous MSI headsets great. GH62 sets itself apart from other wireless earbuds by incorporating all the core features gamers want – accurate audio reproduction, clear voice recording, low-latency responsiveness, and low maintenance.Light Weight, Heavy HitterCLUTCH GM41 LIGHTWEIGHT WIRELESS is our first lightweight wireless mouse for FPS gamers who want a symmetrical ergonomic shape to play with speed. Built with the latest 2.4G radio technology, latency is reduced to just 1ms, resulting in responsiveness that's almost 10 times faster than a typical wireless mouse on the market. Designed for advanced FPS players, the GM41 LIGHTWEIGHT WIRELESS is equipped with soft and durable rubber that has a diamond texture to maintain a steady grip, while weighing only 74g.Charging Ahead with SpeedFinally, MSI's SPATIUM SSD lineup charges ahead with speed, ready to shorten loading times and rapidly move files. The fastest model, the M480, will have transfer speeds up to 7000 MB/s. The heatsink lowers peak load temperatures by up to 20 degrees Celsius and prevents SSD thermal throttling.MSI unveils new innovations at Computex 2021

Artificial Intelligence (AI) and Advanced Assisted Driving System (ADAS) are the two core elements of the Automated Vehicle (AV). A whole battery of sensors comprises the ADAS. These include short and long-range radar, LiDAR & precision cameras, which help to collect information outside the car at real time. With the help of the AI, the ADAS is then able to differentiate sensor data into crucial categories including pedestrians, obstacles, traffic signs, lane line, other vehicles, proximity, speed and direction relative to the AV, process this and quickly instruct the vehicle's actuators that control acceleration, braking, and steering."Since sensors play such a crucial role in enabling AVs, a critical component of delivering the most reliable AVs is to make sure that every sensor produced during manufacturing is free from defects," said Dr. James Song, Vice President and Product General Manager of ASM Pacific Technology (ASMPT). Optical-based sensors such as LiDAR and cameras are no exception. A tiny particle on a LiDAR or camera sensor surface could cause huge issues due to the signal not able to be received or transmitted, which could have huge implications for AV reliability and passenger or pedestrian safety.Dr. James Song emphasized safety is the primary concern in the automotive industry. With more complex camera assemblies, the need to ensure the best quality from the manufacturing process becomes the most critical. It has indicated that there is an increasing market demand for its Automated Optical Inspection (AOI) machines to replace conventional inspection methods that employ human operators. With its automated visual inspection of component manufacture using a camera that autonomously scans the device under test for both catastrophic failure and quality defects, AOI is overall much more reliable and repeatable than manual visual inspection.Recently, ASM Pacific Technology has lunched its brand new AOI model named "CamSpector," which has been designed specifically to meet automotive market needs, and to fulfill important requirements such as CE Mark. It is the first 3rd Optical AOI capable of detecting sub-micron particle as well as 2D + 3D wire bond defects for the CIS market. CamSpector equipped with HD optics, which enables a more robust vision performance to reduce over reject rates to less than 0.1%, and to keep under reject at 0%. The "secret sauce" behind these impressive capabilities are Artificial Intelligence capabilities that have been integrated into CamSpector's AOI vision system to leverage big data from both inspection and manufacturing & enterprise systems.With manufacturers increasingly seeking to modernize their factory lines with more automation and AI features in tandem with "Industry 4.0" trends, AOI inspection data can be shared to such "Smart Factory" systems to augment their data analysis. With real-time feedback systems a Smart Factory hallmark, AOI data could help to improve yield and reduce operational costs, or on a wider level even be used to monitor and provide feedback for upstream processes in the Smart Factory so as to proactive repair of faulty processes or improvement process capability.High quality camera senor is critical to the reliability of AV. Therefore, a production line of the sensor equipped with intelligent and high-precision inspection system is prerequisite for achieving the autonomous driving. "This is where CamSpector comes to play," said Dr. James Song. It is expected that more manufacturers will integrate AOI system in the production line of auto parts in order to improve product quality. These are among the various possibilities as the world becomes more enabled via an increasingly integrated approach blending intelligent software with precision manufacturing systems.Multiple sensorsSource: Yole 3D Imaging & Sensing 2020 ReportASMPT's AIoT

In the era of smart devices, the capabilities of traditional networking equipment are no longer sufficient as more diverse IT system functions become available. Therefore, virtualization has become a focal point when designing corporate IT systems. Apart from large-scale independent software vendors (ISV) and cloud service providers relying on virtualization, small-scale operators have also begun investing in this technology, generating demand for the market as a whole. AEWIN has navigated the networking field for many years, accumulating abundant technological expertise and experience. Recently, AEWIN has built the SCB-1937, a high-performance networking computing platform that supports the latest EPYC 7003 Milan CPU launched by the large processor manufacturer AMD. This platform can help enterprises swiftly introduce network function virtualization.Established in 2000, AEWIN focuses on R&D for network communications and information security technologies to provide customers with excellent solutions. Currently, AEWIN has three major product lines, including network equipment, servers, and network expansion cards. Network equipment includes network security appliances. As for servers, these include general-purpose servers and edge computing servers. In addition, network expansion cards cover a wide range of network interface cards (1G - 100G) and QAT (Intel QuickAssist Technology) accelerator cards with encryption technology. These products can meet all kinds of customer need. In addition to developing hardware products, AEWIN has also expanded its software R&D team. Through pre-validation and performance optimization, AEWIN has shorten the development time of ISV clients and increased customer satisfaction levels.The SCB-1937 computing platform launched by AEWIN can also meet the recent demand for Edge AI. The network's I/O ports and expansion interfaces are at the front of the platform, shortening the time for module installation and maintenance, facilitating the connection of network switches. The depth of the platform is 60 cm, allowing enterprises to install high-performance network equipment within limited spaces. The SCB-1937 platform uses two AMD EPYC 7003 Milan CPUs. This family of processors support the latest bus standard, PCIe Gen4, and up to 128 lanes of PCIe Gen4, which comprehensively increase transmission speed. Moreover, it has eight PCIe Gen4 x8 expansion slots that support networking modules, U.2 NVMe SSD modules or GPU/FPGA accelerators. Regarding networking configuration, the SCB-1937 can support up to eight network expansion modules, with flexible Ethernet port configurations, including 64x 1GbE, 64x 10GbE, 32x 25GbE, or 8x 100GbE ports.AEWIN also makes the most of the memory support of the EPYC 7003 Milan CPU. The platform supports a memory capacity of up to 4TB and eight channels DDR4 RDIMM (up to 3200Mhz), which significantly enhance the computing capabilities of virtualization. In terms of the I/O interface, the SCB-1937 has two management ports for BMC/IPMI management functions, a console port, two USB 3.0 ports, and a 5-key LCM module. In addition, the SCB-1937 supports two hot-swap 2.5" SATA HDD/SSD docks, one mSATA and two M.2 2280 slots.With regard to SCB-1937 applications, AEWIN pointed out that the platform allows ISV clients to create higher values with less equipment because of the SCB-1937's 128 computing cores, high-capacity RAM, high-speed bus PCIe Gen4, and more diverse network interface. In the past, enterprises had to purchase different kinds of IT equipment based on different types of services when responding to their expanding business scope. This approach not only leads to huge costs of IT deployment but also makes it difficult to fully leverage the performance delivered by hardware equipment. By incorporating all functions into a virtualized infrastructure, enterprises can simplify their deployment procedures and swiftly scale out relevant applications. Various virtual network functions can be deployed in a single host or many clusters and achieve the best performance simply by using a website interface to control the functions and deploy software. As a result, virtual frameworks have gradually become the IT mainstream among enterprises and government organizations. The SCB-1937 is the best platform specifically designed for a virtual framework.So far, this product has already achieved many successful applications. Take Edge AI application as an example, the platform is used to identify traffic flows and license plates of traffic offenders and can further connect traffic signals to alleviate traffic congestion by adjusting traffic lights. For the manufacturing sector, the platform can be used for facial recognition to manage access to certain areas. Compared with past embedded hardware, this application is an ideal choice in terms of installation costs or system flexibility.With an increasingly fierce market competition, IT network equipment is playing a more important role in corporate operations. As AMD's long-term partner, AEWIN cooperated with AMD to conduct testing since the development phase of the CPU. This is why AEWIN can offer the best solutions simultaneously while the product is being launched. The SCB-1937 is a multi-functional computing platform that leverages the high-performance and high-frequency features of the AMD EPYC 7003 Milan CPUs.AMD EPYC 7003 Milan CPUSCB-1937

Murata Manufacturing and Cooler Master have jointly developed a vapor chamber with thickness of only 200um for electronics devices.This is the first product developed by the joint partnership between Murata and Cooler Master, with both companies committed to continue strengthening their collaboration as they work to create more new products that solve heat-related problems affecting next-generation devices.Beginning with this new product, Murata and Cooler Master intend to build a partnership to meet new technical challenges and a wide range of product needs by utilizing expertise from both companies to develop heat dissipators for electronic devices.To strengthen cooperation between the companies on product development, Cooler Master plans to install development and testing facilities with the same conditions as Murata's facilities at Cooler Master headquarters scheduled for completion in the second half of 2021.This will allow the two firms to share new product concepts and ideas without delay and realize the development of a system that provides accurate performance evaluation, they said.As electronic devices achieve higher performance and more advanced functionality, the amount of heat generated per device is increasing, making efficient heat dispersion and dissipation, as well as cooling, a key issue.In addition, the constrained space limited by high-density designs of the new-generation electronics devices means that conventional heat dispersion components such as graphite sheets and heat pipes can no longer provide sufficient heat dissipation.This has created a need for vapor chambers, which can disperse heat over a large surface area and dissipate heat effectively in spite of limited space. The space available for heat dissipators is particularly limited in mobile products with advanced functionality, such as 5G smartphones and AR/VR devices, as they utilize high-performance ICs and face constant demand for reduced weight.Using Murata's technology and expertise in electronic components, the ultra-thin form factor vapor chamber can be mounted in very small interior spaces and still provide efficient dispersion and dissipation of heat from components such as ICs, thereby improving the operating stability of compact electronic devices.The vapor chamber will be manufactured at Cooler Master's factory, benefiting from the firm's expertise in producing heat dissipators for a variety of electronic devices. The cooling solution will be available under the Cooler Master brand.Murata and Cooler Master's ultra-thin vapor chamberPhoto: Companies

Global Unichip Corp (GUC), the advanced ASIC leader, announces GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes and 3DFabric advanced packaging technology for AI, HPC, and networking applications.AI/HPC/Networking memory demand is growing quickly and the SRAM to Logic ratio is also increasing. Logic gains higher density and performance when scaled to N5/N3 process nodes but SRAM scaling from N7 to N5/N3 is moderate. SRAM/Logic disintegration allows the implementation of separate SRAM and Logic at the most efficient process nodes. Layers of CPU and SRAM (Last Level Cache, packet buffers) dies can be assembled over and under interconnect/IO dies using TSMC 3DFabric packaging technology. Such expandable SRAM and modular computing applications are enabled by GUC GLink-3D high bandwidth, low latency, low power, and point-to-multipoint interface between 3D stacked dies. CPUs, SRAMs, Interconnects, and I/Os (SerDes, HBM, DDR) can be implemented in the most efficient process nodes. Different die combinations can be assembled to address different market segments. At boot time, assembled SRAM and CPU dies are identified, unique die IDs are distributed, available memory space and computing resources are defined and a point-to-multipoint GLink-3D interface to the stacked dies is enabled.TSMC's 3DFabric SoIC platform technology allows much more efficient connectivity. GLink-3D achieved six times higher bandwidth/area density, six times lower latency and twice lower power consumption than best-in-class 2.5D interface GLink-2.0 (it was taped out in Dec 2020). Several 3D die stacks can be assembled using CoWoS and InFO_oS, interconnected using GLink-2.5D links and combined with HBM memories."GLink-3D is a new addition to a rich portfolio of best-in-class and silicon-proven HBM2E/3 PHY/Controller and GLink-2.5D IPs. CoWoS, InFO_oS, 3DIC expertise, package design, electrical and thermal simulations, DFT and production testing under one GUC roof provide our ASIC customers with quick design cycles, fast bring up and production ramp up." explains Dr. Ken Chen, president of GUC."3D die stacking technology will start a revolution in the way we design HPC, AI and Network Processors. Die-to-die interface is not limited any more to the die boundary, it can be located exactly where processors need to connect to SRAM and additional CPUs. 3DFabric and GLink-3D pave way to the processors of the future, combining huge and scalable processing power with vast, high bandwidth and low latency memory, when every component is implemented using the most efficient process node." said Igor Elkanovich, CTO of GUC.GLink-3D key features:*Supports TSMC-SoIC stacking of combination of N5 and N6 process nodes *Point-to-multipoint interface allows the main die to interface with several stacked dies simultaneously *Robust, full duplex 9Tbps traffic per mm2 *Speed: 5.0 Gbps per lane *Extremely low end-to-end latency (< 2ns) with low power design (< 0.2pJ/bit) *Single supply voltage 0.75V ± 10%To learn more about GUC's HBM, GLink 2.5D/3D IP portfolio and InFO/CoWoS/SoIC total solution, please contact your GUC sales representative directly.

Sintrones' in-vehicle computers offer a complete solution for in-vehicle applications, including driver behavior monitoring and self-driving capability. They have high flexibility, support a wide range of peripherals and connectors, and can be adapted to various vehicle management systems. Common use cases include: fleet management with GPS requirements, vehicle maintenance systems, and computing for autonomous vehicles.The key highlight of Sintrones' in-vehicle computers is their easy-to-use and intuitive interface, which is highly suitable for self-driving cars, public transport, and other applications that require large capacity systems while maintaining functional simplicity. What's more, these systems can manage the capabilities of the inner components of vehicles to accurately assess and track the state of hardware and software, usage status, and operation of all of the fleets.Among industrial PC manufactures in Taiwan whose core business is in-vehicle computers, Sintrones stands out because of its expertise regarding in-vehicle computer hardware design and manufacturing. They have accumulated years of practical experience and business relationships with end users, which have helped them gain valuable first-hand interactions and insights from countless customers. Sintrones have continuously challenged their own design capabilities for creative inspiration, and eventually rolled out products optimize for in-vehicle environments and usage, achieving impressive results. Since its establishment in 2009, it has continued to accelerate its growth. In 2019, it was successfully became a public listed company in Taipei Exchange.Technological progress for communication systems, driving in-vehicle computers' growthSintrones' Account Manager of the Greater China Region, Juergen Ko, explained during an interview that the development of in-vehicle computers began with integrated systems that incorporated GPS and 3G communication technologies. Back then, Europe was a major region, and also where Sintrones began and developed its business, first by setting a firm foothold in the region with Finland's taxi fleet management, followed by applications in various commercial vehicles such as buses, trucks, taxis, and even trains, etc., which began to sprout and grow rapidly.Take 4G for example, in-vehicle applications have high demand for Power over Ethernet (PoE) technology. Thanks to the application of Internet of Vehicles (IoV), IoT devices were all , including IP cameras. PoE played an important role by solving power supply issues while greatly reducing wiring complexity, with that, in-vehicle monitoring, troubleshooting, and Internet services became mainstream. Although the market was fragmented in its early days, and the difference between requirements among different applications was vast, Sintrones still seized the opportunities for growth, offering specialized custom-made in-vehicle computers for these industries.5G applications sparked a new type of competition for in-vehicle computersWith the advent of the 5G era, public transport systems introduced smart applications en masse, realizing various benefits of living in a smart city, such as bus tracking apps, which allow people to catch it right on time, or traffic control for ambulances which reduces the chance of traffic delays and saves precious time. Both of these applications are backed by in-vehicle computers.The requirements of smart applications center around artificial intelligent (AI), and with the brand new lineup of 5G communication modules and GPUs, in-vehicle computers are on the same track with the future development of next-gen electric vehicle applications. Although the high-diversity, low volume nature of product specs continues to challenge our engineering teams' design flexibility and customization capabilities, the gross margin is over 30%, so the profit structure is relatively stable compared to other electronic manufacturing service industries in Taiwan.According to Manager Ko, in order to keep up with the advent of 5G applications, Sintrones EBOX-7000 series has built-in hot swappable SIM card auto activation modules, which offers Dual SIM Dual Standby, allowing end users to easily switch between SIM cards. The EBOX-7000 series also supports different 5G telecom service providers, offering users the best online experience. Thanks to this, Sintrones has set a new benchmark in the highly competitive 5G application market.Wide temperature and voltage range, positioning us as the hidden campionThe competitive edge of in-vehicle computers is closely related to the engineering teams' experience in design, from wiring layout to thermal design, and customers expect every bit of the details to work in unison. Take Sintrones' entry into the snowplow vehicle market for example. One of the global top three snowplow providers separated from the Mercedes-Benz Group, which also happened to be Sintrones' client, and mentioned that in the presence of heavy snow, thickness detection with GPS and real-time readiness of vehicle and personnel information are required for proper plowing; in such cases, resource allocation efficiency and safety monitoring abilities are crucial for a successful operation. Now, when we compare the taxi fleet in the distant desert area of Dubai and this case, it is clear that both rely on the wide range of temperature design capabilities required to adapt to the extreme environments of the polar region and desert.The biggest difference between in-vehicle computers and common industrial computers is their power input design. Since the voltage supplied to other electronic devices when a car starts up is unstable, our engineering team needs to devise a multi-stage delayed booting mechanism, where the computer will react differently based on the distinct characteristics of cars. For example, a design where the computer is formally booted 5 or 10 seconds after the car starts up once the voltage supply is stable. Moreover, the 9-to-36-volt wide voltage plays a key role in adapting to the voltage fluctuations in cars. The rising trend of electric cars has brought a different set of requirements for power management and control, and Sintrones has already actively deployed applications in the electric vehicle market.Aiming at electric vehicle applications in the coming ageTaking a look at Sintrones' clientele, we can see that business in the quantity-oriented taxi fleet management is going strong. As for cases that serve as indicators, aside from the application in German snowplow vehicles, the application in AI smart buses in Singapore is a key milestone for our high-grade model. This case combines AI with unmanned autonomous vehicle systems by integrating ADAS and using GPUs' high-speed computing capabilities to predict road conditions. At the same time, it meets the various needs of vehicle emergency response; it is currently one of the best models in high-end applications.Our AI applications have also entered the Japanese market. Currently, a key example is a case with a client who specializes in the manufacturing of excavators and construction machinery, where are used as integrated applications in machinery safety warnings and GPS linkage. After years of continuous efforts, Sintrones received wide praise from our clients in the Japanese market. This is now our largest market in Asia, and also one of our key growth-driving forces worldwide.With electric vehicles becoming all the rage around the world, we maintain business relationships with all of the major players, whether it's Foxconn's Make It Happen (MIH) Electric Vehicle Alliance in Taiwan, or mainstream electric vehicle manufacturers from Europe, the U.S., and China. Take France's leading autonomous vehicle manufacturer, Navya, as an example; our collaborative product development plan is only the first of many to come. Regarding the business prospects of in-vehicle computers, as the market continues to undergo huge and drastic changes, Sintrones, who specializes in hardware design and manufacturing, will continue to prioritize promoting this technology and maintaining close contact with frontline system integrators and software vendors. Moreover, by sharing resources with leaders from other industries, such as an alliance with AUO, we will offer more comprehensive solutions to our clients. This is Sintrones' best strategy for our future success.Sintrones' Sales Manager of the Greater China Region, Juergen KoPhoto: CompanySintrones produces flexible high-performing industrial computers, satisfying various smart edge computing requirementsPhoto: Company

Semiconductor chips have been the hottest trending topic recently due to their indispensability in all types of applications, including automobiles, mobile phones, military weapons, and space technology, etc. We can't help but wonder, how do semiconductor plants produce chips with such a large variety of functions out of large silicon wafers? The entire procedure involves an extremely important back-end packaging process known as "die bonding," which is to remove the die from the silicon wafer, and then attaching the die to the IC substrate using a conductive medium such as epoxy or gold wire (with epoxy the most common).With the evolution of the semiconductor miniaturization process, an increasing number of die can be cut from a silicon wafer. The LED die, for example, has evolved from an original die size of about 1mm to micro LED dies of just 100μm or even only 30μm. This means the number of pick-and-place motions in the die bonding process have also undergone a sharp increase, posing severe challenges for manufacturers seeking to maintain operating efficiency and positioning accuracy. To address this issue, ADLINK continues to introduce die bond solutions that are faster, more accurate, and offer easier setting of the dispensing trajectory to fulfill the needs of customers in the semiconductor industry.Supports multiple I/O channels to meet various needs for motion controlFeynman Lin, Technical Director of the ADLINK Smart Machine Product Center, stated that ADLINK's die bond solutions feature an extremely convenient development interface which allows users to easily set the dispensing trajectory and fully supports linear, circular, spiral or mixed trajectories of various shapes while also providing extremely efficient error compensation. More importantly, once the trajectory has been set, users can perform "trigger" control using check list mode, which means the computer will confirm that the correct position has been reached based on sensor information such as temperature, position and weight supplemented by the camera's precise positioning comparison. The adhesive dispensing valve will only be triggered after all conditions are met, enabling precise amounts of adhesive to be dispensed according to user settings. In other words, ADLINK's die bond solutions can be used with a great variety of I/O channels to fully meet the check list requirements that users anticipate.Ruey Wang, Product Manager at ADLINK's Smart Machine Product Center, added that with the advancement of semiconductor manufacturing processes, die size has shrunken exponentially, requiring an increasing number of pick-and-place motions. As such, users as a matter of course have come to expect accelerated pick-and-place sequences that offer the same positioning accuracy. To this end, ADLINK's die bond solution supports "high-speed P2P" and uses closed-loop motion control technology to speed up the tuning speed, suppress resonance or jitter effects in the shortest time, and ensure that adhesive can be dispensed as soon as possible once positioning has been completed.As for why it is necessary to use a camera to assist with positioning, Ching-pang Lin explained that even with more advanced general sensors, positioning accuracy can reach only about 2mm while the process takes 10ms to complete, making it difficult to meet user requirements in terms of both accuracy and speed. In contrast, cameras can reach an accuracy of 0.1mm, and the position can be obtained immediately after shooting, offering a more immediate and convenient positioning method. To facilitate camera applications, ADLINK offers PCIe-GIE74 frame grabbers that can be used with all renowned camera brands. In addition to excellent image capture quality that guarantees no frame drop, this product also comes with real-time power control capability that provides outstanding energy saving efficiency. In addition, ADLINK also offers PCI-8258 DSP-based 4-axis advanced motion controllers, which are suitable for mounting on the motion axes that require high accuracy and immediate response.One particular challenge that users often encounter when performing die bonding is the inability to distinguish driving axles from driven axles, which can easily affect the control ability of the machine due to the resonance effect of the mechanism. ADLINK's die bond solution offers master-slave synchronous control, thus effectively avoiding interference between machines and mechanisms through frequency-domain response analysis technology, a feature that is becoming increasingly important. Over the past couple of years, an increasing number of manufacturers have been attaching two different ICs into the same chip. Apart from the need for increased alignment accuracy, this approach must moreover be supplemented with evasion functions or related processing mechanisms to avoid interference between heterogeneous components. As the perfect solution to this issue, ADLINK's high-speed P2P fast tuning technology and master-slave synchronization control capabilities not only help users achieve higher alignment accuracy and speed, but also completely eliminate interference variables.As the packaging process becomes more and more miniaturized and high-precision, ADLINK's die bond solution continues to evolve and advance, ensuring that the correct positioning can be quickly achieved and the precise amount of adhesive can be dispensed so that users no longer have to worry about short circuits and defects due to misaligned contraposition or adhesive dispensing.ADLINK's die bond solutions feature an extremely convenient development interface which allows users to easily set the dispensing trajectory and fully supports linear, circular, spiral or mixed trajectories of various shapes while also providing extremely efficient error compensationPhoto: CompanyADLINK's die bond solution continues to evolve and advance, ensuring that the correct positioning can be quickly achieved and the precise amount of adhesive can be dispensed so that users no longer have to worry about short circuits and defects due to misaligned contraposition or adhesive dispensingPhoto: Company

The pandemic has changed people's way of life. Changes in the consumption habits of the general public have led to rapid e-commerce and shipping market growth. Logistic processing efficiency has become one of the key capabilities of competing business owners. In addition, in the era of Industrial 4.0, smart factories extensively adopt machinery to replace manpower, thereby enhancing production efficiency and accuracy. Therefore, demand for unmanned automatic guide vehicle-unmanned handling (AGV) and autonomous mobile robot (AMR) will significantly increase in line with market expectations.In order to ensure the smooth operation of AGV and AMR, battery and charger stability play an essential role. The FSP has developed a 600W charger (FSP600-1UAC01) acceptable to a full range of input voltages, with an output voltage of 50.4V-58.8V and an output current of 10.0A. The product has a streamlined appearance and a compact size of only 202x132x69mm/2.2Kg.In addition, according to different AGV/AMR designs, the FSP also provides:*On-board chargers: IP65 waterproof and dustproof grade; CAN bus communication interface option.*Off-board chargers: IP54 waterproof and dustproof grade; handheld handle design; CAN bus communication interface option. The CAN bus communication interface facilitates software updates and features battery operation data recording, anomaly reporting, etc.FSP's greatest advantage lies in its more than 400 R&D personnel and nearly 30 years of power development experience. Therefore, we are capable of providing different types of customization services. Unlike charger products with the same wattages available in the market, FSP600-1UAC01 has the added function of charger condition setting. It provides micro-customization services of charging voltages/currents, locking mechanisms/wires, charging curves that cater to customers' AGV or AMR product needs.The FSP offers chargers for e-bikes under 300W and industrial chargers with high wattages above 400W. Our products come with a complete range of wattages. Feel free to write us if you have different wattage terminal application needs. We can provide you with tailored products and services.FSP releases battery chargers for AGV and AMR

As the world gets shrouded in COVID-19, low contact has become an essential element in daily lives and work modes in order to prevent the spread of the virus. Under such circumstances, equipment connectivity has gradually become common; the demand for stable and high-speed wireless communication technology has greatly increased; and the role of Wi-Fi 6 will become increasingly important. Bureau Veritas, a major global company specialized in testing, inspection, and certification, held a seminar on "New Opportunities for the Communication Industry in the New Era of Wi-Fi 6E" at Dazhi Denwell, Taipei on April 9, 2021. The latest regulatory trends and key points for certifications concerned with related technologies were explained and analyzed by the technology experts from Bureau Veritas.Pascal Le-Ray, the general manager of Bureau Veritas Taiwan, pointed out in his speech that, since COVID-19 has changed the entire world, communication technology has become the most important technology for the communications between people, between people and things, as well as between things. For instance, when different countries imposed lockdowns in 2020, it became necessary for various large companies to rely on online meetings to maintain operation. At the same time, an array of systems with smart functions emerged to meet demands, showing that the quality of communication technologies will become increasingly crucial for the digital transformation of companies and agencies. With industry-leading testing capability for Wi-Fi 6E, Bureau Veritas already has testing laboratories appointed by the Wi-Fi Alliance. The company is able to provide all-round Wi-Fi certification testing to wireless-network product manufacturers. Meanwhile, the company also has extensive experience in testing for compulsory test items required by relevant standards; and it has assisted many clients in successfully obtaining FCC certifications. Businesses that intend to step into this field may take advantage of Bureau Veritas' professional abilities to minimize time spent on bringing products into the market.Continuous developments in regulations of various countriesFor the first agenda of the seminar, Hank Chung from the Technical Services Division of Bureau Veritas gave a brilliant presentation on the topic of "Wi-Fi 6E Product Regulation Development Trends and Verification Unit Preparation". Hank Chung stated that Europe and the US have formulated new regulations for Wi-Fi 6E. The US has opened up 4 frequency bands for this purpose. But since these 4 frequency bands were previously opened for the use of other technologies, the FCC has set restrictions to protect Incumbent System from interference. As for Europe, the European Commission of Communications opened up the frequency band of 5925-6425MHz. Overall, compared to the 2.4 GHz and 5 GHz spectrums currently in use, the bandwidth of the new spectrum is an increase of more than 150%.The FCC's formulation of regulations for Wi-Fi 6E was announced in May 2020, and its corresponding test method did not complete until October 2020. Therefore, despite the faster pace at which the frequency bands were opened in the US, manufacturers did not have products available until December 2020. Basically, the FCC's regulations for Wi-Fi 6E 6GHz is still under the same original UNII chapter as before, and the related technical requirements are further extended based on this. Such regulations are separated into two categories: AP and Client. Equipment belonging to these two major categories are divided into high power and low power classifications based on their features. High-power equipment can be used outdoors and indoors. In addition to the original RF transmitter-related tests, it also needs to comply with the requirements of AFC (Automated Frequency Coordination) or CBP (Contention-Based Protocol). Low-power equipment is mainly used for indoor use. In addition to the original RF transmitter-related tests, there are also related product design restrictions (such as power supplied requirements, antenna requirements, etc.) and the requirements of the CBP (Contention-Based Protocol). The FCC has formulated limitation regulations for these classifications, so Hank Chung specially reminded businesses that they must first clarify the classifications to which their own products belong and take these into consideration at the design stage.In addition to the key points of FCC's regulations, David Liu from the Technical Services Division of Bureau Veritas also gave an in-depth explanation of the UKCA marking requirements for radio equipment. He stated that after leaving the EU, the UK also formulated its own UKCA Marking directives, which include most goods several standards previously subject to CE markingrequired by the CE, including the EMCD, LVD, RED, and RoHS; these were put into effect on January 1, 2021. In relation to these UKCA markingstandards, he made several suggestions for products sold in the UK. 1. If you need to (or choose to) use an authorized representative or responsible person, they will need to be based in the UK for products being placed on the GB marketBusinesses must give the responsibilities of this matter to locally authorized personnel. 2. Check your legal responsibilities, confirm that your own company or and distributors have a clear understanding of the modified legal responsibilities if changed. 3. From 1 January 2023, the UKCA marking must, in most cases, be affixed directly to the product. You should start building this into your design process ready for this date. Goods to be shipped must have UKCA markings when being labeled. 4. In addition to UKCA marking, information including the names and addresses of the manufacturer and importer also need to be displayed on labels. 5. Products to be sold in the GB UK must comply with the UKCA marking, CE DoC; the UK DoC and related technical documentations must be signed and kept for 10 years after the product's entry to market , kept for up to 10 years after the product is placed on the market. 6. The UK standards are currently the same in substance and with the same reference as the standards used in the EU The regulations put into effect on January 1, 2021 was announced simultaneously in the EUOJ content published on the same day. 7. Note that products sold to the UK should follow relevant UK legislation (rather than EU legislation) UK regulations rather than EU regulations. Corresponding information can be found in several regulations. For electromagnetic compatibility, see Electromagnetic Compatibility Regulations 2016 (S.I. 2016/1091); for low voltage products directives, see Electrical Equipment (Safety) Regulations 2016 (S.I. 2016/1101); as for radio frequency equipment, relevant instructions can be found in Radio Equipment Regulations 2017 (S.I. 2017/1206).Information security designs have become essential for Wi-Fi 6EWith regard to high-quality connections supported by large capacity, high efficiency, and high performance, Jimmy Wang from the Wi Fi NFC Testing Section of Bureau Veritas introduced Wi-Fi Alliance's latest certification technologies for Wi-Fi 6E and WPA3. He said the frequency band of Wi-Fi 6E has extended into 6 GHz, and the bandwidth with higher speed greatly reduces the delay of signal transmission. While the fast and trouble-free transmission brought by the various features of Wi-Fi 6E leads to an array of smart services, it will also give rise of risks of user information leakage or security attacks during the information transmission,. Therefore, Wi-Fi Alliance released new version of WPA3 in December 2020. The testing of SAE with Hash-to-Element and Transition Terminated Indicator will be required from December 2021.Moreover, it adds some optional features. The first one is SAE Public Key (SAE-PK) This mechanism uses encrypted public key fingerprints to provide asymmetric authentication in order to prevent external malicious attacks. The next feature, Beacon Protection, ensures signal integrity by only utilizing keys that can be obtained by network equipment. The third feature is Operation Channel Validation. In the process of switching transmission channels, the system provides mutual authentication to both channels. The last feature is Privacy Extension. To achieve this, the system is enabled to support the designs of randomized MAC addresses, which protect the privacy of Wi-Fi users.In addition, Kenny Lee from the Technical Services Division of Bureau Veritas also shared and explained the development trends of information security regulations in recent years. He first pointed out that, in 2020, Bureau Veritas received the "Industry Leader Award" in the Professional Services Category of the Dow Jones Sustainability Indices (DJSI) with honor. Bureau Veritas sets the highest benchmark in the industry as an impartial third-party certification agency. Its information security testing laboratories have assisted many manufacturers in successfully completing certifications.Regarding information security regulations, countries around the world have continuously introduced information security laws in the past few years in response to the emerging era of smart networks. Looking at Europe as an example, in 2019, the EU granted authority to the European Union Agency for Cybersecurity (ENISA), and ENISA officially became a permanent cybersecurity agency of EU. ENISA is responsible for formulating certification plans, guiding the development of technical certification frameworks, and assisting member countries in dealing with large-scale cyber attacks. In addition to the EU, other major industrial nations have also begun to launch related plans one after another. Apart from rolling out relevant strategies, the agencies have also started to formulate related regulations. The IEC 62443, RED ARTICLE 3.3, and ETSI EN 303 645, for example, provide comprehensive directives that give businesses in various industries a clear direction for product design.As a global agency specialized in information security certification, Bureau Veritas provides professional Wi-Fi certification and testing services for industrial control systems and consumers. Kenny Lee expressed that, as market demands rapidly emerge and various countries make regulations more stringent, manufacturers can take advantage of Bureau Veritas' expertise and experiences to quickly create products that comply with market regulations. Doing so can help reduce time spent on entering the market and enhance company competitiveness.

The recent global shortage of automotive chips has brought Taiwan's semiconductor industry into the focus of worldwide attention. The real cause of why Taiwan's semiconductor chips are in such great demand is due to their trusted, unwavering quality that's supported and assured by a series of rigorous verification procedures. The electrical measurement performed before integrated circuit packaging is one of the most important steps of verification. To complete this task, the engineering probe station system must be used in conjunction with a variety of test instruments, automatic test equipment and specially designed engineering verification system.The challenges of electrical measurement lies in the fact that the input of the silicon wafer measurement signals cannot be seen directly by the naked eye, but only through simulation. As such, how does the probe station generate a real-time response based on the analog signal generated from contact between the probe and the silicon wafer, thus directing the probe to continue performing the subsequent motion (such as a slight pause, or horizontal movement, etc.) while also ensuring that the probe head accurately and effectively touches the silicon wafer? Although this indeed constitutes a major challenge, it's something that can be overcome with good motion control.To address this issue, ADLINK has been closely following the evolution of semiconductor manufacturing processes over the years, and has developed a series of probe test solutions that offer the advantages of both high precision and high speed. These solutions can be used to simulate and control at the same time, thus enabling clients such as wafer manufacturing plants or IC packaging plants to directly begin probe test operations without needing to purchase additional servo controllers with related functions.Enhancing the efficiency of error compensation through closed-loop motion controlFeynman Lin, Technical Director at ADLINK's Smart Machine Product Center, states that as ADLINK has been working closely with test equipment factories and semiconductor factories for many years, the company is well versed in the challenges that may arise in the probe test process. Therefore, it has continued to refine the probe test solution and already perfected many key technologies. In addition to the above, the analog input control function has been integrated into the motion control card so that it can fully correspond to the corresponding instantaneous command control, thereby preventing the probe from moving abnormally. Lin further explains that as the silicon wafer is often not a neat, level plane, it is necessary to constantly adjust the position of the probe to avoid damage to the silicon wafer or probe head due to excessive contact.Ruey Wang, Product Manager at ADLINK's Smart Machine Product Center, goes on to add that whether before or after the positioning of the probe, it will need to perform various motion controls, including moving up and down continuously, shifting horizontally, or moving to the next point. Now, through its profound knowledge of motion control technology, ADLINK is able to efficiently meet these diverse and constantly changing needs.Furthermore, each silicon wafer has hundreds or thousands of points to be tested on which testing must be performed. Therefore, in order to achieve optimal timeliness, the probe must be able to continue moving quickly and efficiently. Resonance and jitter however are likely to occur at the moment of positioning, and measurement cannot be performed until after tuning has been completed. To minimize the lag resulting from time spent waiting for tuning to be completed, ADLINK has developed rapid tuning technology which allows the probe to move before the Z axis of the workbench under test (for silicon wafers) is stabilized, thereby increasing tuning speed and achieving the effect of resonance suppression. This is to ensure that the probe will no longer vibrate as soon as it is in place, and is able to immediately execute testing.Feynman Lin additionally indicated that the ADLINK probe test solution supports "closed-loop motion control" by continuously calculating on a rolling basis the average value of the error between the number of commanded steps and the actual number of steps. When the next command is issued, it can directly combine the number of commanded steps with that of error steps (if the original command is to move 5mm and the average error is 0.01mm, then the subsequent command is directly adjusted to 5.01mm). By directly carrying out error compensation within the same motion, error distance can be reduced even if the compensation is not 100% complete, and is thus greatly conducive to improving testing speed.Other technical features of the solution include "mixed use of multi-axis linearity and arc angle compensation" and "process interruption protection mechanism." In the previous usage scenario, the main reason is that the wafer carrier may move in X-axis, Y-axis or Z-axis interchangeably. The path of travel is a mixture of straight lines and curves. In complex situations like this, the ADLINK probe test solution can continue to perform route detection and error compensation step by step, regardless of whether each segment is a straight line or an arc without the need to pause for switching or causing breakpoints in the testing process. Process interruption protection, on the other hand, usually comes into play in scenarios of sudden power glitches or power failure. The state immediately before the interruption will be recorded, and the process will continue to be executed after power is restored without need to waste time by starting the process all over again.Also worthy of mention is the fact that ADLINK has developed an "Automation Product Software Development Kit" (APS SDK) based on the experience and product functions the company has accumulated over the years. The APS SDK can also be used in probe test applications to help semiconductor clients significantly accelerate the development and deployment of motion control programs.In conclusion, ADLINK will continue to closely monitor the evolutionary trends of Mini LED or MicroiLED backlight technology, 2.5D or 3D packaging technology, and even 2nm or 1nm process technology, as it continues to strive for excellence by launching probe test solutions that fulfill customer expectations with faster execution speed while maintaining high-precision performance.ADLINK has been closely following the evolution of semiconductor manufacturing processes over the years, and has developed a series of probe test solutions that offer the advantages of both high precision and high speedPhoto: CompanyHow does the probe station generate a real-time response based on the analog signal generated from contact between the probe and the silicon wafer, thus directing the probe to continue performing the subsequent motion while also ensuring that the probe head accurately and effectively touches the silicon waferPhoto: Company