Semiconductor chips have been the hottest trending topic recently due to their indispensability in all types of applications, including automobiles, mobile phones, military weapons, and space technology, etc. We can't help but wonder, how do semiconductor plants produce chips with such a large variety of functions out of large silicon wafers? The entire procedure involves an extremely important back-end packaging process known as "die bonding," which is to remove the die from the silicon wafer, and then attaching the die to the IC substrate using a conductive medium such as epoxy or gold wire (with epoxy the most common).
With the evolution of the semiconductor miniaturization process, an increasing number of die can be cut from a silicon wafer. The LED die, for example, has evolved from an original die size of about 1mm to micro LED dies of just 100μm or even only 30μm. This means the number of pick-and-place motions in the die bonding process have also undergone a sharp increase, posing severe challenges for manufacturers seeking to maintain operating efficiency and positioning accuracy. To address this issue, ADLINK continues to introduce die bond solutions that are faster, more accurate, and offer easier setting of the dispensing trajectory to fulfill the needs of customers in the semiconductor industry.
Supports multiple I/O channels to meet various needs for motion control
Feynman Lin, Technical Director of the ADLINK Smart Machine Product Center, stated that ADLINK's die bond solutions feature an extremely convenient development interface which allows users to easily set the dispensing trajectory and fully supports linear, circular, spiral or mixed trajectories of various shapes while also providing extremely efficient error compensation. More importantly, once the trajectory has been set, users can perform "trigger" control using check list mode, which means the computer will confirm that the correct position has been reached based on sensor information such as temperature, position and weight supplemented by the camera's precise positioning comparison. The adhesive dispensing valve will only be triggered after all conditions are met, enabling precise amounts of adhesive to be dispensed according to user settings. In other words, ADLINK's die bond solutions can be used with a great variety of I/O channels to fully meet the check list requirements that users anticipate.
Ruey Wang, Product Manager at ADLINK's Smart Machine Product Center, added that with the advancement of semiconductor manufacturing processes, die size has shrunken exponentially, requiring an increasing number of pick-and-place motions. As such, users as a matter of course have come to expect accelerated pick-and-place sequences that offer the same positioning accuracy. To this end, ADLINK's die bond solution supports "high-speed P2P" and uses closed-loop motion control technology to speed up the tuning speed, suppress resonance or jitter effects in the shortest time, and ensure that adhesive can be dispensed as soon as possible once positioning has been completed.
As for why it is necessary to use a camera to assist with positioning, Ching-pang Lin explained that even with more advanced general sensors, positioning accuracy can reach only about 2mm while the process takes 10ms to complete, making it difficult to meet user requirements in terms of both accuracy and speed. In contrast, cameras can reach an accuracy of 0.1mm, and the position can be obtained immediately after shooting, offering a more immediate and convenient positioning method. To facilitate camera applications, ADLINK offers PCIe-GIE74 frame grabbers that can be used with all renowned camera brands. In addition to excellent image capture quality that guarantees no frame drop, this product also comes with real-time power control capability that provides outstanding energy saving efficiency. In addition, ADLINK also offers PCI-8258 DSP-based 4-axis advanced motion controllers, which are suitable for mounting on the motion axes that require high accuracy and immediate response.
One particular challenge that users often encounter when performing die bonding is the inability to distinguish driving axles from driven axles, which can easily affect the control ability of the machine due to the resonance effect of the mechanism. ADLINK's die bond solution offers master-slave synchronous control, thus effectively avoiding interference between machines and mechanisms through frequency-domain response analysis technology, a feature that is becoming increasingly important. Over the past couple of years, an increasing number of manufacturers have been attaching two different ICs into the same chip. Apart from the need for increased alignment accuracy, this approach must moreover be supplemented with evasion functions or related processing mechanisms to avoid interference between heterogeneous components. As the perfect solution to this issue, ADLINK's high-speed P2P fast tuning technology and master-slave synchronization control capabilities not only help users achieve higher alignment accuracy and speed, but also completely eliminate interference variables.
As the packaging process becomes more and more miniaturized and high-precision, ADLINK's die bond solution continues to evolve and advance, ensuring that the correct positioning can be quickly achieved and the precise amount of adhesive can be dispensed so that users no longer have to worry about short circuits and defects due to misaligned contraposition or adhesive dispensing.
ADLINK's die bond solutions feature an extremely convenient development interface which allows users to easily set the dispensing trajectory and fully supports linear, circular, spiral or mixed trajectories of various shapes while also providing extremely efficient error compensation
ADLINK's die bond solution continues to evolve and advance, ensuring that the correct positioning can be quickly achieved and the precise amount of adhesive can be dispensed so that users no longer have to worry about short circuits and defects due to misaligned contraposition or adhesive dispensing
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