AMD has introduced its next generation mobile graphics technology, the AMD Radeon HD 6000M series, delivering AMD's highest performing notebook graphics for those who want to experience games, entertainment, and productivity on the go.Harnessing AMD's second-generation of Microsoft DirectX 11-capable mobile graphics architecture, the AMD Radeon HD 6000M series provides users with: Models offering up to 1.3 teraflops of compute power for a gaming experience on up to six displays using AMD Eyefinity technology; AMD HD3D technology for stereo 3D entertainment; and AMD EyeSpeed technology for improved video and application performance.AMD Radeon HD 6000M series graphics represent support for notebook brands with existing and upcoming 2011 AMD mainstream notebook platforms planned to feature Eye-Definition Gaming with DirectX 11 support and AMD Eyefinity technology, plus amazing AMD HD3D Technology-all designed to accelerate mobile performance.AMD Radeon HD 6000M series GPUPhoto: Company

AMD, at Consumer Electronics Show (CES) 2011, launched a new class of accelerated processor that combines with strong compute capabilities - the AMD Fusion family of accelerated processing units (APUs) in a single die design. It features multi-core CPU (x86) technology, a powerful DirectX11-capable discrete-level graphics and parallel processing engine, a dedicated high-definition video acceleration block, and a high-speed bus that speeds data across the differing types of processor cores within the design.New generations of desktop, notebook and HD netbooks are now available based on AMD Fusion APUs at affordable price points, the vendors said. Tablets and embedded designs based on AMD Fusion APUs are expected be available later in the first quarter of 2011. The new range of product features include stutter-free HD video playback, breakthroughs in computational horsepower to handle the most demanding applications, DirectX 11-capable graphics and all-day battery life.AMD expects leading manufacturers Acer, Asustek Computer, Dell, Fujitsu, Hewlett-Packard (HP), Lenovo, Micro-Star International (MSI), Samsung Electronics, Sony and Toshiba to announce plans to deliver AMD Fusion APU-based systems.The 2011 low power platform (Brazos) enhances the everyday computing experience and is available beginning today in two APU variations: E-series and C-series. These APUs feature the new x86 CPU core codenamed Bobcat. Bobcat is AMD's first new x86 core since 2003.The 2011 mainstream platform is primarily intended for performance and mainstream notebooks and mainstream desktops. It will feature the 32nm A-series Llano APU, which includes up to four x86 cores and a DirectX 11-capable discrete-level GPU, and is scheduled to ship in the first half of 2011 and appear in products mid-year, AMD said. AMD: New low power APU specifications Low power APUs Model TDP Core count Frequency E-series (Zacate) - Designed for mainstream notebooks, all-in-ones, and small form factor desktops E-350 18W 2 1.6GHz E-240 18W 1 1.5GHz C-series (Ontario) - Designed for HD netbooks and other emerging form factors C-50 9W 2 1.0GHz C-30 9W 1 1.2GHz Source: Company, compiled by Digitimes, January 2011

VIA Technologies has announced a new graphics card designed specifically for the embedded market with the VIA eH1, a DirectX 10.1 compliant, multi-display card that thrusts any system with a PCI Express slot.The VIA eH1 comes with a three year product longevity guarantee and is the most power-efficient discrete graphics and video solution on the market today, VIA claimed. The VIA eH1 AIB features an advanced DirectX 10.1, OpenGL 3.1, OpenGL ES 2.0 compatible 64-bit architecture and offers multi-stream 1080p HD video decoding and stereoscopic 3D rendering capability.The VIA eH1 is a low profile PCI Express add-in-board designed for next generation embedded applications in a range of segments including digital signage and advertising, POS, POI, gaming or any embedded application where graphics and HD video is streamed on two displays, the vendor said.The VIA eH1 features the S3 Chrome 5400E GPU and is complimented with 512MB of DDR3 memory. VIA eH1 graphics card specifications Item Detail Port PCI Express 2.0 bus interface Memory 512MB DDR3 Output Dual-link DVI and HDMI (with HDCP) Resolution Up to 2560 by 1600 Source: Company, compiled by Digitimes, January 2011VIA eH1 graphics cardPhoto: Company

At the 2011 Consumer Electronics Show (CES) in Las Vegas, LG Electronics (LG) will unveil the LW6500, a Cinema 3D TV.LG's Cinema 3D technology does not require shutter glasses, so images displayed on the LW6500 are entirely free of flicker, and the LW6500 received a "flicker free" certification from Intertek and TÜV, two certification bodies. The company said the LW6500 is the first 3D TV to receive this designation.The 3D glasses weigh 16 grams and have no electrical parts and are free of electromagnetic waves and never need to be recharged. The glasses do not need to be synchronized so viewers can watch the LW6500's screen from any angle. And because the glasses are far less expensive than shutter glasses, viewers can buy as many pairs as they need for family and friends. The LW6500 also features 3D light boost, a thin film covering the screen that ensures 3D images are shown at maximum brightness.The LW6500 will be rolled-out in select markets soon after its introduction at CES.LG Cinema 3D TV, the LW6500Photo: Company

With the PC BIOS entering a new generation of UEFI (Unified Extensible Firmware Interface) technology, Phoenix Technologies, the leading manufacturer of core system software, has launched the new SecureCore Tiano 2.1 (SCT2.1), offering a total solution to help clients join the UEFI line.During the SCT2.1 product launch presentation in Taiwan, executives provided a technology overview, explained the product features, introduced development tools, outlined educational training, and performed a demonstration using an actual machine. The response was overwhelming, with over 200 designers participating in the event.Phoenix Technologies' president and CEO Tom Lacey stated that Phoenix Technologies' results for focusing on the BIOS industry have already been shown; currently they have already received over 120 projects, and project teams are giving clients their full support to help them complete product development and testing. In the future they will continue to expand their operation scale and R&D investment in Taiwan to provide more comprehensive product service. Lacey also stressed that Phoenix Technologies has a close partnership with Intel, which helps Phoenix Technologies to develop industry-leading UEFI technologies.The Phoenix SCT2.1 offers a comprehensive BIOS solution using SDK as the core and four major complete solutions - development tools, educational training, professional service and plug-ins. The presentation allowed various department heads to explain the progress of the company's latest technologies and services to the participants.Five outstanding features of SCT2.1Phoenix Technologies' director Kevin Huang noted that there are five outstanding features of SCT2.1:- Easy power-on: The SCT2.1 module design and menu-driven settings not only simplify the R&D process; they also effectively reduce the power-on preliminary work time for every project. The continuing addition of industry-supported software and hardware specifications and excellent project teams means that on average they can achieve the client project's power-on requirements in less than 48 hours.- Best customization: Through a standardized SMBIOS interface, shared EC interface and POST hook or S3 hook, customization time which originally required three months is reduced significantly to just 3-4 weeks.- Quick Boot: SCT 2.1 can also provide optimized boot-up steps to breakthrough the speed barrier of next generation notebook platforms. According to standard testing results, SCT 2.1's Quick Boot time is approximately 3.5 seconds, while standard boot time is just a little longer, approximately five seconds.- High reliability: In order to provide clients with maximum reliability, over four times more reliability tests were performed on the SCT 2.1 compared to others in the industry. There is continuing investment in testing for support on peripherals such as storage devices, LAN, webcams and USB devices and others, which included testing for over 50 PCI and PCIe cards.- Innovative platform: SCT 2.1 is not only a core platform, but also an innovative one. Through BIOS plug-ins and in addition to core BIOS functions, SCT 2.1 can also bring value-added differentiation services to clients. Through the provision of these value-added services, clients can create new revenue sources and build new markets.Currently SCT 2.1 provides two plug-ins solutions - In-ROM Diagnostics and SecureGuard- In-ROM Diagnostics: A diagnostic tool which exists in the ROM; it can perform tests on main components such as hard drives, CPU, memory and boot path without the need for other storage devices. This is a tool developed together by Phoenix and its partners.- SecureGuard: A patented UEFI plug-in; it allows OEM manufacturers to provide restoration tools for important software components in the ROM environment.SCT2.1 strengthens core functions and expands software and hardware support territoryIn order to provide complete support for OEM/ODM, especially in times of fluctuating market conditions, Phoenix Technologies and silicon vendors maintain close partnerships, and continue to develop corresponding SecureCore Tiano products according to the latest processor structure development.Phoenix Technologies' senior engineering director Terry Chen gave a detailed explanation of SCT2.1's software and hardware support functions and core technology. Chen stated that SCT is a new generation BIOS firmware based on UEFI specifications. It provides high performance multi-layer structures from base, core, and execution to the system (see figure below). Because the BIOS file structure was rearranged, every directory clearly corresponds to SCT 2.1's structure; therefore it is easier for designers to begin the process of developing new projects. Chen stressed that continued engineering processes improvements were made to SCT 2.1; from building client requirements, specifications, and design to program coding, the entire RSDC process was taken into consideration. Also, mechanisms such as the header, version update notification and automated build test for the original files were strengthened in order to increase overall service quality.SecureCore Tiano is a next generation BIOS firmware based on UEFI specifications and provides a high performance multi-layer structure from base, core, and execution to the system.SCT 2.1 also added more BIOS setting flexibility, including variable extension and extended support for hard drives over 2.2 terabytes to perform 64bit OS startup through GUIDed Partition Table (GPT). It also allows OEM/ODM manufacturers to place special pre-boot applications in specific segments in order to achieve the application of system recovery image.As for the most popular tablet products, SCT 2.1 also added support for adding HID (Human Interface Device) in POST and Setup, including through touch panels and the usual mouse operations; this is great news for BIOS settings and changes of embedded systems and popular tablet PCs. At the same time, for the maturing USB 3.0 (which will soon become the industry standard) SCT 2.1 already supports a wide range of related manufacturers, including Fresco Logic, Renesas Electronics, VIA Labs Inc, Texas Instruments (TI) and ASMedia Technology, to satisfy different project needs.With the announcement of SCT2.1, various support tools are available to satisfy the production line and stage requirements for designingDuring the presentation, Phoenix Technologies senior R&D manager Jack Wang introduced the numerous development tools provided by SCT 2.1, including Flash Tool, BIOS Editor, Unlock Tool and Debugger Tool.The Flash Tool supports multiple languages and can be executed under DOS and Windows simultaneously. A new capsule update method was also added, which is able to perform Flash updates under the DXE stage and not in the OS - this can prevent improper operation, system crashes, or unexpected occurrences that could interrupt Flash updates; emergency restore for the BIOS can also be performed with this function. The new version of the BIOS Editor tool strengthens edit flexibility; clients who were unable to receive the original code can now perform module replacement and editing, as well as adjustment to the startup sequence of software and hardware and changing of the logo.The Unlock Tool and Debugger Tool are two important newly added tools for SCT 2.1. The first uses AES-128 security technology, and can be used as a backdoor PBA password generator. OEM manufacturers can set key passwords flexibly through methods such as command lines, user interface or embedding. After being unlocked, the PBA password will be cleared. This tool can solve unnecessary RMA problems and lower service costs.The Debugger Tool is a next generation debugging module. The company is currently in the process of applying for a related patent; prototype development has already been completed. In terms of hardware specification, it is equipped with multiple interfaces; on the platform side there are USB, I2C, GPIO and serial ports and on the host side there are USB and serial ports. When used as a single machine, it can be used for Port 80 redirection as an LCD message display screen (see figure below). Wang stressed that different debug stages PEI/DXE/SMM could be selected for RDM Reveal and automatic firmware update could be paused at any time through the USB interface to understand the system's executing status; these can vastly increase debugging efficiency.The SCT Debugger Tool currently undergoing patent application is equipped with multiple interfaces.Professional project services with the help of educational training to help clients quickly import projectsIn response to the launching of the all-new SCT 2.1 to the market, Phoenix Technologies also prepared a complete training course. Senior product marketing director Rebecca Yang stated that Phoenix Technologies initiated educational training for clients since the end of last year; in order to make training more comprehensive, and next year they will resume Phoenix University Training (PUT), a course with a long history. It is estimated that course content such as X86 architecture, UEFI 101 to basic SCT and advanced SCT will be provided every season for beginners and BIOS engineers according to the needs of designers.To find out more, please visit Phoenix Technologies' official website at http://www.phoenix.com/.

Intel has announced a new line of ultra-small solid-state drives (SSD), the SSD 310, which delivers the same performance as its regular X25 series-class SSD but in one-eighth the size.Measuring 51mm by 30mm and 5mm thick, and weighing just 10 grams, the new compact SSD series enables accelerated performance in dual-drive systems when paired with larger-capacity hard drives.The Intel SSD 310 also supports SATA signals over a PCI Express (PCIe) mini-connector for on-board, compact storage in single-drive netbooks, tablets or handheld devices."The Intel SSD 310 series will allow us to provide the advantages of a full-performance Intel SSD paired with the storage of a hard disk drive in a small, dual-drive system," said Tom Butler, director of ThinkPad product marketing, Lenovo. "We've offered Intel SSD solutions for our highly innovative Lenovo ThinkPad laptops for some time, and now we're looking forward to incorporating this new solution across our ThinkPad line.""In order to meet the rigorous demands of our mobile users, we design for mission-critical tasks that require connectivity and handheld mobility in all-weather operations," said Mike Sarrica, vice president and general manager for DRS Tactical Systems. "The Intel SSD 310 series fits the bill by offering a reliable and high performing memory solution."The Intel SSD 310 series is available in capacities of 40GB and 80GB, respectively, priced at US$99 and US$179 in 1,000-unit quantities. The new drives are currently shipping to customers.Intel SSD 310 measuring 51mm-by-30mm and only 5mm thickPhoto: CompanySide view of Intel SSD 310Photo: Company

PPTC (Polymer Positive Temperature Coefficient) temperature sensitive resistors have already become vital elements in today's motherboards, notebook, mobile phones and other consumer electronics devices. With years of experience in the SMD PPTC manufacturing processes, Polytronics said it can help to improve user peripheral compatibility, reduce subsequent manufacturer maintenance costs, and increase overall added value for the transition between USB 2.0 and USB 3.0 with PPTC and super low rho (SLR) PPTC components. Polytronics is focused on PPTC research and manufacturing Polytronics was founded in 1997 and is based in Taiwan's Hsinchu Science Park. The company mainly produces PPTC temperature sensitive resistors and thermal substrates, which are sold worldwide under Polytronics' own Everfuse brand. Types of PPTC include: SMD (surface-mount device), ALD (axial leaded device), RLD (radial-leaded device) plug-in elements, and disc-shaped and other customized elements. SMD-type components are currently the mostly widely used elements, and are mainly used in motherboards, mobile phones and consumer electronic devices, and in recent years, have been introduced into Lithium battery protection designs; ALD-type are widely used in various types of Li-ion batteries; RLD plug-in pin elements are mainly used in MB/GC and industrial electronics; and disc-shaped elements are used in cylindrical rechargeable batteries. Other products include polymer ESD (static) protection elements, one-time fuses, thermal conductive CCL and thermal interface material (TIM) designed for use with PCBs in LED lighting and LED TVs. Assistant manager of Polytronics' Technical Development and Service Center Xie Junbai explained that Polytronics' PPTC temperature sensitive resistors are made of polymer and conductive particles, with two electrodes connected to the plug-in RLD type. The SMD type is produced using Polytronics' patented PCB manufacturing process. Under ordinary current conditions, devices are in a low-resistance state; as soon as the current conditions change, the joule heating effect produces a massive jump in resistance, causing the circuit to be broken, thereby protecting further circuits. Once the situation returns to normal, conductivity across the circuit is immediately restored, and the process can be repeated many thousands of times. For this reason, PPTC elements have replaced one-time fuses in recent years, becoming vital over-current protection elements for motherboards, notebook, consumer electronics devices and mobile phones. Strict adherence to USB 3.0/2.0 compatible specifications, outstanding price/performance ratios in PPTC products for a commercial edge Comparing the USB 3.0 standard with its predecessor USB 2.0, power delivered has increased to 900mA in USB 3.0, therefore at full load the motherboard or hub is slightly reduced from the original 4.75V to 4.45V. As devices which receive power through USB must be able to operate normally at 4.00V, as well as with current limitations such as transient current and motherboard sleep or hibernation modes, the USB 2.0, USB 3.0 and HDMI specifications all propose designs using PPTC or OCP Ics as over-current protection elements, in order to comply with the UL-60950-1 Limited Power Source (LPS) and UL 1434 standards. If PPTC elements are compared to semiconductor switch OCP Ics, other than their somewhat slower reaction times (in the millisecond rather than microsecond range), PPTCs are superior in most other respects, no matter whether the issue is reusability, maximum fault current (>100A), or maximum fault energy (800W); moreover, their low impedance, zero electrostatic susceptibility design and comparatively lower cost make PPTC elements favorites with engineers for designing over-current protection circuits. Polytronics provides a complete line of PPTC products, which work with customer design requirements, while meeting USB 3.0 over-current protection standards. The small size SMD 1206 (0.12-inch by 0.06-inch) and PPTC 1210 (0.12-inch by 0.10-inch) provide protection for one to two USB ports; these over-current protection elements are both capable of maintaining full current load at temperatures above 50-degress C without operating, avoiding erroneously tripping the PPTC element as a result of thermal derating. Although the voltage requirements for the power supply terminal are somewhat reduced in USB 3.0, Polytronics still recommends using the SLR, in order to ensure that voltage drops in the PPTC at full current load do not exceed 0.1V, particularly for rear USB ports in desktops; this not only ensures greater compatibility with USB 2.0 devices, but also leaves more design headroom for motherboard circuits. A typical Intel 5-series or AMD 8-series motherboard provides 10-14 USB ports, with a single or dual port requiring only a single PPTC; at least 5-7 PPTC elements are therefore needed, added to 1-3 elements for a single 1394 port, with the result that an individual motherboard can use as many as 16 PPTC elements. SLR (super low rho) for increased current and improved peripheral compatibility Polytronics' vice president of sales Zeng Wenchang explained that breakthroughs in SLR (super low rho) materials for Polytronics' surface-mount devices (SMD) mean that the company's newly launched SLR PPTC has the following advantages over most conventional PPTC elements: Super low resistance/low voltage drop: Using a 1.5A element, Rds (ON) approaches 110mOhms with an IC under a current of 1A, while the figure for the Polytronics SLR element is only 40mOhms; this allows the consumer to use a longer USB cable and increases compatibility with peripherals that require large amounts of current. High current: Ordinary PPTC and over-current protection (OCP) Ics are limited by the fact that their internal resistance is unable to cope with high-current products; the SLR series offers a choice of the 1206 3A or 1210 3.5A or higher elements, so that users can connect external USB hubs without external power sources. SLR products are also compatible with the latest USB battery charging v1.1 specification, under which USB ports must supply 1.5-1.8A of charging current. Ultra-small dimensions: Polytronics is the first manufacturer to mass produce 0805/0603 PPTC elements, as well as offering two sizes of SLR PPTC product; the 0603 is able to supply 1.5A current suitable for use with USB 3.0 products, while the even smaller 0402 SLR PPTC is also at the prototype stage. Polytronics' solutions are compatible with the latest standards, including U1434 and UL/IEC 60950-1 2nd Edition LPS 8A current five second cutoff operations. Zeng added that SLR solutions originally evolved from the development of low resistance SLD axial PPTC elements for Lithium mobile phone batteries; these products only exist thanks to the combination of the unique properties of the material and Polytronics' own experience of PCB and SMD manufacturing processes. Polytronics hopes to utilize these materials to develop products which are ultra-thin, possess even smaller dimensions (0805, 0603, 0402) and can cope with correspondingly high working currents, in order to provide over-current protection for high-spec mobile phones and other handheld electronic devices. Starting out with the USB 3.0 specification's requirements for electrical characteristics, Polytronics began to promote uses for SLR both domestic and internationally in 2009. Competition in Taiwan's motherboard market is particularly fierce, with the result that the major motherboard manufacturers have been highly enthusiastic about the introduction of SLR, including Asustek Computer and Gigabyte Technology, as well as key notebook OEMs, have already introduced SLR PPTCs into their products, with designs featuring 1206 or smaller size PPTC elements. High patent thresholds leave the competition standing Zeng pointed out that Polytronics has patents for everything from the materials and structure to the manufacturing process. For this reason, even though many China-based manufacturers are developing similar products, a large number of technological breakthroughs are still required when working with conductive ceramic filler in PCB process, making the prospect of competing products coming out unlikely in the short term, giving Polytronics an undoubted advantage in this area. Polytronics has high hopes that the increasing use of USB 3.0 will help to popularize SLR PPTCs. Zeng explained that most manufacturers assess passive elements in terms of price, supply and quality. Polytronics is working to break through many manufacturers' ill-conceived design philosophy of "enough will do"; the firm's SLR PPTC products allow desktops, notebooks and consumer electronics devices to become less power hungry and more compatible, helping to reduce subsequent compatibility problems, not to mention customer service and RMA costs. Polytronics' SMD PPTC products took a nearly 70% share of the market in 2009, with production capacity in 2010 standing at around 200 million units per month, and monthly shipments of SLR series products account for around 10 million units, just under 10% of overall shipments. Zeng said he believes that this figure will gradually climb as first-tier motherboard manufacturers and major notebook OEMs begin using these products, which should be the mainstream within 2-3 years. Polytronics' PPTC products: SMD SLR series Photo: Company Miniaturized design: Polytronics' first 0805 and 0603-size SMD PPTC components are also available in the same ultra-low resistance versions. The 0805 and 0603 models can be used to implement 2A or 1.5A high current protection respectively.Photo: Company Comparison with existing products Product Ihold (A) R1max (mΩ) Max Voltage Drop (V) @1A SMD1206P150TFT 1.5 120 0.120 SMD1206P150SLR 1.5 55 0.055 Comparison with over-current protection Ics Product Continuous Current (A) Typical Rds (ON) @1A Typical Voltage Drop (V) @1A Current Limiting Switch 1.5 110 0.110 SMD1206P150SLR 1.5 40 0.040 Ultra-low resistance, ultra-low voltage drop: Ultra-low resistance materials mean that peripherals can receive higher voltages while working under high-current conditions. Source: Company

Micro-Star International (MSI) has launched its new R6850 Cyclone 1GD5 Power Edition graphics card equipped with the latest AMD Radeon HD 6850 GPU. Apart from being the first Radeon HD 6850-based graphics card supporting triple over-voltage functions, the R6850 Cyclone 1GD5 Power Edition is equipped with a 6+1 power system to improve power supply quality and stability, MSI claimed.MSI also pointed out that the graphics card's Cyclone thermal solution is able to reduce the GPU temperature by up to 14-degrees Celsius, while lowering noise by 4dB versus the reference design under full-speed operation.MSI also introduced its exclusively developed P/S Switch for users to adjust fan speed between two modes, performance and silent.Meanwhile, the R6850 Cyclone 1GD5 Power Edition is equipped with the latest Military Class II materials including Hi-C tantalum and solid caps as well as SFC high-performance chokes to ensure the best power supply quality and stability.MSI R6850 Cyclone 1GD5 Power Edition graphics cardPhoto: Company

Mobile communications technology is a constantly evolving field. Rather than always trying to keep up with the latest developments, sometimes taking a different strategic tack will work just as well. While NTT docomo came out second-best in the battle for the iPad 3G Japanese market this year, the Personal Wireless Router (PWR) from another NTT company NTTBP (Broadband Platform) created a new opening. A Taiwanese IT vendor played a role in creating the new blue sea market as well. In this report, we visit NTTBP President Tadao Kobayashi to find out about NTTBP's strategy for next-generation wireless networks.The constantly expanding range of mobile Internet services and the length of the industry chain signify that it is becoming increasingly difficult for traditional telcos to control every single development. They must adopt more flexible strategies and ally with more strategic partners to respond to the new challenges.Japan has now surpassed North America and Western Europe to become the largest wireless broadband market in the world and the demand for mobile Internet is continuing to grow rapidly. As the largest telco in Japan, NTT docomo has come under increasing pressure from other competitors such as SoftBank over the past year. (SoftBank secured exclusive Japanese rights to Apple's iPhone and iPad. Both products have proven to be wildly popular in Japan.)Realizing that the popularity of smart phones and the iPad will lead to a surge in demand for network bandwidth, NTT docomo responded by releasing the Personal Wireless Router (PWR). The PWR complemented the public Wi-Fi network deployed by fellow NTT subsidiary NTTBP throughout Japan and quickly gained solid consumer support. While NTTBP usually works quietly behind the scenes, its role in the success of the PWR has increased its stock with the Japanese communications industry.During the interview, NTTBP President Tadao Kobayashi explained that NTTBP's role is that of a network infrastructure provider. NTTBP is the overall integrator and administrator for the public Wi-Fi networks of NTT business units such as NTT East, NTT West, NTT docomo and NTT Communications. It has also set up more than 7,000 base stations in airports, train stations, schools, hotels, cafes and even train carriages throughout Japan. Expanding its services to include smart phones has helped boost NTTBP's data traffic business by several fold.Kobayashi said that Wi-Fi is gradually becoming the standard wireless interface for portable electronic products. Wireless Internet is now increasingly being integrated into notebooks, smart phones, handheld gaming devices and tablet PCs, so the bandwidth demand is continuing to expand as well. "A huge amount of infrastructural investment is required to deliver Wi-Fi grade speeds over LTE (4G) networks. Wi-Fi is low cost and does not involve expensive spectrum licensing fees either, making it an investment that offers very high returns."Kobayashi thinks that NTTBP can use the newly created demand as an opportunity to set up a new business model. "A new market however lacks a precedent, so the process of going from thinking up a concept to securing the support of your partners is therefore very difficult." Nevertheless, this is a process that all original products or inventions must go through and Kobayashi is more than willing to share this experience with Taiwanese vendors looking to move up to the next level.The MOEA Industrial Technology Research Institute has never spared any effort when it comes to looking for international business opportunities. Industrial Development Bureau section chief Long-fon Hsieh said: "By promoting partnership opportunities with major international companies and learning from their development processes for innovative applications, we can help Taiwanese companies develop even more original and localized value-adding application services. This will help enhance the added value from Taiwanese ICT products as well."Kobayashi first met with team leader Chih-yuan Liu and deputy team leader Chi-lung Wang from the ITRI ICT Laboratories five years ago. Thanks to the efforts of the ITRI, NTTBP began working more closely with Taiwanese companies. Apart from sharing NTTBP's own Wi-Fi operations savvy with Taiwan, the ITRI and NTTBP began a technical exchange program last year as well. The latest joint project is power-saving software for smart phones and smart home sensing applications.Commercial confidence means actual PWR sales figures are not available but Kobayashi revealed that triple-digit growth is expected next year, so Japan will assuredly significantly increase its purchases of wireless gateways from Taiwan. When the associated applications and services are expanded to China, the Americas, and Europe, Taiwanese businesses will benefit as well."There is still a great deal of potential in Wi-Fi!" says Kobayashi. NTTBP is now studying the next generation of Wi-Fi communications standards. The interfacing and compatibility issues between PWR products and LTE (4G) networks are being worked on as well. Kobayashi noted that wireless networking is unlicensed, unlike 3G and even 4G networks. It is also free from the restrictions of licensed bands as well, so 3G and Wi-Fi will complement rather than conflict with each other.Digital convergence is now an established trend and users are increasingly coming to expect seamless IT services. The MOEA IDB is now actively promoting partnerships between embedded system vendors and value-added application or content service providers. The partnership will focus on developing the value-added application services derived from digital convergence. The "Create International Supply Chain for Embedded Software Industry" project, commissioned by the MOEA IDB, and being executed by the ITRI, for example, is based on identifying partnership opportunities with major international vendors such as NTTBP. These projects will enable local companies to set up value-added application services suitable for Taiwan and introduce their successful business models to the business market. This will in turn lead local embedded systems, value-added application or content service vendors into emerging blue sea markets.NTT docomo recaptures Japanese mobile market with support of Taiwanese IT vendors and a flexible Wi-Fi strategyPhoto: Company

Chimei Innolux's (CMI's) Longhua subsidiary, the Innocom Technology (Shenzhen), in China has recently obtained two RoHS certifications from the China Electronics Standardization Institute (CESI), including the production and management of 1.36- to 10.2-inch LCD modules (LCMs) passing the China RoHS factory inspection, and the 1.36- to 4.3-inch LCMs obtaining the China RoHS product voluntary certification. CMI is the first panel maker to obtain the certifications. Being first to establish the China RoHS certification management system gives CMI an advantage to be active in the supply chain, receiving related policy support, obtaining priority in government procurements, and being first to capture market opportunities.As one of the first companies to participate in the China RoHS voluntary certification program, CMI is prepping its supply chain in coordination with the Electronic Information Products Pollution Control Technology Center and CESI Certification Center to establish comprehensive systems for control of hazardous substances and quality assurance.The advantages of obtaining China RoHS voluntary certification include being the first to establish a RoHS certification management system, combining RoHS testing and product certification to increase third-party credibility. It also gives CMI an active position in the supply chain. The result of China RoHS voluntary certification for materials and parts provides admissibility for whole-unit compulsory product certification required by the next tier of suppliers in the supply chain, reducing customers' whole-unit certification cost and reducing time-to-market. In addition, when customers are required to obtain China RoHS compulsory certification, CMI can quickly respond to meet that requirement, enabling customers' products to capture market opportunities first. The China RoHS voluntary certification also not only makes it easier to receive national policy-related support but also priority in government procurements.