Cree, Inc., a market leader in silicon carbide (SiC) power devices, announces a new family of silicon carbide (SiC) Schottky diodes optimized for performance. Cree is advancing the adoption of silicon carbide power devices into mainstream power applications by introducing a comprehensive family of SiC diodes with a wide range of amperage ratings and package options."In order to develop the next generation of power electronics, design engineers are looking for the unique performance advantages of SiC Schottky diodes - zero reverse recovery losses, temperature-independent switching losses, higher frequency operation - all with a lower EMI signature," said John Palmour, Cree co-founder and chief technology officer, Power and RF. "This new family of diodes allows a higher current density and increased avalanche capability over previous generation SiC Schottky diodes with no penalty in performance. Cree's recent innovations in device design and commitment to continuous process improvement are allowing us to offer significantly higher amperage ratings at lower cost per amp."Cree Z-Rec diodes feature zero reverse recovery, resulting in up to a 50% reduction in switching losses versus comparable silicon diodes. They also exhibit consistent switching performance across their entire temperature range, which simplifies circuit design and reduces the need for complex thermal management. When used in conjunction with Cree's recently-introduced 1200V SiC power MOSFETs, these SiC Schottky diodes enable the implementation of all-SiC power electronic circuits with the capability to operate at up to four times higher switching frequencies when compared to conventional silicon diodes and IGBTs. This enables a reduction in the size, complexity and cost of inverter circuitry, while achieving high system efficiency. Finally, this new family has the additional characteristics of higher surge ratings and avalanche capabilities than the previous generation of SiC Schottky diodes, helping to increase overall system reliability.These devices are ideal as boost diodes and anti-parallel diodes in solar inverters and 3-phase motor drive circuits, as well as in power factor correction (PFC) boost circuits in power supplies and UPS equipment. They can also be used in applications where engineers typically parallel many devices to address higher power requirements.

MediaTek has announced that its EDGE mobile phone MT6236 IC chip solution which supports big HVGA capacitive full touch screen, high camera and video specification and various multimedia formats, has been recognized by Latin American operators and brand name mobile phone providers alike.Many of "Powered by MediaTek" touch screen mobile phones with internet enabled were rolled out and have all been hot selling items in these markets, which include several EDGE phones launched by Latin Americas' largest operators, América Móvil and Telefonica, as well as the large screen mobile phone with dual-mode TV support produced by the Brazilian brand NavCity, said MediaTek.With the consumer in mind, MediaTek's MT6236 solution features integrated and highly optimized CPU functions, as well as powerful support for the experience of a smooth and precise touch-screen performance. In addition, with easy to set up internet and Wi-Fi access for EDGE mobile phones, as well as human machine interface, mobile phone manufactures—thanks to the software design offered by the MT6236 platform solution—now have the power to offer more customization in products, thus better fulfilling operators' needs.Along with operators in Latin America, Brazil's local mobile phone brands and channels, in response to the government's promotion of the digital TV standard ISDB-T, have launched mobile phones now offering support for dual-mode television (ATV and ISDBT). MediaTek's MT6236 solution is perfectly poised to meet this trend. ISDB-T digital TV standards use H.264 decoding technology and since the MT6236 solution supports H.264 decoding, the use of an additional H.264 decoder chip is not necessary. This high level of integration allows mobile phone manufacturers to design thinner and lighter mobile phone and, more importantly, power consumption issues can be significantly improved, MediaTek said.

NTI Corporation, a worldwide software pioneer in digital media and storage management, announced that Plextor LLC, a leading developer and manufacturer of digital media equipment, has selected NTI SSD Utility Suite as their software solutions. Consisting of feature-rich, and easy-to-use system cloning, data protection and storage performance analyzing tools for their high performance SSD products, this new NTI SSD Utility Suite will allow the users of Plextor SSDs to perform the most demanding daily tasks with the highest levels of confidence in Read/Write performances while maintaining full protection and integrity of their data."We are excited to debut NTI Echo with Plextor, which is a market leader renowned for its high-quality and state-of-the-art products," said Bill Yao, President and CEO, NTI. "While SSD storage technology is rising in popularity, NTI SSD Utility Suite makes adoption of the technology easier by providing a smart cloning tool, an award-winning Backup software, and a coherent set of utilities."NTI SSD utility suite will be included with the next generation Plextor SSD which provides a significant upgrade package for customers, available from Q3 2011. NTI SSD Utility Suite and all the software are available for OEMs and resellers to bundle independently with all popular SSD, HDD, or USB storage devices.For additional product information, please visit: www.nticorp.com

With the global economy recovering, advances in telecommunication technologies and rising demand for smart devices are boosting the development of industries related to memory products. In addition, with improvement to 3D image display technologies, users' demand for storage capacity is also growing significantly, which is in turn prompting entertainment-related industries, such as the gaming and multimedia businesses, to change their content. Memory players are also launching related products to meet demand.World-leading DRAM with nanometer heat dissipation technologyCEO of KINGMAX Digital Joe Liu pointed out that KINGMAX's focus at Computex 2010 was DRAM featuring its nanometer heat dissipation technology, a technology invented by KINGMAX to adopt nanometer heat dissipation into overclocked DRAM modules. In 2011 the company has launched its high-performance dual-channel overclocked Hercules DDR3 2,400MHz 8GB DRAM module with the heat dissipation technology to completely replace the traditional heatsink. The technology uses nanometer-level silicon coating to better heat dissipation, while the removal of the traditional heatsink lessens the weight of the module.Since heat dissipation is a major factor determining whether a DRAM module will have high efficiency, data processing speed and stability during high-speed calculation. Heat dissipation is usually the most valued criteria for enthusiast players and is also a technological challenge for DRAM makers to continue pushing their innovations. Currently, most DRAM module makers are using thicker and heavier heatsinks to further boost their DRAM products' heat dissipation, increasing both the size and cost of the modules. But KINGMAX's nanometer heat dissipation DRAM module has advantage not only in terms of size, its heat dissipation is also quicker than DRAM modules that use heatsinks, allowing it to operate at lower temperatures (about two degrees Celsius lower) and raise its heat dissipation by 10%.In addition to the gaming enthusiast-level DRAM modules, the nanometer heat dissipation technology can also be applied to USB 3.0 or other high-speed transmission applications, particularly those military- or industrial-standard transmission applications, which require a high degree of stability. KINGMAX has a presence in all these market segments.Speed, stability and compatibility are all in one solutionAfter KINGMAX released its nanometer heat dissipation technology in 2010, the company has been receiving good reviews from the international media as well as DIY players. The technology has also received awards for its performance, technology innovation, overclocking performance and transmission efficiency from Taiwan, Russia, Malaysia, Vietnam, Thailand and China. After a year of wide acclaim, KINGMAX has launched its high-capacity dual-channel overclocked Nano Gaming RAM DDR3 2400 8GB DRAM module in 2011.Gaming and overclocking players want more than just speed. For them, system stability and compatibility are also important factors. KINGMAX's Nano Gaming Ram adopts only high-quality IC chip to ensure excellent overclocking capability. The DRAM module is produced through dual-side assembling technology, implanting eight 256MB IC chips on both the front and back sides of the print circuit board (PCB). The DRAM module supports Intel's P55 chipset and after the chipset reads the module's built-in serial presence detect (SPD), it will automatically execute overclocking. Paired with KINGMAX's in-house designed PCB board, it minimizes interference between electric circuits and enables maximum performance. It allows the DRAM module to perform in extreme speeds during high-frequency use, preventing the gamer from seeing the Blue Screen of Death (BSoD) or having to reboot during play.The world's first 64GB microSDXC memory cardWith demand for smart devices with higher resolution rising, needs for memory cards with higher capacity have been growing stronger and stronger. KINGMAX at Computex 2011 announced an eye-catching breakthrough for memory cards in terms of both technology and capacity. It launched the 64GB microSDXC memory card for smartphone, the first microSD in the world with such mega capacity.The memory card supports handheld devices such as cell phones, smartphones, tablet PCs and multimedia players that support the exFAT format, and with an adapter it can be used as an SD card or USB drive for different applications. The memory card also supports Class 6 high speed transmission to satisfy consumers' extreme demand for high storage in an era that sees an explosion of multimedia content.

LSI Corporation recently announced a new multiservice processor that enables OEMs to reduce the physical footprint and cost of wireless backhaul, wireless controllers and media gateways. The LCP5400, which is software compatible with the existing link communication processor from LSI, allows networking OEMs to consolidate multiple line cards, reducing inventory and development costs and speeding equipment time to market.The LCP5400 enables the migration of time-division multiplex (TDM) equipment to more cost-effective Internet protocol (IP) solutions. The increased density of the LCP5400 reduces the number of legacy TDM slots required in the chassis and allows more room for IP-based cards. As networks continue to transition to IP, this gives OEMs and service providers the opportunity to increase the number of SONET/SDH connections without increasing the numbers of boards per system. The LCP5400 allows customers to take full advantage of the least-expensive IP or TDM leased lines available.The LCP5400 simultaneously supports multiple protocols including ATM, PWE3, HDLC and ML/MC-PPP as well as proprietary protocols. A high degree of programmability allows connections to legacy, non-standard equipment for backwards compatibility. The LCP5400 also offers the flexibility to upgrade products already deployed through non-intrusive software updates, dramatically increasing the serviceable life of boards in the field.With the LCP5400, a single protocol path can take full advantage of the device's bi-directional data bandwidth, or as many as three protocols can share it simultaneously. The LCP5400 includes multiple programmable engines, integrated Ethernet ports and multiple ARM11 processors.To learn more about LSI and the LCP5400 device, visit www.lsi.com.

VIVOTEK is proud to be the world's first and foremost in IP surveillance industry to unveil Scalable Video Coding (SVC), the next-generation video codec.Scalable Video Coding (SVC) is a video standard based on H.264 that allows video data to be divided into multiple layers with different resolutions, picture sizes, and frame rates. Such feature turns a single video stream into multiple layers by selectively discarding some data to create independent layers. Users with limited resources, such as reduced display resolution, lower processing power or insufficient battery, can still use the layer that best suits their capabilities.In the near future, all VIVOTEK products will support SVC."The resolution of network cameras is only going to get higher. The demand for better video processing and displaying will increase, too, which makes handling multiple channels of video streaming more challenging than ever," said Owen Chen, Chairman of VIVOTEK. "At VIVOTEK, we've overcome that challenge and become the first to bring to the world products with SVC incorporated. Currently, VIVOTEK supports SVC-T for layers with variable frame rates. This flexible allocation of video data can reduce bandwidth usage and storage capacity needs by up to 70%, and also reduce loads on CMS servers and CPUs." added Owen.VIVOTEK has showcased SVC at industry exhibitions such as ISC West, SecuTech Taipei and ISC Brazil, receiving excellent feedback and responses from the industry. "Our partners are very excited about our SVC technology as they can apply it to many of their surveillance applications," said Owen. "It saves a lot of network bandwidth, requires lower CPU loading, provides instantly adjustable frame rate to match device capabilities, and most importantly, it can seamlessly integrate with other available network devices."Just like William Ku, Director of Brand Business Division at VIVOTEK said, "VIVOTEK will continue to innovate as it pursues development of advanced technology with a primary focus on creating high-quality products," our SVC, as always, will once again amaze the industry.The Next Generation Video Codec - Scalable Video Coding (SVC)Photo: Company

Hsinchu, Taiwan, June 09, 2011 – Lextar Electronics Corporation (Lextar) is launching the world's brightest* 6 watt LED candle lamp and ultra bright 1500 lm LED bulb, along with 25, 40, and 60 watt replacement ultra light bulbs bulbs. Among them are the wide-angle-technology based surrounding bulbs with a view angle up to 270 degrees. These products demonstrate Lextar's technical capabilities in LED lighting applications. This whole new series of LED light bulbs will debut in the LED Lighting Taiwan 2011 Taipei International Optoelectronics Week from 14th to 16th this month.World Brightest* 6 Watt LED Candle Lamp:The newly launched, world's-brightest* 6 watt LED candle lamp features a luminous flux up to 335 lumens, 100% more than others available in the market. In addition to the uniform and bright light stream distribution for enhanced crystal light effects, its high CRI (CRI >95) and high efficiency attributes can reduce heat radiation and present the best skin color.Ultra Bright 1500 lm Bulb:The newly launched ultra bright and light 1500 lm bulb is a new record to Lextar after the debut of 1000 lm bulb in 2010 end. This new enhanced model has high efficiency of 95 lm/W. In addition, the new insulting and heat conducting material can reduce the weight to only 75g. This technology establishes a new generation of specifications for 100W replacement LED bulbs in the industry.Ultra Light LED Bulb Series:Take the new light LED bulb products: The alternative and light weight LED A-Lamp series, from 25 to 40 to 60 watts replacement are introduced in one shot. With the lightest bulb weighing a mere 53 grams, this series of products are 50% lighter than a conventional LED bulb with heavy and thick heat sink. Not only are they more cost effective but they are easier to install. The whole series A-Lamp bulbs are international A55 dimension compliant and suitable for any light fixture device. Light weight material plus a new mechanical design catches the international trend of green products with significant carbon footprint reduction. Regarding light pattern improvements, Lextar breaks through the lighting angle limitations of conventional LED light bulbs for surrounding type. Lighting quality is substantially enhanced when the view angle is expanded from the current 120 degrees to 270. This A-Lamp series fits the Japanese markets that require light quality and minutia and environment protection. With its whole series CE and PSE international safety standards compliance, Lextar's international market competitiveness has continued to advance in giant steps.*Based on available market research information as of June 09, 2011.

On June 10, 2011, Samsung LED Co., Ltd. ("Samsung LED") filed a patent infringement lawsuit against Osram Korea Co., Ltd. ("Osram Korea") and two other defendants at the Seoul Central District Court requesting an injunction from unauthorized use of Samsung LED's valuable intellectual property and money damages. The defendants include Osram Korea and two companies that sell Osram's products in Korea, Barun Electronics and Dabo Industrial System.The 8 patents-in-suit relate to LED chip and package technology used in LED light lenses and high power applications. For example, this technology has found wide use in LED headlights and LED lightings.The Korean suit is Samsung LED's first response to Osram's initiation of lawsuits against Samsung LED in the US (District Court of Delaware and the U.S. International Trade Commission) and Germany. Samsung LED is developing a measured response.Samsung LED has made considerable investments to develop LED technology, resulting in a considerable number of core LED patents and patent applications. Samsung LED currently has about 700 US patents and patent applications and about 2000 Korean patents and patent applications."We are developing evidence to show that Samsung LED is not infringing any valid claim of Osram's patents, as well as evidence of Osram's unauthorized use of our patents, we are evaluating every contingency and will vigorously defend our technology," said Jun Sung Park, Vice President and the head of the IP and Legal Affairs Team at Samsung LED.

Aavara announces three uncompressed HDMI 3DTV Extenders, flexible and high-performance HD AV extension solutions for integrating residential HD AV entertainment system over ultra-long distance, as well as for digital signage applications.Aavara PE3D4K100A HDMI v1.4a Cat5e/6/7 Single-Cable Extender features the latest HDBase-T technology, which can support uncompressed 4Kx2K (4096x2160p, 4 times Full HD 1080p), 48bits Deep Colour, 7.1 channels audio, Ethernet Network Link, Power Over Cable transmission up to 100M (330ft) over ultra long distance by using SINGLE Cat5e/6/7 cable. It also fully supports HDMI v1.4, allowing smooth 3D video transmission from 3D Blu-ray players to 3DTVs, with CEC, 36 bit Deep Colour & fully HDCP compliance. Built-in 3 x 100Mbps Fast Ethernet RJ-45 ports at both sender and receiver allow Internet connected TV, Video device and PC keep link with Internet.Power Over Cat5 Cable design made PE3D4K100A receiver don't need power adapter. Convenient IR Pass-Thru function allows video sources to be controlled via IR remote control from TV/Display which may be located some distance away.Aavara PE4K3D100 HDMI v1.4a Cat5e/6/7 Single-Cable Extender, a little brother of PE3D4K100A, features same HDBase-T technology with same 100M uncompressed 1080p 3D video transmission power with Convenient IR and RS-232 Pass-Thru function. Tiny 9.8 x 8.3 x2.7cm form factor and single-cable transmission make it an ideal fit for interior designs without compromising on style.PE3D4K100A is available to ship now, while PE3D4K100 will be available to ship in July 2011.

ChipSiP Technology, the leading company in turnkey SiP solutions, features "Smart, Share, Smile" at Computex Taipei 2011. SiP technology has been merging into daily life by seamlessly concealing miniature design in electronics after its groundbreaking in slimness and light-weighted for multimedia devices. The convergence of life and SiP is bringing people at the core of smart life that keeps them sharing and connecting anytime and anywhere.Sam Wang, President of ChipSiP, said, "ChipSiP announced a concept of smart life in 2010, and delivering a view of fun, smart lifestyle for this year. We hope to drive the core engine of SiP technology to meet portability for mobile applications by miniaturization solutions, and to combine wireless technologies, everyone can enjoy a smarter, easier and even more fun life with ubiquitous connectivity. Such a brand-new networking life has been ignited by SiP."Accumulated hundreds of multi-chip package solutions for digital still camera in volume, ChipSiP introduced DDR3 Memory SiP of Logic SiP product line at Computex 2011 to show our advanced SiP capabilities, as well as meet current trends for multimedia devices toward high-performance and high-efficiency. Otherwise, in order to share in wireless connectivity, GPS, WiFi+BT and such as highly integrated RF SiP are designed for life on the go. Moreover, by leveraging core miniature-value of SiP and multi-chip integrated design, ChipSiP launched WiDi, mini AP/router, Pad(MID) SiP turnkey solutions, which can address system manufacturers' needs: slimmest, smallest and most power-efficient, to satisfy the desire into a smart life."ChipSiP's WiDi Box was awarded the Best Choice in Computex 2011. The product was praised for its smallest size (86x55x17mm) in the world, which was designed by SiP technology. By combining with WiFi MIMO technology, the WiDi Box enables videos, photos and web pages to display on televisions from PCs, Sam Wang, President of ChipSiP, pointed out. In addition, having an insight into booming mobile multimedia entertainment on iPad-like devices, ChipSiP takes advantage of SiP technology in slimness and power-efficiency to unveil a Pad(MID) turnkey solution with mere 9.86mm height. The easy-to-implement solution is optimized for personal digital entertainment, and it is powered by the composition of stacked memory, RF SiP and Android operating system.