With patented heart spectrum blood pressure monitoring technologies as its core, OSTAR Meditech Corp. has successfully developed a "Smart Cloud Vital Sign Monitoring System", which is adopted by local hospitals and shows significant nursing efficiency improvement...
As the telecom market moves from 3G to 4G, smartphones require more miniature inductors. A 3G smartphone may only need 15-20 miniature high-frequency chip inductors but a 4G one may require 60-90 pcs. It is therefore imperative to find ways to fit more components in the limited space of a phone or provide more space for batteries by down sizing the component size.
After many years of construction, most developed nations now have fiber-to-the-building (FTTB). However, FTTB alone will not be enough to satisfy the bandwidth demands of the various types of cloud applications in the near future. Therefore, fiber-to-the-home (FTTH) is a must-have...
Yes we can! For the past 19 years, EverFocus has been supporting and working with our partners down the river of success. "Partner for growth" is what EverFocus has been doing and we believed that to provide something that can efficiently solve the problems is what we can do with our partners to grow together...
DIY security systems became instant hits when they were introduced to the industry due to their practicality and convenience. With the increasing need of smart home systems, the global alarm systems supplier LuxHome is thrilled to announce its highly anticipated online shopping site www.myluxhome.com is now live to customers in the United Kingdom...
Indium Corporation was presented with the Global Technology Award for its BiAgX solder paste at SMTA International in Rosemont, Ill. on Tuesday, September 30. Sponsored by Global SMT & Packaging, the Global Technology Awards have acknowledged outstanding innovations in the printed circuit board assembly and packaging industry for the past 10 years.
Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857, NYSE: ATE) announced that a new mold thickness metrology system, the TS9000, for measuring the thickness of semiconductor packaging, is available for purchase. The system is based on advances in Terahertz (THz) technology pioneered by Advantest.
The race to thinner devices with high performance pushes the advanced packaging industry toward smaller form factor and thinner packages, some as small as a just a few hundred microns (less than 0.3 mm) in height. To accommodate this rapid miniaturization, we are seeing a growing number of trends to improve existing processing techniques.
Imagination Technologies, a global leader in silicon intellectual property (SIP), held its annual summit recently in Taiwan, with separate sessions in Hsinchu and Taipei. Company CEO Hossein Yassaie and key partners attended the event and introduced the latest trends in the market and technology development.
The smart home security solutions provider - LuxHome has always been committed to the design and innovation of products to help people create a more comfortable smart home environment...
