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Wednesday 6 August 2014
Indium Corporation technology expert to lead professional development course at SMTAi 2014
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will teach a professional development course at the Surface Mount Technology Association's International Conference and Exhibition (SMTAi) on Monday, September 29 in Rosemont, Ill.Dr. Lee's course, Properties and Applications of Low Temperature Solders, discusses the physical, mechanical, and soldering properties and applications of a variety of low temperature solders, with emphasis on lead-free alloys. Low temperature soldering is preferred for a number of special applications, such as heat-sensitive devices, systems that require step-soldering, parts with significant differences in their coefficients of thermal expansion, components exhibiting severe thermal warpage, or products with highly miniaturized design.SMTA International is an annual technical conference and exhibition on electronics assembly and advanced packaging that draws industry professionals from around the world. For the full SMTAi 2014 schedule, visit http://www.smta.org/smtai.Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.For more information about Indium Corporation, visit http://www.indium.com/ or email abrown@indium.com.
Tuesday 5 August 2014
German MSO Tele Columbus chooses Compal Broadband Networks advanced cable gateway to support its growth strategy
Compal Broadband Networks (CBN) has signed an agreement with Tele Columbus, one of the leading German cable network operators, under which it will supply its CBN CH7485E advanced DOCSIS cable gateway to support Tele Columbus' successful rollout of high speed broadband and telephony services.The CBN CH7485E advanced DOCSIS cable gateway is a state of the art 16x4 gateway combining DOCSIS 3.0 network speeds of up to 800 Mbps with ultra high wireless speeds up to 1.6 Gbps and an extended coverage area based on its embedded 3x3 11ac Wi-Fi technology with advanced antenna design. Tele Columbus is the first MSO introducing such a powerful cable gateway into the German market.Besides its tremendous speed capabilities and stylish enclosure design, the CBN CH7485E provides a whole range of advanced feature sets like Community Wi-Fi, full IPv6 support, media server, NAS, full band capture tuner with remote diagnostics, as well as full IMS compatibility. This combination of raw speed power with an advanced feature set makes it the ideal product for the challenges that MSOs face today and their needs for support of a wide range of sophisticated applications at very high speed."With Compal Broadband Networks we have found an excellent partner for developing a new future-oriented cable gateway that meets the growing demands of our customers in terms of speed, Wi-Fi connectivity as well as multimedia functionality", says Ronny Verhelst, CEO of the Tele Columbus Group. "The new device will help us to continue our successful growth in internet connections and open new opportunities for additional multimedia services merging the worlds of internet, voice, video and mobile applications."Alex Wang, CEO of Compal Broadband Networks (CBN): "We are very happy and extremely proud to welcome Tele Columbus, one of the leading MSOs in Germany and pioneer in very high speed services, into the growing family of CBN 16x4 and 24x8 advanced cable gateway customers. We are delighted to be able to support Tele Columbus with the roll-out of their successful high-speed broadband service. Compal Broadband Networks will continue to lead the cable gateway business with a strong and innovative product portfolio well adapted to the needs of our customers."About Tele ColumbusThe Tele Columbus Group numbers among Germany's leading cable network operators and has been successful as a multimedia and telecommunications provider since 1985. Tele Columbus provides some 1.7 million connected households with a TV signal and increasingly more customers with digital program packages, Internet access and telephone connections via powerful broadband cable. As a national provider with regional focus and as a partner of the housing industry, the group is present in its entire core area of Berlin, Brandenburg, Saxony, Saxony-Anhalt, Thuringia and Mecklenburg Western Pomerania as well as in numerous core regions in Western Germany. For more information, visit http://www.telecolumbus.de/About Compal Broadband NetworksCompal Broadband Networks, Inc. (CBN) is part of the global Compal group. Combining its extensive experience in Cable Voice and Broadband products with its innovative Wireless and in-home Gateway technologies, CBN offers a full line of cable modems, gateways, media gateways, set top boxes and digital connected consumer appliances, such as TV's, Wi-Fi Repeater's, Android based tablets and Smart TV Dongles. As a result of its extensive connected home integration approach, all of CBN products interface with each other seamlessly, allowing people to live a convenient and better life while using CBN products. For more information, visit http://www.icbn.com.tw/The CBN CH7485E advanced DOCSIS Cable Gateway
Friday 1 August 2014
Indium Corporation announces new Vice President of Operations
Indium Corporation announces that Brian Reid has joined the company as vice president of operations. Reid is responsible for managing operations to achieve superior productivity, efficiency, quality, capability, and delivery."The vice president of operations plays a critical role in advancing our production practices," Greg Evans, president of Indium Corporation said. "Brian has extensive experience in developing, refining, and enhancing operations at world-class manufacturing facilities. His unique perspective and experience will help us to continue to bring our practices to new levels of efficiency and productivity."Reid has more than 14 years of international manufacturing experience, including the creation and implementation of strategic plans, facility and capital management, and site master planning. Most recently, he served as vice president of operations for Norwich Pharmaceuticals in Norwich, N.Y., USA. Prior to that, he was director of operations, operational excellence, and strategy for Wyeth Pharmaceuticals/Pfizer in Rouses Point, N.Y. Reid has participated in Lean Six Sigma deployment in the United States, Asia-Pacific, and South America, and holds a Lean Master certification.Reid earned his bachelor's degree in interdisciplinary engineering and management and his master's degree in engineering and global operations management from Clarkson University.Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.For more information about Indium Corporation, visit http://www.indium.com/ or email abrown@indium.com.
Friday 25 July 2014
ABB and Volvo form global partnership for electric and hybrid bus fast-charging
ABB, the leading power and automation group, recently announced a partnership with Volvo Buses, one of the world's leading bus manufacturers, to co-develop and commercialize electric and hybrid buses with open standards-based direct current (DC) fast charging systems.The cooperation creates a city-wide standardized charging system for electric and electric hybrid buses that can charge buses quickly through an automatic roof-top connection system at bus stops or through cabled charging systems overnight.This approach, based on internationally accepted standards, enables maximum re-use of existing e-mobility technologies, thereby ensuring a rapid deployment of urban e-mobility. The first joint project for Luxembourg's public transportation system is planned for 2015.Volvo's new Electric Hybrid bus, which reduces fuel consumption by 75 percent compared to conventional diesel buses, will debut at the IAA exhibition in Hannover, Germany, in September. ABB and Volvo will contribute with their respective expertise in power grids and e-buses to further develop e-bus fast-charging standards, such as communications protocols for infrastructure, electrical grids and e-buses.An electric-bus charging standard will be largely based on the recently adopted global DC fast charging standards for passenger cars, guaranteeing safety and helping stimulate investment, long-term commitment and increased adoption of clean mobility."We are very pleased to partner with a global transportation industry leader that shares our vision of e-mobility in line with ABB's commitment of power and productivity for a better world," said Pekka Tiitinen, head of ABB's Discrete Automation and Motion division. "Urbanization is at a historic high and is stretching transport infrastructure of cities around the world. Our collaboration will help support sustainable and cost-efficient transportation solutions to meet rising commuter demand."The partnership is focused squarely on standardization of automatic e-bus fast charging, including the communications protocol between the infrastructure charging solution and e-bus, the electrical interface and specifications for the rooftop automatic connection system (ACS)."We are delighted to enter into partnership with ABB. Together, we have a complete and competitive offer to cities around the world that want to switch to a sustainable public transport system," said Hakan Agnevall, President Volvo Buses. "Electric hybrid buses and full-electric buses are tomorrow's solution for urban public transport."Volvo Buses launched its first hybrid bus in 2009 and has delivered nearly 1,600 hybrids to 21 countries. Its first fully electric bus will be launched in June 2015 as part of the ElectriCity project in Gothenburg, Sweden.ABB has delivered over 1,500 DC fast charging systems for passenger vehicles worldwide since 2010, rolling out charging networks for automotive, utility, government and retail customers including nationwide networks in the Netherlands, Estonia and Denmark.The first joint project will be the implementation of Volvo Electric Hybrids and ABB's automatic e-bus chargers in the Luxembourg public transport system, where as many as 12 Volvo Electric Hybrid buses operated by Sales-Lentz will be running on existing lines by 2015.The project is integrated into Luxembourg's Mobility Network linking different mobility projects in the western European country to exploit synergies and develop common visions for the mobility of the future.ABB (http://www.abb.com/) is a leader in power and automation technologies that enable utility and industry customers to improve their performance while lowering environmental impact. The ABB Group of companies operates in around 100 countries and employs about 150,000 people.Volvo Buses (http://www.volvobuses.com/) is one of the world's leading bus manufacturers, with a strong focus on vehicles and systems for long-term sustainable public transport. Volvo Buses is part of Volvo Group, one of the world's leading manufacturers of trucks, buses and construction machines as well as drive systems for marine and industrial applications.
Friday 18 July 2014
GIGABYTE's EasyTune App makes overclocking a breeze on new Intel Pentium Anniversary Edition CPUs
GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of motherboards and graphics cards announced a new version of its overclocking assistant EasyTune has been released just in time for the new Intel Pentium Anniversary Edition CPU, an unlocked CPU designed to bring overclocking to the mainstream. The new EasyTune application allows users to get the highest level of overclocked performance from their CPU and GIGABYTE Z87 / Z97 series motherboard, and with one click automatic overclocking, even novice users can experience enhanced computing performance right from the start.With a stock frequency of 3.2 GHz, the Intel Pentium AE can be easily overclocked using the revamped EasyTune application so that users can experience faster system performance without having to buy a more expensive CPU. The Smart Quick Boost function within EasyTune comes pre-configured with set overclocked profiles which have been tested by GIGABYTE's experienced engineers, to ensure no matter what the hardware configuration, users can enjoy 24/7 stable system performance. To enable different levels overclock, users just need to click "Light", "Medium" or "Extreme", with the expected CPU frequency being highlighted in the upper right corner of the settings tab.For more experienced users, EasyTune also offers advanced overclocking options for both the CPU and memory so that users can tweak their system performance to even higher levels in a Windows environment, without having to enter the BIOS.To see just how easy it is to use the EasyTune application, please check out the video featuring a GIGABYTE Z97-HD3 motherboard with the new Intel Pentium Anniversary edition processor: https://www.youtube.com/watch?v=Dacnua5xxDkA Processor with Great PotentialThe Intel Pentium G3258 is truly a great investment for the users looking to build a system under a low budget but wanting great performance. Once overclocked, frequencies equal or even higher than the latest Intel Core i7-4790K or i5-4690K CPUs can be achieved. As show in the tables below (see Figure 2 and 3), the Pentium G3258 can clock at very high frequencies under different cooling methods. By water cooling, the G3258 is already able to match the performances of the i5-4690K and i7-4790K skus under the same conditions. When cooled using LN2, the Anniversary Edition CPU overclocks even better than the i5-4690K, and priced at $72 USD, the overclockable Pentium G3258 is close to 5 times cheaper than the i7-4790K, most undoubtedly the best price/performance deal on the market.To update your EasyTune application to the latest version, please use the "Live Update" option in the App Center. You can also download the latest version of EasyTune for the GIGABYTE 8 and 9 Series motherboards under the GIGABYTE Utility download website, here: http://www.gigabyte.com/support-downloads/Utility.aspx?cg=2For more details regarding GIGABYTE 9 series Ultra Durable motherboards, visit the following link: http://www.gigabyte.com/microsite/364/9series-ud.htmlFigure 1: GIGABYTE's EasyTune AppFigure 2: Results may varyFigure 3: Prices are based on Intel's June 2, 2014 recommended Processor price list
Wednesday 16 July 2014
OAXIS adds a second E Ink screen to your smartphone with launch of InkCase+ on Kickstarter
Today OAXIS launches its campaign on crowd funding site Kickstarter to bring the InkCase+ to life. Starting from $79 for the very early bird special, InkCase+ is a removable 3.5-inch E Ink display module. InkCase+ can be inserted into a dedicated smartphone case and used as an auxiliary screen, bringing all the benefits of E Ink to Android smartphones.An early prototype was showcased to the public at both Mobile World Congress and Computex Taipei trade shows earlier this year. The prototype saw such a large amount of interest that OAXIS will work alongside Kickstarter backers to get through the difficult process of bringing a product to market.https://www.kickstarter.com/projects/378232716/inkcase-plus-e-ink-screen-for-android-phone?ref=nav_searchInkCase+ will let consumers personalise their phone case and allow alerts to be pushed to the low power E Ink screen. This means that when users want to check their notifications or even read a book there's no need to power on the main screen, what's more the low power E Ink screen also means notifications are always visible.As well as notifications the InkCase+ can provide reference materials such as maps, tickets or shopping lists even when it is out of power. InkCase+ can also display your favourite pictures, customizing your phone case according to moods and trends. Why stick with the same phone case when it could be infinitely customizable."Kickstarter provides a unique opportunity to work closely with our customers and have them shape the product we're creating," said OAXIS CEO G-Jay Yong. "We're excited to be working alongside the Kickstarter community bringing a fantastic InkCase product to Android users for the first time. We regularly hear from our friends and family that their phone has died and we hope that InkCase+ can alleviate this problem by making checking your phone a less power hungry process. We also look forward to the millions of photos people will use to customize their phone making the blank black slate a thing of the past."The convergence of E Ink devices is already happening. In the same way smartphones have integrated Sat Nav, MP3 player, PDA, feature phone, game pad and more into one universal device, InkCase Plus will eventually be the "smart universal device" among E Ink devices. This is possible because of the ability of the InkCase Plus to install multiple apps.Following the success of the acclaimed InkCase, the second generation InkCase Plus now packs more power as a modular second screen for Android smartphones. With the new ability to install apps, InkCase Plus has become the converged multifunctional second screen for E Ink devices; just like the smartphone for communication and personal devices.InkCase+ provides a rich set of APIs to seamlessly integrate into the apps people use on their smartphones in their everyday lives. The available SDK and InkCase Companion Apps provide valuable resources to developers that will create a vibrant ecosystem of applications for InkCase+Specs:•3.5" (8.75cm) E Ink display in a compact 2.25" (5.7cm) x 4.25" (10.8cm) body.•InkCase+ uses industry standard BlueTooth technology to communicate with smartphones.•At just 45g and 5mm thick the InkCase+ is one of the smallest and lightest information displays on the market. •500mAh lithium polymer battery allowing 7 days of standby time, 3400 pages of reading or 19 hours of continuous operation.•InkCase+ supports all Android smartphones running Android 4.3 (Jelly Bean) and above.You can back the OAXIS on their Kickstarter page now: starting at $79 for the Very Early Bird adopters.
Tuesday 15 July 2014
Core technology of wearable devices
The wearable devices currently in the market seem to fall into two categories: they either come with long battery life but simple features, or short battery life with comprehensive features. Is there a solution to make wearable devices that have both long battery life and comprehensive features? Imagination has the answer.No compromise: Wearable devices are not mobile devicesIn his speech, "Get that smartphone chip out of my wearable! Designing SoCs optimized for wearable computing," Bryce Johnstone, Head of Ecosystems at Imagination Technologies, stated that currently, wearable devices such as smartwatches mostly adopt smartphone chips resulting in products that are high in power consumption with unnecessary features. To increase sales, chips for wearables should be redesigned. Johnstone first talked about power consumption and safety of wearable technology and then introduced new chip solutions designed by Imagination's partners specifically for wearable devices.Johnstone noted that wearable devices have been in the market for many years, such as the heart rate monitor introduced by Polar in the 1980's. With the coming together of a number of technology and social aspects, the time for wearables has now arrived. Advances such as configurable and flexible processing, low-cost silicon, low-power connectivity and others are combining to meet emerging requirements today's highly tech savvy consumers, who want instant social media interaction, personal and health monitoring, and always-on connectivity. The industry has begun focusing on wearables, and is providing low-cost and low-power consumption MEMS sensors, advanced power management technology, and chipsets designed specifically for this market.Mobile and wearable devices have very different hardware structuresAccording to Johnstone, the wearable devices currently in the market usually adopt compromised solutions.The main similarity between today's smartwatches is they tend to adopt high-end chips and hardware similar to those used in smartphones. This means the products consume power more rapidly and users have to recharge frequently. Also the user interface of these products is similar to that of smartphones, but varies among brands because there has not been a standard application programming interface (API).Wearable devices should not just be a smaller version of mobile devices, but should instead meet demand from different markets and provide specific and necessary, often complementary functions. In designing these products, companies must consider the many factors, including: low power consumption (power consumption should be calculated on a daily or weekly basis for exercise sensors, monthly for home care sensors, and yearly for vital sign sensors), low cost, small memory, method of use, data security, data accuracy, data collection efficiency, data management, and connectivity (low frequency bandwidth and high efficiency power use and data transfer, support low power-consumption mesh network, and wireless connection).Johnstone outlined some of the necessary hardware specifications for smart bracelets, smart watches and smartphones for comparison. In terms of the CPU speeds, an example smart bracelet runs on a sub-100MHz MCU, compared to an example smartwatch with a 0.3-1GHz multi-core power-saving application processor (AP), and a smartphone with a 2GHz quad-core CPU.As for other items in the comparison, display screens are unnecessary for smart bracelets. Smartwatches need only a small screen with a simple interface. Smartphones obviously feature larger displays that support a full range of functions. As for memory and battery capacity, it is low for smart bracelets, medium for smartwatches and high for smartphones. However, battery life for smart bracelets is long, medium for smartwatches and short for smartphones.Different wearable devices require different functionality. For example, smart bracelets need various types of sensors to accurately collect information; smart watches provide a more convenient way to read messages and should focus on simple interactions; and smart glasses provide high resolution images and camera functionality and focus on expanding the virtual reality experience.One potential wearable device architecture outlined by Johnstone features a 3-CPU core architecture: a wearable computing CPU, wearable control CPU, and sensor CPU (which connects various sensors).Johnstone also showed the difference in power consumption between wearable devices with smartphone components and wearable devices with wearable-optimized components. Smartwatches with wearable components can be 10 times more efficient in power consumption performing exercise monitoring functions (with only the sensor CPU on), 10-20 times more efficient in voice recognition and operating various apps (with the wearable control CPU on).They can three times more efficient in running an OS like Android Wear, which was introduced by Google to specifically accommodate wearable devices with an aim to provide the best user experience and a standard API (with the wearable computing CPU on). This means the multiple-CPU architecture meets the requirements of wearable devices.Power-saving and high efficiency is the best wearable device solutionImagination's partner Ingenic has introduced Newton, a MIPS-based wearable hardware development platform. The Newton platform is embedded with low-power consumption and high-performance JZ4775 1GHz MIPS CPU, and can process multimedia (enabling 2D graphic engines and various types hardware acceleration). It features multiple memory support (256KB L2 cache RAM + up to 3GB mobile DDR3/DDR2/LPDDR RAM + eMMC), contains a four-in-one connectivity component (Wi-Fi a/b/g/n, 2.4/5GHz, Bluetooth 4.0, EDR supporting Bluetooth, NFC, and FM), and supports various sensors (habitual, environmental, and biological). The device consumes power around four microwatts during standby, and 100 microwatts during operation. The PCB size is the size of two one-euro coins.Another Imagination partner, Ineda, has introduced the Dhanush WPU (wearable processing unit), which is the first processing unit designed specifically for the wearable device market. The system structure incorporates the three types of CPUs as described above: a low-power consumption sensor CPU, a low-power consumption sub CPU, and a main CPU for application processing. In particular, the sensor CPU only operates Tiny RTOS to collect data, hence only consumes one-third of the power compared to pure MCU solutions. The sensor CPU consumes 2-3 times less power during standby, supports 2-30 times more memory, and the embedded DSP/FPU runs 2-3 times faster than pure MCU solutions.Johnstone concluded that MIPS structure is the CPU with the most potential for expansion in the wearables market. It supports products ranging from low- to high-performance applications. It is an ideal choice for various sectors.Bryce Johnstone, Head of Ecosystems at Imagination Technologies
Monday 14 July 2014
Indium announces RMA-155 Pb-Free Solder Paste
Indium Corporation recently released RMA-155 Pb-Free Solder Paste. RMA-155 is the best solder paste for customers who are required to use RMA materials, but who need the performance benefits of modern Pb-free solder paste technology.RMA-155 was designed for balanced performance, making it ideal for high-complexity boards with a variety of component sizes, as well as simple assemblies. Compatible with both SnPb and SAC alloys, RMA-155 delivers consistent transfer efficiencies, excellent response-to-pause, and a strong oxidation barrier, even for long and hot profiles. It is halogen-free, resists graping on small components and tiny deposits, prevents head-in-pillow defects, and minimizes voiding for BGAs and large thermal planes (QFNs).RMA-155 conforms to the RMA classification for QQ-S-571F and offers proven performance similar to the well-received Indium8.9 Series solder pastes. Indium Corporation's full suite of compatible RMA materials includes TACFlux RMS-155, WF-2212 wave flux, FP-2212 flux pens, and CW807 series flux-cored wires in many alloys.RMA-155 is best suited for military and aerospace PCB assemblies, especially those still required to use RMA-classified fluxes. This solder paste also enables the transition to Pb-free because the flux is compatible with both Pb-containing and Pb-free alloys.For more information about RMA-155, visit http://www.indium.com/flux-and-epoxy.Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation, visit http://www.indium.com/ or email abrown@indium.com.
Thursday 10 July 2014
EverFocus' great leap forward: eZ Hopper
EverFocus recently introduces an innovative function, eZ Hopper, for our new series of DVRs/NVRs, allowing users to control up to 16 connected DVRs/NVRs in the same LAN network with just one single mouse.This breakthrough feature will bring great benefits to the traditional small and medium-sized surveillance system. For traditional DVR/NVR users who want to expand the surveillance system, a costly Central Monitoring Software (CMS) and the time-consuming training can be a great burden. However, adopting the CMS solution is no longer the only way to scale up, EverFocus' newly developed function, eZ Hopper, is now to help you to solve this problem.The eZ Hopper is designed and developed upon the current DVR/NVR codebase, so there is no need for users to learn any other complex configurations to manage the whole surveillance system or to spend the great setup cost and time. You just need to set up one DVR or NVR to be the Main Server, and the rest to be the Sub Servers. Then, simply connect a mouse to the Main Server, and you will be able to move its cursor across all the connected monitors of the Main and Sub Servers and to control their OSD menus respectively.If the customers are EverFocus current existing DVR/NVR users, they can simply upgrade to the new firmware to enjoy this powerful and flexible function. For the customers who would like to have a traditional small and medium-size surveillance system but withdraw from using the CMS because of the considerable expanse and complicated operations, EverFocus' DVR/NVR coupled with the eZ Hopper function will definitely be more applicable and much appealing.About EverFocus Electronics CorporationEverFocus Electronics Corporation (TWSE: 5484) is a leading integrated security solution manufacturer. Our lineup includes IP, HD-SDI, analog, mobile surveillance solutions, access control systems, as well as surveillance and access control peripherals. EverFocus has offices globally, located in Taiwan, the U.S.A, Germany, China, Japan, and India. For more information, please visit http://www.everfocus.com.tw/eZ Hopper allows one mouse to control 16 DVR/NVRs
Tuesday 8 July 2014
Heraeus Photovoltaics consolidates research and development in US
The Heraeus Photovoltaics Business Unit, a worldwide leading supplier of metallization pastes for solar cells, has decided to relocate their research and development scientists to their facility in West Conshohocken, PA to strengthen the activities of the group."The relocation of our worldwide research and development group to our West Conshohocken, Pennsylvania facility is a strategic move for our business", stated Dr. Weiming Zhang, Vice President of Technology for the Heraeus Photovoltaics Business Unit. "When Heraeus first began the development of metallization pastes for solar cells, we started with a few scientists in West Conshohocken. We successfully developed products with higher performance than what was commercially available at that time. To increase our competitive position, we recognized that we needed to attract additional talented scientists and engineers from around the world." Dr. Zhang continued to state, "With a core talent of employees at our corporate location in Hanau, Germany and our targeted market in Asia, we set up R&D centers in Hanau and Singapore. This has allowed us to obtain outstanding employees who have been instrumental in increasing our technology portfolio to develop advanced paste formulations. We have now decided to co-locate all our research and development staff in West Conshohocken. We believe this action will foster a faster pace of innovation, increasing our speed to market. We are excited about having this cross-cultural team, with their unique perspectives, come together for the benefit of the Heraeus PV business and our customers."Heraeus will be exhibiting at this year's Intersolar North America at the Moscone Center West Hall on level 1 in booth 7611. You can also go to http://www.pvsilverpaste.com for more information regarding Heraeus Photovoltaics products and services.About the Heraeus Photovoltaics Business UnitThe Heraeus Photovoltaics Business Unit is an industry leading developer and manufacturer of silver metallization pastes for the photovoltaic industry. For over 40 years, Heraeus has built a reputation of innovation, extensive research and new product development in thick film technologies for some of the most prominent companies within a variety of industries. In the field of photovoltaics, the Heraeus Photovoltaics Business Unit applies this history and its innovative technology to offer metallization pastes for solar cell applications. The Heraeus SOL Series of silver pastes is specially formulated to provide higher efficiencies and wider processing windows, resulting in better yields and higher output for cell manufacturers.