Getac rugged computers have been widely used by elite military, police and fire fighting teams to help them carry out frontline duties. With an established brand reputation and a good understanding of the user scenarios, Getac rugged computers have been enthusiastically embraced by customers...
Global server shipments will grow 8.5% to reach 13.73 million units, driven by the needs to store and process enormous amounts of data in the age of 5G, IoT and AI...
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that the company has filed a patent infringement lawsuit against Micron Semiconductor (Xi'an) Co., Ltd. and Micron Semiconductor (Shanghai) Co., Ltd. in the Fuzhou Intermediate People's Court of the People's Republic of China (PRC)...
Xcerra Corporation is pleased to announce the establishment of a direct presence in Taiwan with the opening of our Xcerra development center (XDC) in Zhubei City. The XDC will provide prompt, high level technical support for customers in the region and beyond...
As portable phones continue to evolve functionally, their physical appearance has changed commensurately, with plastic body shells giving way to slim and lightweight metal casings...
Macronix International Co., Ltd. (TSE: 2337), a leading integrated device manufacturer in the non-volatile memory (NVM) market, today announced the introduction of an ultra-low-voltage SPI NOR flash MX25S working at 1.2V, marking a new milestone in its process technology and low power consumption product offerings...
Aveni, a developer and manufacturer of wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, has announced it has obtained results that support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node.
Denso and BlackBerry have announced the companies have jointly developed what they call the world's first integrated HMI (human machine interface) platform. Intel also collaborated in the development of this product.
